21 results about "Photonic sensor" patented technology

An apparatus for photonic biosensors for multiplexed diagnostics and a method of use are disclosed. The apparatus includes a portable device configured for point-of-care diagnostics. The portable device includes a photonic sensor chip that includes one or more resonators that is substantially in contact with at least a fluid that includes one or more analytes and the reader device communicatively connected to the photonic sensor chip that includes at least a light source and the reader device is configured to provide an input optical signal using the at least a light source, receive the one or more sensor signals from the photonic sensor chip and determine one or more characteristics of the one or more analytes as a function of the one or more sensor signals and a connecting system, wherein the connecting system is configured to connect the photonic sensor chip and the reader device.

This invention discloses a three-dimensional waveguide glass chip based on CPO (Continuous Photonic Optical Array) with an integrated weak-reflection grating sensor array, relating to the field of integrated photonic sensors. The three-dimensional waveguide glass chip of this invention has a multi-core single-mode fiber array connection unit on the left end and a single-mode multi-core fiber optic connection unit on the right end, connected in the middle by a femtosecond laser direct-write multi-channel three-dimensional waveguide. The end directly connected to the optical chip also integrates a weak-reflection fiber grating for temperature measurement. Simultaneously, multiple three-dimensional waveguide glass chips connect to the optical chip, forming a grating temperature sensing array. The signal processing end uses host computer software to perform real-time online monitoring of optical loss and the periphery of the optoelectronic chip interface. This three-dimensional waveguide high-density optical connector with an integrated weak-reflection grating sensor array for CPO applications features low loss, low power consumption, high capacity, and multifunctionality, and can monitor chip temperature and interface quality using non-primary communication bands.

A method and system for detecting and measuring the braking force of a vehicle's brake system using photonic sensors integrated into brake pads is described. A method for detecting and measuring the clamping force (CF) and / or brake torque (BT) resulting from the operation of a vehicle's friction brake system by detection performed in the brake pads (10) of the brake system is described. The method includes encapsulating at least one optical fiber strain sensor (2) in a casing (9) and incorporating the casing (9) into a respective portion of a friction-sensitive friction material (M) attached to a base plate or platform (11) of the brake pad (10). The shear strain (St-eff) of the casing (9) acting in a tangential reference direction (x) represents the tangential force (Ft) acting on the brake pad (10), and the normal force (Fn-eff) of the casing (9) acting in a normal reference direction (y) represents the normal force (Fn) acting on the brake pad (10). The method includes detecting, by the optical fiber strain sensor 2, a first strain S1 (present at a first location on the casing along a first spatial direction w1) based on both a normal force Fn-eff and a tangential strain St-eff acting on the casing 9 at the first location, and detecting, by the optical fiber strain sensor 2, a second strain (present at a second location on the casing along a second spatial direction w2) based on both the normal force Fn-eff and the tangential strain St-eff acting on the casing 9 at the second location. The method includes generating, by the optical fiber strain sensor 2, a first photonic signal L1 representative of the first detected strain S1 and a second photonic signal L2 representative of the second detected strain S2, and receiving, by an optical reading / interrogation unit 4 optically connected to the optical fiber strain sensor 2, the first photonic signal L1 and the second photonic signal L2. The method ultimately involves determining, by the optical reading / interrogation unit 4, a value of the first strain S1 and a value of the second strain S2, respectively, based on the first received optical signal L1 and the second received optical signal L2, and determining a measurement value of the clamping force CF and / or the brake torque BT based on the determined values ​​of the first strain S1 and the second strain S2.

A method for detecting and measuring a braking force and / or a braking torque deriving from actuation of a vehicle braking system includes incorporating a fiber-optic strain sensor of fiber Bragg grating type in a respective position in a portion of material of the body of the brake caliper susceptible to deformation, detecting, by the fiber-optic strain sensor local deformation and / or strain acting in the respective position, generating a respective first photonic signal representative of the detected deformation and / or strain, receiving the first photonic signal, by an optical reading / interrogation unit optically connected to the fiber-optic strain sensor, generating, by the optical reading / interrogation unit, a first electrical signal representative of the local detected deformation and / or strain, based on the received first photonic signal, and processing the first electrical signal to obtain a measurement of the braking force and / or braking torque. A sensorized brake caliper and a corresponding system to detect and measure a braking force and / or braking torque are also described.

