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122 results about "Adjacent level" patented technology

Adjacent level disease is a post-operative complication of spinal fusion surgery in which the fusion of one or more motion segments affects the joints above and below it, causing the breakdown of joints.

Driving circuit unit, gate driving circuit and display device

ActiveCN102723064AFast pull upQuick pull downStatic indicating devicesDisplay deviceEngineering
The invention relates to a gate driving circuit and a display device. The gate driving circuit comprises multiple levels of driving circuit units connected in series. Each level of units comprises an inputting module for providing threshold voltage of a driving module, a driving module for responding to the threshold voltage and for sending a first clock signal to a signal outputting interface, a discharging module for responding to an output signal or a clock signal of an adjacent level and for coupling a control terminal of the driving module to a first voltage source, a clock feedthrough inhibiting module for stablizing the potential of the control terminal of the driving module under the control of the clock signal and the output signal of the adjacent level, and a low level maintaining module for stablizing the output signal at the potential of the first voltage source under the control of the clock signal. The driving circuit unit, gate driving circuit and display device provided by the invention employ single driving tube to realize the fast pull-up and pull-down of the output signal with sequential coordination, reducing the delay time of the rise and fall of the output signal at a low temperature, and employs the clock feedthrough inhibiting module to stablize the gate potential of the driving tube, reducing the corresponding dynamic power consumption.
Owner:PEKING UNIV SHENZHEN GRADUATE SCHOOL +1

Stacked via-stud with improved reliability in copper metallurgy

A multilevel semiconductor integrated circuit (IC) structure including a first interconnect level including a layer of dielectric material over a semiconductor substrate, the layer of dielectric material comprising a dense material for passivating semiconductor devices and local interconnects underneath; multiple interconnect layers of dielectric material formed above the layer of dense dielectric material, each layer of dielectric material including at least a layer of low-k dielectric material; and, a set of stacked via-studs in the low-k dielectric material layers, each of said set of stacked via studs interconnecting one or more patterned conductive structures, a conductive structure including a cantilever formed in the low-k dielectric material. The dielectric layer of each of the multiple interconnection levels includes a soft low-k dielectric material, wherein the cantilever and set of stacked via-studs are integrated within the soft low-k dielectric material to increase resistance to thermal fatigue crack formation. In one embodiment, each of the set of stacked via-studs in the low-k dielectric material layers is provided with a cantilever, such that the cantilevers are interwoven by connecting a cantilever on one level to a bulk portion of the conductor line on adjacent levels of interconnection, thereby increasing flexibility of stacked via-studs between interconnection levels.
Owner:GLOBALFOUNDRIES INC

Stacked via-stud with improved reliability in copper metallurgy

A multilevel semiconductor integrated circuit (IC) structure including a first interconnect level including a layer of dielectric material over a semiconductor substrate, the layer of dielectric material comprising a dense material for passivating semiconductor devices and local interconnects underneath; multiple interconnect layers of dielectric material formed above the layer of dense dielectric material, each layer of dielectric material including at least a layer of low-k dielectric material; and, a set of stacked via-studs in the low-k dielectric material layers, each of said set of stacked via studs interconnecting one or more patterned conductive structures, a conductive structure including a cantilever formed in the low-k dielectric material. The dielectric layer of each of the multiple interconnection levels includes a soft low-k dielectric material, wherein the cantilever and set of stacked via-studs are integrated within the soft low-k dielectric material to increase resistance to thermal fatigue crack formation. In one embodiment, each of the set of stacked via-studs in the low-k dielectric material layers is provided with a cantilever, such that the cantilevers are interwoven by connecting a cantilever on one level to a bulk portion of the conductor line on adjacent levels of interconnection, thereby increasing flexibility of stacked via-studs between interconnection levels.
Owner:GLOBALFOUNDRIES INC

MR (Measurement Report) data indoor and outdoor separation method based on statistic model

The invention discloses a MR (Measurement Report) data indoor and outdoor separation method based on a statistic model. The MR data indoor and outdoor separation method comprises the steps of: aiming at MR sampled data of each cell of an outdoor macro station, carrying out characteristic value statistics of received signals, which comprises statistics of a main cell level; and carrying out separation of a mixed Gaussian distribution and probability calculation, and according to an indoor probability, obtaining a corresponding indoor and outdoor separation result. Moreover, the MR data indoor and outdoor separation method supports combination of various factors of the main cell level, a main and adjacent level difference, the number of adjacent cells and the like, and by a combined model, an indoor and outdoor judgment result is judged and output; and judgment methods at other angles also can be integrated. According to the MR data indoor and outdoor separation method disclosed by the invention, data characteristics which are shown by signal intensity and a signal number of the MR data in a statistical sense and are combined by two indoor and outdoor normal distributions are utilized, and probabilities that different signal intensity and different signal numbers occur in a door or outside a door can be calculated, so that the method of separating the MR data according to signal characteristics is more feasible, and accuracy of indoor and outdoor separation of the MR data is improved.
Owner:WUHAN HONGXIN TECH SERVICE CO LTD
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