The invention discloses a wafer processing method and a wafer processing device.According to the wafer processing method, cleaning and UV dispergation are carried out on a wafer after girdling, the influence of cutting chippings and a glue layer on the surface of a thin film on subsequent ring taking can be effectively avoided, ring taking can be guaranteed, and before each action of girdling, UV dispergation and ring taking, ring taking can be carried out in a one-to-one manner; according to the technical scheme, the wafer is positioned through a set of centering mechanism, the position precision and consistency of the wafer at the positions of ring cutting, UV dispergation and ring taking can be effectively ensured, the ring cutting precision and the stable implementation of ring taking can be ensured, and the whole process of feeding, ring cutting, cleaning, UV dispergation, ring taking and discharging can be automatically realized through a set of automatic equipment, so that the production efficiency is improved, and the production cost is reduced. The automation degree is high, manual intervention is not needed, and continuous and efficient machining can be achieved.