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Photosensitive resin composition

A photosensitive resin composition of the present invention includes an acid group-containing vinyl ester resin and a photopolymerization initiator as essential components, wherein the acid group-containing vinyl ester resin is an acid group-containing vinyl ester resin having a multiple-branched molecular structure obtained by the following steps where a polybasic anhydride (a3) is reacted with an epoxy vinyl ester resin (v1) that is a reaction product of an aromatic epoxy resin (a1) and a radically-polymerizable unsaturated-double bond-containing monocarboxylic acid (a2); a radically-polymerizable unsaturated-double bond-containing monoepoxy compound (a4) is subsequently reacted with an acid group formed by the reaction; and a polybasic anhydride (a3) is subsequently reacted with a secondary hydroxyl group formed by the reaction of the compound (a4) with the acid group, thereby obtaining the acid group-containing vinyl ester resin having a multiple-branched molecular structure; and contains 1.75 to 3.5 radically-polymerizable unsaturated double bonds per aromatic ring in the acid group-containing vinyl ester resin, and the acid groups within a range where the acid value of the acid group-containing vinyl ester resin reaches 30 to 150 mg KOH/g. According to the present invention, a resin composition for a resist ink that simultaneously has ultrahigh sensitivity, excellent developability, and broad heat control range can be provided.
Owner:DAINIPPON INK & CHEM INC
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