According to the method for measuring the
surface type parameters of the transparent thin plate,
outlier identification and correction are carried out on collected surface coordinates and thickness data of the transparent thin plate before and after
polishing through an abnormal value detection
algorithm and adjacent non-abnormal point linear interpolation replacement, and then
noise reduction
processing is carried out on the corrected data by adopting a
dynamic noise reduction combination. The method comprises the following steps of: acquiring surface coordinates and thickness data of a transparent thin plate, performing interpolation prediction on the unacquired surface coordinates and thickness data of the transparent thin plate, finally performing data fitting, generating a thickness thermodynamic diagram, calculating the bending degree, the warping degree, the
total thickness change and the local thickness change of the transparent thin plate, simultaneously generating a removal quantity thermodynamic diagram, calculating the kurtosis, the skewness, the
mean square error and the local deviation value, and judging the
polishing uniformity; the method is high in key defect recognition accuracy, high in interpolation adaptability and high in parameter acquisition precision, multi-dimensional quantitative analysis of the
polishing uniformity of the transparent thin plate is achieved by introducing indexes such as kurtosis, skewness,
mean square deviation and local deviation, and data support is provided for technological parameter adjustment.