68results about How to "Temperature variation" patented technology

A disk array system includes a plurality of disk drives and at least one unit box including the plurality of disk drives aligned in the thickness direction of the disk drive, each disk drive including a thin case accommodating a recording disk, a read / write head, and a driving mechanism for driving the recording disk and the read / write head, and a control board for controlling the driving mechanism, the control board being mounted on the thin case. In the disk array system, the thin case and the unit box are composed of a thermally-conductive material, the unit box includes surfaces parallel to the thickness direction of the plurality of disk drives, and at least one of the surfaces has a cold plate filled with a refrigerant. Heat generated at the disk drives is transferred to the cold plate, thereby improving cooling performance.

An underwater cutting pelletizer is disclosed wherein a water chamber is circular in plan, an inlet portion is formed on one side in a diametrical direction of the water chamber to introduce cooling water into the water chamber, and an outlet portion is formed on the other side in the diametrical direction of the water chamber to discharge the cooling water from the interior of the water chamber to the exterior, the inlet portion being in a divergent shape in an inflow direction of cooling water. The retention time of pellets in the interior of the water chamber can be made as short as possible.

A surface acoustic wave device, includes: an interdigital transducer serving as an electrode pattern to excite a Rayleigh surface acoustic wave, the interdigital transducer including a comb-tooth-shaped electrode having a plurality of electrode fingers; a piezoelectric substrate on which the interdigital transducer is formed, the piezoelectric substrate being made of a quartz substrate that is cut out at a cut angle represented by an Euler angle representation (φ, θ, Ψ) of (0°, 95°≦θ≦155°, 33°≦|Ψ|≦46°); electrode finger grooves formed between the electrode fingers of the comb-tooth-shaped electrode; and electrode finger bases being quartz portions sandwiched between the electrode finger grooves and having upper surfaces on which the electrode fingers are positioned. The surface acoustic wave device provides an excitation in an upper limit mode of a stop band of the surface acoustic wave.

A fluid handling device includes a body portion defining a flow passage and an impulse chamber extending from the flow passage. The impulse chamber is fluidly coupled with the flow passage and has a pair of opposing ends defining a length dimension therebetween. The impulse chamber further presents a diameter dimension transverse to the length dimension, wherein the length dimension is at least 3 times and not greater than 10 times the diameter dimension. The device further includes at least one sensor operably coupled with the body portion. The sensor is disposed proximate the end of the impulse chamber opposite the flow passage and presents a sensing face facing into the impulse chamber.

In a constant temperature liquid circulating device that connects a piping of circulating liquid in an external device between a discharge port and a return port of a conduit for delivering the circulating liquid at a constant temperature by a pump, a flow amount sensor and temperature sensors for detecting discharge temperature (T1) of the circulating liquid from the conduit and the return temperature (T2) of the circulating liquid are provided in the conduit, so that the flow amount and the temperature of the circulating liquid is controlled by a controller according to the heat load of the external device obtained on the basis of the outputs from the temperature sensors.

By using a temperature monitor, a coil-dedicated chiller measures an amount of change in temperature of cooling water flowing out from a cooling pipe of a gradient magnetic field, determines an amount of change in temperature of cooling water to be flowed into the cooling pipe in accordance with the measured amount of change in temperature of the cooling water; and changes the temperature of cooling water to be flowed into the cooling pipe of the gradient magnetic field based on the determined amount of change in temperature.

Provided is a light-bulb type LED lamp 10 including a plurality of LEDs 67-78, a base 12, a lighting circuit unit that converts commercial power provided through the base 12 into power for lighting the LEDs 67-78, and a heat radiation member 16 that includes a bowl-shaped portion 42. Two stages 46 and 48, extending inwards from an inner circumferential surface 44 of the bowl-shaped portion 42, are provided in a direction of a central axis X of the bowl-shaped portion 42. The LEDs 67-78 are mounted on the stages 46 and 48 in a circumferential direction around the central axis X.

To prevent, in a multilayer wiring board to which a semiconductor chip is flip-chip bonded, occurrence of cracks in the board at portions adjacent to electrode pads due to a difference in thermal expansion coefficient between the semiconductor chip and the board. A multilayer wiring board (20) of the present invention has features that electrode pads (22) corresponding to electrodes of a semiconductor chip (25) located near an outer periphery (29) of the semiconductor chip each have an oblong shape, openings (35) of a solder resist (23) are each smaller than the oblong shape, and the center (B) of the opening is located to be offset from the center (A) of the oblong shape by a distance (L4) in a direction (30) toward the center of the semiconductor chip. Therefore, in the multilayer wiring board of the present invention, thermal stresses applied to portions (L3) of the electrode pads (22) on the board near the outer periphery of the semiconductor chip are relaxed. Consequently, the multilayer wiring board of the present invention can prevent occurrence of cracks in the board at portions adjacent to the electrode pads near the outer periphery of the semiconductor chip due to a difference in thermal expansion coefficient between the semiconductor chip and the board.

A movable platen support structure includes: a linear guide mechanism via which a movable platen is provided for horizontal movement; a plurality of movable-platen height adjustment mechanisms provided in corresponding relation to leg sections of the platen, each of the height adjustment mechanisms including a flat plate placed on a corresponding slider of the guide mechanism, and an adjusting bolt screwed into the corresponding leg section of the slider and abutting at its distal end against the flat plate; and a plurality of fastening mechanisms provided in corresponding relation to the leg sections, each of the fastening mechanisms including a fastening bolt for, following the height adjustment by the adjusting bolts, fastening the corresponding leg section to the corresponding slider by being passed through the leg section and the flat plate so as to be screwed into the slider.

A heating control apparatus and a control method thereof are provided. The heating control apparatus includes a heating module, a temperature sensing module, a pulse width modulation circuit, and a comparator. Input terminals of the comparator are respectively coupled to the temperature sensing module and the pulse width modulation circuit, and an output terminal of the comparator is coupled to the heating module. In the control method, a heating temperature of the heating module is sensed by the temperature sensing module, so as to provide a temperature sensing signal. The comparator receives the temperature sensing signal and a pulse width modulation signal generated by the pulse width modulation circuit and compares the temperature sensing signal and the pulse width modulation signal to generate a comparing pulse width modulation signal, so as to control the heating temperature of the heating module by using the comparing pulse width modulation signal.