The application discloses a chuck
assembly and a
semiconductor device, relates to the technical field of
semiconductor devices, and comprises a chuck and one or more shaft cylinders, wherein the last shaft cylinder of the plurality of shaft cylinders or one shaft cylinder is connected with the chuck, the inside of each shaft cylinder is provided with a central hole, the central hole is provided with a balance
mass and an elastic damping piece, and the elastic damping piece is sleeved with the balance
mass to form a balance
mass-spring-damping
system. The chuck
assembly is sleeved with the balance mass through the elastic damping piece to form the balance mass-spring-damping
system, the balance mass-spring-damping
system generates reverse vibration matched with the vibration of the chuck, micro-vibration generated between the disc surface of the chuck and the contact surface of the substrate is inhibited, generation of friction particles is reduced, stability and cleanliness of a core area of a process environment are improved,
process quality of a deposited film is improved, and the needs of high-end processes for extremely low defect rate and ultra-high uniformity of the deposited film are met.