Provided is a two-photon spectroscopy including a light source configured to generate first laser light having a pulse, a pulse width correction device configured to receive the first laser light to output a second laser light, an optical system through which the second laser light passes, a first two-photon sensor configured to measure a first pulse width of the first laser light generated from the light source, and a second two-photon sensor configured to measure a second pulse width of the second laser light passing through the optical system, wherein the pulse width correction device corrects a difference between the first pulse width and the second pulse width.

The present system(s) and method(s) use an integrated photonic sensor to determine tilt angle present at the metrology region or mark. The integrated photonic sensor uses two pairs of grating couplers, each pair having an emitting grating coupler and a capturing grating coupler. The positions of the grating couplers may be fixed where a first capturing grating coupler will capture a peak captured light value of its paired emitting grating coupler when the angle of tilt at the region is a positive angle, and a second capturing grating coupler will capture a peak captured light value of its paired emitting grating coupler when the angle of tilt at the region is a negative angle. Using this fixed configuration and knowing the tilt angles at which peak coupling efficiencies would be captured, a ratio is computed using the two captured light values. A tilt angle is determined using this ratio.

The present invention relates to a conversion device, or commonly called transimpedance amplifier, able to convert an input electric current (Id) from a current source such as a photonic sensor (D) into an output voltage (Vo) and comprising an integrated electronic circuit comprising, inter alia, a resistive component (Rf) of adjustable value and a capacitive component (Cf) of adjustable value. The invention also relates to a method for determining the values of the resistive component and of the capacitive component.

1. Name of the product in this design: High-speed silicon photonics sensor chassis (standard type). 2. Application of this design: This design is the chassis of a "high-speed silicon photonics sensor query instrument", used to carry and protect the internal optical signal detection and demodulation module. It is suitable for special industrial environments with high electromagnetic interference, flammable and explosive materials. The high-speed silicon photonics sensor uses laser detection technology to demodulate signals from silicon-based / fiber-based sensors such as Fabry-Perot cavities and Bragg gratings to measure physical quantities such as temperature, pressure, and acceleration. 3. The key design features of this product are the combination of shape and pattern. 4. The image or photograph that best illustrates the design's key points: a 3D model.

The invention discloses an underwater laser ranging method, and relates to the field of ranging methods. The underwater laser ranging method comprises the following steps: S1, acquiring a plurality of signal peaks; s2, calculating a confidence coefficient; s3, filtering invalid peaks; s4, selecting an effective peak; s5, carrying out multi-frame filtering processing; and S6, outputting a distance measurement result. According to the underwater laser ranging method, a single-photon DTOF sensor is adopted to obtain a multi-peak signal, and confidence calculation, multi-condition filtering and self-adaptive peak selection strategies are comprehensively utilized, so that a target reflection peak and interference peaks such as water scattering, cover plate crosstalk and sunlight noise can be effectively distinguished; therefore, the real target distance is accurately locked in the complex underwater environment, the problems of inaccurate distance measurement and failure caused by signal confusion in a traditional method are solved, and the method adapts to different water quality conditions from clear to turbid by introducing a multi-frame filtering algorithm and a dynamic threshold technology and combining with special processing logic for turbid water and clear water.

1. Name of the product in this design: Optical Fiber Adapter. 2. Purpose of this product design: It is used to connect different types of silicon photonic sensors on branch lines, and to connect multi-core optical cables to the main line outlet through the optical cable adapter and connect to the silicon photonic sensor query instrument. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: 3D view 1.

A method is described for detecting and measuring at least one dynamic mechanical quantity and one thermal quantity, associated with the application of a load to a system or component, by means of detection performed in an element (10) of the system or component. The method involves arranging in a casing or housing (9) at least two pairs of optical fibre sensors (1, 2), each capable of detecting a mechanical strain and a thermal quantity; then, incorporating into the element (10) the casing or housing (9), so that it undergoes deformation caused by and indicative of the dynamic mechanical quantity acting on the element and so that it is subject to a thermal condition dependent on the thermal quantity present in the element, and thereby representative of the thermal quantity. The casing or housing (9) is designed to transmit the aforementioned thermal condition to the optical fibre sensors. The step of arranging at least two pairs of optical fibre sensors involves placing a first pair of optical fibre sensors 1 in mechanical contact with the casing or housing (9), ensuring that the deformation or strain of the casing or housing is transmitted to the optical fibre sensors of this first pair (1). Additionally, a second pair of optical fibre sensors (2) is arranged in such a way that the optical fibre strain sensors of this second pair (2) are mechanically isolated from the casing or housing (9), ensuring they are not affected by the dynamic mechanical quantity, but only by the aforementioned thermal quantity. The method involves each optical fibre sensor in the first pair (1) detecting a mechanical strain indicative of the respective deformation of the casing or housing, thereby providing a first result dependent on both the dynamic mechanical quantity and the thermal quantity. Each optical fibre sensor in the second pair (2) provides a second result dependent solely on the thermal quantity. The method finally involves determining the at least one dynamic mechanical quantity and the thermal quantity, based on the aforementioned first and second results. A device and a sensorized pad capable of implementing the aforementioned method are also described.

