122 results about "Adjacent level" patented technology

In a spin-chuck with plural collector levels, a separate exhaust controller is provided for each level. This permits selectively varying gas flow conditions among the collector levels, so that the ambient pressure at one level does not adversely affect device performance in an adjacent level.

A multilevel air-gap-containing interconnect structure and a method of fabricating the same are provided. The multilevel air-gap-containing interconnect structure includes a collection of interspersed line levels and via levels, with via levels comprising conductive vias embedded in one or more dielectric layers in which the dielectric layers are solid underneath and above line features in adjacent levels, and perforated between line features. The line levels contain conductive lines and an air-gap-containing dielectric. A solid dielectric bridge layer, containing conductive contacts and formed by filling in a perforated dielectric layer, is disposed over the collection of interspersed line and via levels.

A multilevel semiconductor integrated circuit (IC) structure including a first interconnect level including a layer of dielectric material over a semiconductor substrate, the layer of dielectric material comprising a dense material for passivating semiconductor devices and local interconnects underneath; multiple interconnect layers of dielectric material formed above the layer of dense dielectric material, each layer of dielectric material including at least a layer of low-k dielectric material; and, a set of stacked via-studs in the low-k dielectric material layers, each of said set of stacked via studs interconnecting one or more patterned conductive structures, a conductive structure including a cantilever formed in the low-k dielectric material. The dielectric layer of each of the multiple interconnection levels includes a soft low-k dielectric material, wherein the cantilever and set of stacked via-studs are integrated within the soft low-k dielectric material to increase resistance to thermal fatigue crack formation. In one embodiment, each of the set of stacked via-studs in the low-k dielectric material layers is provided with a cantilever, such that the cantilevers are interwoven by connecting a cantilever on one level to a bulk portion of the conductor line on adjacent levels of interconnection, thereby increasing flexibility of stacked via-studs between interconnection levels.

The most hardware efficient way to implement an N-stage pipeline ADC is to use (G+1)-level ADC-DAC for its first (N−1) stages and use (2·G−1)-level ADC for the last stage, where G is the inter-stage gain. For the fist (N−1) stages using (G+1)-level ADC-DAC, the (G+1) levels are uniformly distributed between −(G−1) / G and (G−1) / G; inclusively. The spacing between two adjacent levels is 2(G−1) / G2. For the last stage using (2·G−1)-level ADC, the (2·G−1)-levels are uniformly distributed between −(G−1) / G and (G−1) / G, inclusively. The spacing between two adjacent levels is 1 / G.

The invention discloses an implantable facet arthroplasty device suitable for treating adjacent level disease. The device is designed for implantation between a first vertebra and a second vertebra. Components of the device include: a crossbar; a first component having a first attachment mechanism adapted to attach to a first location of a spinal fusion device attached to a first vertebra and a second attachment mechanism adapted to attach to the crossbar; and a second component having a second attachment mechanism adapted to attach to a second location of a spinal fusion device attached to the first vertebra and a second attachment mechanism adapted to attach to the crossbar. The first component articulates relative to the second component and the first vertebra articulates relative to the device itself.

A control system for routing data in an automatic identification system includes an event management system (EMS), a real-time in-memory data structure (RIED) and a task management system (TMS). The control system can be provided in a distributed hierarchical arrangement. The EMS of each control system can include filters which limit the amount of information provided to the next level in the hierarchy. In this manner the hierarchical control system network acts as a high volume data collector and processor. In some embodiments a level of the hierarchy can be removed spatially and / or temporally from an adjacent level in the hierarchy.

A spacer device is provided for use with a primary spinal fixation device to treat, reduce, or delay adjacent level degenerative disc disease. The spacer device comprises a compressible spacer, a transverse member, and a connecting member. The compressible spacer is sized to fit between the spinous processes of two adjacent vertebrae and is configured to reduce the range of motion of at least one vertebra. The transverse member is configured to extend from one side of the midline of the spine, extending through the interspinous process space. The transverse member is coupled with the spacer. The connecting member is attachable to the transverse member and to a primary spinal fixation device.