31results about How to "Improve data retention characteristics" patented technology

A semiconductor memory device includes a memory cell having an FET of a floating body type, and a capacitor for storing a data charge; a bit line to which the source or the drain of the FET is connected; a precharging device for performing precharge control so that the bit line has a predetermined precharge voltage; a sense amplifier for amplifying and storing the potential of the bit line, which is set in accordance with the data charge read from the memory cell; a switching device, provided between the bit line and the sense amplifier, for performing selective connection therebetween; and a control part for controlling the precharging device, the sense amplifier, and the switching device. Except for each period for performing data reading or writing, the control part makes the precharging device perform the precharge control and makes the switching device disconnect the bit line from the sense amplifier.

Disclosed is a semiconductor-memory device comprising a selector for performing switching control such that in the standby state the refresh operation is performed responsive to an external-refresh-execution command supplied from outside the semiconductor-memory device, while in the active state, the refresh operation is performed, not under the control from outside the semiconductor-memory device, but under the control from a built-in timer.

The invention relates to the micro-electronics technical field, and discloses a non-volatile storage unit of a nanocrystal floating gate structure, which comprises a silicon substrate, a source conduction region 6, a drain conduction region 7, a tunneling dielectric layer 2, a nanocrystal charge storage layer 3, a control gate dielectric layer 4 and a gate material layer 5, wherein the source conduction region 6 and the drain conduction region 7 which are heavily doped are arranged on two ends of the silicon substrate 1, the tunneling dielectric layer 2 is covered on a current carrier channel between the source conduction region 6 and the drain conduction region 7, the nanocrystal charge storage layer is covered on the tunneling dielectric layer, the control gate dielectric layer 4 is covered on the nanocrystal charge storage layer, and the gate material layer 5 is covered on the control gate dielectric layer. The invention simultaneously discloses a process for preparing the non-volatile storage unit of a nanocrystal floating gate structure. The non-volatile storage unit of a nanocrystal floating gate structure increases programming/erasing speed of the non-volatile storage unit of a floating gate structure, effective storage capacity, data retention, programming/erasing durability and the like, and the process for preparing the non-volatile storage unit of a nanocrystal floating gate structure simplifies manufacturing technique, increases manufacturing efficiency and reduces manufacturing cost based on the conventional CMOS technique.

The invention relates to a nanocrystal nonvolatile memory based on strained silicon in the technical fields of nano electronic components and nano processing. The nanocrystal nonvolatile memory based on strained silicon comprises a silicon substrate, a GeSi gradually-doped buffer layer, a Gel-xSix relieving layer, a strained silicon layer, lightly-doped drain electrodes, a source conduction region, a drain conduction region, a tunneling dielectric layer, a nanocrystal charge storage layer, a control grid dielectric layer and a grid electrode material layer, wherein the GeSi gradually-doped buffer layer, the Gel-xSix relieving layer and the strained silicon layer are deposited on the silicon substrate; the lightly-doped drain electrodes, the source conduction region and the drain conduction region are arranged at two sides in the silicon substrate; the tunneling dielectric layer covers a current carrier channel arranged between the source conduction region and the drain conduction region; the nanocrystal charge storage layer covers the tunneling dielectric layer; the control grid dielectric layer covers the tunneling dielectric layer; and the grid electrode material layer covers the control grid dielectric layer. According to the invention, the mobility is increased by utilizing the strained silicon, thereby increasing the reading current, and simplifying a peripheral circuit; the nanocrystal nonvolatile memory based on strained silicon adopts the nanocrystal as a floating grid material, so that the performance of a storage device is improved, and particularly, the storage performance, such as storage windows, programming/erasing speed, data retention characteristic and the like, is improved comprehensively.

The invention relates to the technical field of microelectronics, and discloses a nonvolatile three-dimensional semiconductor memory device and a preparing method. The three-dimensional semiconductor memory device comprises bit lines made of strip-shaped connecting materials which are isolated by a plurality of insulating layers; each strip-shaped connecting bit line is provided with two surface zones along the side direction; word lines made of connecting materials are arranged in the direction orthogonal with the connecting bit lines; and storage materials are placed in the middle of a cross-shaped overlapping zone which is then used as an electric charge capturing stack zone or a resistance changing function zone. High-dielectric-constant materials can be used in a function zone of the three-dimensional semiconductor memory device, and high-work function materials such as metal nitride are used in a gate electrode. Therefore, according to the preparing method of the three-dimensional semiconductor memory device, partitioning zones arranged between the word lines are introduced first, then storage function layer materials and gate materials are deposited in a back-gate technology, a technology is simplified, material pollution is avoided, and meanwhile performance of the device is improved.