To provide a detection device capable of suppressing deterioration in sensing accuracy.SOLUTION: The detection device includes a sensor panel in which a plurality of optical sensors are arranged, a light source, and a control circuit. The detection target placed between the sensor panel and the light source is provided with a culture medium capable of culturing colonies. The control circuit repeats an acquisition process of obtaining outputs of the plurality of optical sensors, and performs a comparison process of comparing a first output obtained in a first acquisition process with a second output obtained in a latest acquisition process. The comparison processing includes first comparison processing for comparing the outputs of the respective optical sensors, and second comparison processing for comparing the outputs of the respective optical sensors in a region unit including a certain optical sensor and its peripheral optical sensors. The control circuit determines that the output of the optical sensor having the difference equal to or larger than the predetermined value in the first comparison processing and having the difference equal to or larger than the predetermined value in the second comparison processing with the optical sensor satisfying the first condition as one optical sensor is the output of the optical sensor overlapping the colony.SELECTED DRAWING: Figure 9

Effective quantum communication is achieved by room temperature (RT) operating single photon sensor with high photo detection efficiency (PDE) at 1550 nm wavelength. The leading class of devices in this segment is avalanche photo detectors operating particularly in the Geiger mode. A device is provided which employs a two-dimensional (2D) semiconductor material on a co-optimized dielectric photonic crystal substrate to simultaneously decrease the dark current by orders of magnitude and increase the PDE. The device is predicted to achieve RT operation with a PDE >99%. Harnessing the high carrier mobility of 2D materials, the device has ˜ps jitter time and can be integrated into a large 2D array camera.

A system for calorimetry includes a well having a volume for receiving a sample, an input feature to facilitate reception of the sample in the well, a light source to irradiate the well and the sample with incident light, and a photonic sensor chip disposed at the bottom of the well. The photonic sensor chip includes plural nanohole array (NHA) sensors. A light detector is configured to measure transmission of light through the NHA sensors to obtain a series of extraordinary optical transmission (EOT) measurements. Frame elements secure and mutually couple the light source, the photonic sensor chip, the light detector, and the input feature to form a calorimetry unit. A processor is configured to calculate a calorimetry measurement as a function of the series of EOT measurements, the calorimetry measurement being indicative of energy released as a result of the sample in the well undergoing a change.

The invention discloses a high-frame-rate reconfigurable single-photon sensor integrated circuit. The high-frame-rate reconfigurable single-photon sensor integrated circuit comprises a reconfigurable photoelectric detector macro-pixel array and a high-bandwidth reconfigurable front-end circuit, the macro pixel array is used for being configured into macro pixel arrays with different macro pixel scales and processing current output by the macro pixel array to obtain output current; the front-end circuit is used for being configured as a current subtraction and comparison circuit or a buffer and transimpedance amplification circuit and outputting a voltage signal output by any one of the two circuits; the high-frame-rate reconfigurable single-photon sensor integrated circuit is used for working in any one of a long-distance low-signal-to-noise-ratio ranging mode, a high-signal-to-noise-ratio high-precision ranging mode and a high-signal-to-noise-ratio high-frame-rate ranging mode. The reconfigurable silicon-based single-photon sensor chip solves the problems that the reconfigurable silicon-based single-photon sensor chip is single in structure, and high-frame-rate, high-precision and low-signal-to-noise-ratio detection restricts one another.

