An object is to provide an electronic device of a multilayer structure with 
high density and high reliability that can be reduced in size while incorporating an 
electronic component therein, and further provide a production method for easily producing such an electronic device. An electronic device of the present invention includes wiring 
layers and electrically insulating 
layers stacked on a core board and establishes predetermined 
electrical conduction between the wiring 
layers through upper-lower side conducting vias provided in the electrically insulating layers. An 
electronic component incorporating layer formed by directly forming on a lower layer an insulating resin layer having a cutout portion for receiving an 
electronic component therein and upper-lower side conducting vias and by incorporating the electronic component in the cutout portion is provided at least between one of the wiring layers and one of the electrically insulating layers and / or between the core board and the electrically insulating layer. At least the uppermost-layer electronic component incorporating layer of electronic component incorporating layers has a 
metal frame body surrounding the electronic component and the upper-lower side conducting vias, and a 
metal cap having a 
flange portion fixed to the 
metal frame body of the uppermost-layer electronic component incorporating layer is provided.