55results about How to "Reliability problem" patented technology

There is provided a method for driving the TFT-LCD using multi-phase charge sharing, in which odd-numbered source lines and even-numbered source lines are connected to an external capacitor through a switching element during a period of multi-phase charge sharing time, to share the charges charged in the source lines. The method includes: a first charge sharing step in which even-numbered capacitors, which have been discharged with a voltage VL during a period of (N-1)th gradation expressing time, are charged with the voltage of an external capacitor, VL+(1 / 3)Vswing, according to a second selection signal; a second charge sharing step in which odd-numbered capacitors, which have been charged with a voltage VH during the period of the (N-1)th gradation expressing time, are charged with a voltage VL+(2 / 3)Vswing through charge sharing with the even-numbered capacitors charged with VL+(1 / 3)Vswing by the first charge sharing, according to a third selection signal; and a third charge sharing step in which the odd-numbered capacitors, which should be discharged with VL during a period of the Nth gradation expressing time, are charged with the voltage of the external capacitor, VL+(1 / 3)Vswing, according to a first selection signal.

A double walled thermal container includes an outer container with an inner container mounted therein. Structural support is provided by an internal connection between the inner container and the outer container to minimize stress on the connection point. A separate elastomeric seal is preferably provided to prevent moisture from entering the area between the inner and outer containers.

A method and device for initiating uplink data packet communication from a mobile device to a base station on a common packet channel is disclosed. The communication is initiated when the mobile device reads broadcast status of common packet channels, after which the mobile device sends an access preamble to the base station that is acknowledged by the base station, and then the mobile device sends a collision preamble which the base station answers with a matching collision response. If the base station's response to the collision preamble also includes a channel allocation message, then the base station begins uplink data packet communication on an allocated channel provided that the allocated channel previously had free broadcast status. However, if the base station's response to the collision preamble includes a channel allocation message designating channel(s) not previously having free broadcast status, then the mobile device's access attempt is aborted.

An expansion device for the heat pump applications consists of a flow resistance device that has a different resistance to refrigerant flow depending on the flow direction through this device. The flow resistance device has no moving parts so that it avoids the damage, wear and contamination problems of the moveable piston in the prior art. The flow resistance device is a fixed obstruction about which the fluid must flow when traveling through the expansion device.

A mixed-voltage input / output buffer having low-voltage design comprises a pre-driver, a tracking unit, a driving unit, and input / output pad, a floating-well unit and a transporting unit. The pre-driver receives first data signal and enable signal and outputs first and second data voltages. The tracking unit provides Gate-Tracking function. The driving unit couples the pre-driver and the tracking unit for production of a first buffer voltage corresponding to the first data voltage. The input / output pad couples the driving unit to output a first buffer voltage and to receive a second data signal. The output unit is used for outputting a second buffer voltage corresponding to the second data signal. The floating-well unit couples to the driving unit and the input / output pad in order to output first buffer voltage and receive second data signal. The floating-well unit is used for preventing leakage current.

A manufacturing method of common mode filters and a structure of the same are revealed. A common mode choke layer is disposed over a composite substrate and a second magnetic material layer is coated on an upper surface of the common mode choke layer. The common mode choke layer is produced by a wafer-level electrode leading out method and having leading-out terminals on sides thereof. External electrodes are formed on sides of the common mode choke layer by partial cutting, sputtering, lithography and electroplating at wafer level and corresponding to the leading-out terminals. Thereby common mode filters produced are supported more stably. Moreover, the volume is minimized due to inductive coils and external electrodes connected by wafer level packaging. Thus the common mode filters are mass-produced, the cost is down and the defect rate is reduced.

The present invention provides an electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, and 1700. The assembly 400 uses no solder. Components 406 or component packages 402, 802, 804, 806 with I / O leads 412 are placed 800 onto a planar substrate 808. The assembly is encapsulated 900 with electrically insulating material 908 with vias 420, 1002 formed or drilled 1000 through the substrate 808 to the components' leads 412. Then the assembly is plated 1200 and the encapsulation and drilling process 1500 repeated to build up desired layers 422, 1502, 1702. The planar substrate 808 may be a flexible substrate 2016 allowing bending of an assembly 2000 to fit into various enclosures.