1. Name of the product in this design: High-speed silicon photonics sensor chassis (portable). 2. Application of this design: This design is the chassis of a "high-speed silicon photonics sensor query instrument", used to carry and protect the internal optical signal detection and demodulation module. It is suitable for special industrial environments with high electromagnetic interference, flammable and explosive materials. The high-speed silicon photonics sensor uses laser detection technology to demodulate signals from silicon-based / fiber-based sensors such as Fabry-Perot cavities and Bragg gratings to measure physical quantities such as temperature, pressure, and acceleration. 3. The key design features of this product are the combination of shape and pattern. 4. The image or photograph that best illustrates the design's key points: 3D view 1.

The present invention relates to a quantum computing system incorporating an advanced neural network for predictive error correction and system optimization. The neural network utilizes machine learning techniques, including deep learning and reinforcement learning, to analyze real-time data from a monitoring system comprising photonic sensors. The system dynamically adjusts high-frequency laser parameters and cryogenic cooling to maintain qubit coherence and prevent decoherence events. The neural network also integrates predictive models based on historical data and time-series analysis, enabling preemptive correction of potential errors during quantum operations. By refining its predictive capabilities and control over quantum operations, the system enhances computational accuracy and operational stability, making it particularly suitable for high-precision quantum applications.

A metrology system(s) and method(s) described herein can eliminate the need for a separate focus branch often used in prior metrology systems to determine a focus position for imaging a substrate. An integrated photonic sensor is used to determine the focus position. The integrated photonic sensor is based on apodized grating couplers wherein, by changing a grating period and / or duty cycle, the amplitude and the phase of the grating coupler mode is engineered to have an optimum coupling efficiency for a specific defocus (or initial / known focus position). A coupling efficiency is determined between an emitting grating and a receiving grating based on emitted radiation with a certain amplitude and phase configured for a known position relative to a substrate, and reflected radiation received from the substrate. A focus position is determined based on the coupling efficiency and the known position.

The invention discloses a silicon photon CIS sensor heterogeneous integration packaging structure and method. The method comprises the steps that 1) a photon engine is prepared, an optical / electric integrated circuit is integrated and vertically connected through a copper needle, and a lens coupler is arranged at the optical input end; (2) a CIS chip is inversely arranged on the first RDL layer through a micro-bump, a photosensitive area is hollowed out, a vertical interconnection channel embedded with a first copper column is formed by adopting a TIV technology, a CIS packaging layer is coated with a light-transmitting material, and an optical micro-mirror is integrated on one side of the CIS packaging layer; (3) preparing an ASIC chip; 4) preparing an intermediate layer, and forming a second copper column, an upper bonding pad and a lower bonding pad by adopting a TSV process; according to the invention, TIV, copper column interconnection and CPO heterogeneous integration are combined, the reliability problem of a traditional TSV is overcome, high-bandwidth, low-power-consumption, miniaturized and high-performance packaging is realized, and the packaging structure is suitable for high-speed sensing and data transmission scenes.

The application discloses a high-frame-rate reconfigurable single-photon sensor integrated circuit, comprising: a reconfigurable photodetector macro-pixel array and a high-bandwidth reconfigurable front-end circuit; the macro-pixel array is used for being configured as a macro-pixel array with different macro-pixel scales, and processing the current output by the macro-pixel array to obtain an output current; the front-end circuit is used for being configured as a current subtraction and comparison circuit or a buffer and transimpedance amplification circuit, and outputting the voltage signal output by any one of the two circuits; the high-frame-rate reconfigurable single-photon sensor integrated circuit is used for working in any one of a long-distance low signal-to-noise ratio ranging mode, a higher signal-to-noise ratio high-precision ranging mode and a high signal-to-noise ratio high-frame-rate ranging mode. The application solves the problem that the reconfigurable silicon-based single-photon sensor chip structure is single, high-frame-rate, high-precision and low signal-to-noise ratio detection are mutually restricted.

Example embodiments relate to alignment-tolerant photonic sensing systems. An example sensing system includes an illumination module for delivery of a light beam. The sensing system also includes a cartridge that includes a photonic sensor chip having a length axis and a width axis. The photonic sensor chip includes a plurality of grating couplers in a first areal portion of the photonic sensor chip. The photonic sensor chip also includes a plurality of sensing sites. Additionally, the photonic sensor chip includes waveguides connecting each grating coupler to a respective sensing site or group of sensing sites of the plurality of sensing sites. Further, the sensing system includes a cartridge holder for releasably receiving and locking the cartridge into a sensing position. The photonic sensor chip is aligned relative to the illumination module up to permitted alignment tolerances when the cartridge is locked into the sensing position.