The invention relates to the technical field of digital twinning, and discloses a 3D
chip design
simulation modeling method and
system based on the twinning technology, and the method comprises the steps: obtaining
physical field simulation data, carrying out the
feature fusion of thermal stress and thermoelectric
coupling through solving a
thermal expansion vector field, and obtaining a preliminary mapping relation; according to the preliminary mapping relation, nonlinear
cumulative effect calculation of the dynamic
power consumption density is carried out, and a final
cumulative effect value is obtained; according to the final
cumulative effect value, adjusting an
interconnection material, and correcting an index set; according to the correction index set, deviation quantitative calculation is carried out through
heat flow evolution path analysis, and a
thermal resistance degradation
deviation matrix is obtained; according to the
thermal resistance degradation
deviation matrix, Pareto front inflection point extraction is carried out, and balance configuration is obtained; according to the balance configuration, non-dominated declusters meeting a preset
critical power consumption threshold value are screened out, and candidate declusters are obtained; and according to the candidate declusters, screening out the optimal configuration, and outputting a final optimization scheme. The method can reduce the abrupt change risk of the
chip degradation rate.