A nonvolatile semiconductor memory device according to an embodiment comprises: a memory cell array including a plurality of memory cells provided one at each of intersections of a plurality of first lines and a plurality of second lines and each storing data by a data storing state of a filament; and a control circuit configured to execute a write sequence that writes data to the memory cell, the write sequence including: a setting operation that applies a setting pulse having a first polarity to the memory cell; and a removing operation that applies a removing pulse having a second polarity opposite to the first polarity to the memory cell; and the control circuit, during execution of the write sequence, is configured to repeatedly execute the setting operation until the memory cell attains a desired data storing state, and then to execute the removing operation.

The invention discloses a method of manufacturing a flash memory. The method comprises the steps of etching an active region and an isolation region on a semiconductor substrate which is stacked by a substrate, a sacrificial layer and a mask layer in sequence, forming a lining layer on the substrate after the etching of the mask layer and the sacrificial layer to obtain a semiconductor structure of a smooth corner; forming an insulation layer on the semiconductor structure of the smooth corner; forming an isolation oxide layer on the insulation layer to fill the isolation region; removing the isolation oxide layer and the insulation layer partially until the isolation oxide layer levels with the insulation layer and the mask layer; removing the mask layer located on the active region to expose the sacrificial layer and the partial insulation layer which are in contact with the mask layer; removing the exposed sacrificial layer and the partial insulation layer to expose the substrate of the active region; and forming a tunnel oxide layer and a floating gate layer on the exposed substrate of the active region. The invention can prevent the tunnel oxide layer and the floating gate layer from being influenced by the isolation oxide of the isolation region, thereby improving the data holding characteristics of the flash memory.

A semiconductor memory device, firstly, has both the thickness of a tunnel film and that of a top film provided thereon and configured to be in the FN tunneling region (4 nm or more). The data retention characteristics can be improved by configuring both the thickness of a tunnel film and that of a top film to have a thickness of in the FN tunneling region. Secondly, a high-concentration impurity region of a conductivity type the same as that of the substrate is provided in a substrate region arranged between assist gates provided adjacently to each other. The aforementioned high-concentration impurity region makes a depletion layer extremely thin when bias is applied to the assist gates. Hot holes generated between bands in the depletion region are injected into a charge storage region and the holes and electrons make pairs and disappear, enabling easy data erasing.

A memory unit includes memory elements and a drive section. In executing a first operation out of the first operation for changing resistance state of the memory element from one resistance state out of low resistance state and high resistance state to the other resistance state and a second operation for changing the resistance state of the memory element from the other resistance state to the one resistance state, the drive section performs stepwise operation, in which the drive section repeatedly performs, at least one time, a step in which strong stress application step for applying a stress for performing the first operation to the memory element as the drive target relatively strongly is performed and subsequently weak stress application step for applying a stress for performing the second operation to the memory element as the drive target relatively weakly is performed, and subsequently performs the strong stress application step.

A programming method of an NAND flash memory is provided, for narrowing a distribution width of a threshold voltage. The method includes a step of verification reading for verifying a threshold voltage of a selected memory cell after a programming voltage is applied to a selected word line. The verification reading further includes a step of pre-charging a voltage to a bit line, a step of discharging the pre-charged bit line to a source line, and a step of reading the voltage of the bit line after the discharging step. Regarding the discharge period from starting the discharging of the bit line to starting the read out, the discharge period of the verification reading after the initial programming voltage is applied is set longer than the discharge period of the verification reading after the subsequent programming voltage is applied.

The invention discloses a ferroelectric memory and a preparation method thereof, relates to the technical field of microelectronic manufacturing and memories, and aims to provide a ferroelectric memory which is relatively high in polarization intensity and has data retention time capable of meeting the retention period requirement proposed by the industry. The ferroelectric memory includes: a lower electrode; the ferroelectric material layer is formed on the lower electrode, and the interface of the lower electrode and the ferroelectric material layer is processed by NH3; and the upper electrode is formed on the ferroelectric material layer.