31results about How to "Avoid material damage" patented technology

A joint section where covering films 2a, 2b of film-covered battery 1 are heat-sealed together is formed with flat surface 6′ having thickness t1 and groove 6 having thickness t2. Groove 6 serves to reduce the projection area of film-covered battery 1 by folding side 2c toward receiving section 2a1 with groove 6 serving as an edge, and groove 6 is made thinner than flat surface 6′ by Δ t=t1−t2. Therefore, the length of covering films 2a, 2b produced on outer side 6a is shortened as compared with the case of folding the portion that has thickness t1.

A joint section where covering films 2a, 2b of film-covered battery 1 are heat-sealed together is formed with flat surface 6′ having thickness t1 and groove 6 having thickness t2. Groove 6 serves to reduce the projection area of film-covered battery 1 by folding side 2c toward receiving section 2a1 with groove 6 serving as an edge, and groove 6 is made thinner than flat surface 6′ by Δt=t1−t2. Therefore, the length of covering films 2a, 2b produced on outer side 6a is shortened as compared with the case of folding the portion that has thickness t1.

A narrow track-width magnetoresistive sensor by defining a trench formed between first and second hard bias layers and depositing the sensor into the trench. The sensor can include a sensor stack sandwiched between first and second electrically conductive lead layers. First and second electrically insulating side walls are formed at either side of the sensor stack. First and second hard bias layers extend from the sides of the sensor stack, being separated from the sensor stack by the first and second electrically insulating side walls. First and second physically hard insulation layers are provided over each of the hard bias layers.

Two memory areas on a wafer are coupled through pass transistors to double the memory capacity of each area and can be sawed to yield two memory chips each with single memory area. A pair of pass transistors are used to couple each dedicated functional pad in both memory areas, when the pass transistors are turned on. The connection between the pass transistor pair can be sawed through to yield single capacity memory dice. The memory capacity can be further increased by coupling more memory areas together with pass transistors.

The invention relates to a sintering furnace for components consisting of sintering material, especially dental components and in particular components consisting of ceramic, and a method for sintering such components. The sintering furnace 1 comprises a heatable furnace chamber 2 for the component 9 to be sintered, the furnace chamber 2 having a wall section 6 to be opened for inserting the component 9 to be sintered into the furnace chamber 2. Drive means 10 are provided for mechanized opening and closing of the wall section 6, and a control 11 is provided for the drive means 10 that has an actuation element 12 for the drive means 10. Furthermore, a heating device 5 for the furnace chamber 2 is provided, and the control 11 causes the furnace chamber 2 to be heated. Actuating the control element 12 triggers the loading sequence of the control 11, and the drive means 10 are automatically actuated by the control 11 corresponding to the loading sequence. An additional subject is a method for operating the sintering furnace, as well as a computer program therefor.

The invention discloses an automatic steel ball buffering and receiving device which comprises a buffering blanking device and a lifting receiver. The buffering blanking device comprises a feeding pipe and a blanking pipe. The blanking pipe is internally provided with inclined buffering plates for enabling steel balls to fall in a zigzag track mode and arranged in a staggered mode. The lifting receiver comprises a ball receiving frame, an air cylinder, a controller and a position sensor. Due to the fact that the steel balls are blocked by the inclined buffering plates in the blanking pipe, the steel balls are made to fall in the zigzag track mode, and the falling speed of the steel balls is greatly reduced, so that the problem the steel balls are collided and damaged in the blanking process can be avoided; the position sensor is used to detect the height position of the steel balls in the ball receiving frame, when the position sensor detects that the steel ball position is lower than the set position, the ball receiving frame is lifted to shorten the steel ball falling height, so that the problem that the steel balls are collided and damaged can be avoided; when the position sensor detects that the steel ball position is higher than the set position, the ball receiving frame is lowered, the steel ball falling height is increased, and the problem that a steel ball discharging opening is blocked can be avoided.