Patents
Literature
Patsnap Eureka AI that helps you search prior art, draft patents, and assess FTO risks, powered by patent and scientific literature data.

9 results about "Wrapping procedure" patented technology

Explosive packaging method for packaging a molded body containing explosives

Explosive packaging method for packaging an explosive-containing molded body with an explosive and an outgassing additive in the form of a marking agent, comprising the following steps: I. Providing a foil bag (11) comprising two foil layers (5, 6) which are joined together along a first, a second and a third side (7, 8, 9), wherein the foil layers (5, 6) are welded together on two of the sides (8, 9) and there is a seamless transition between the two foil layers (5, 6) along a third of the sides (9) and wherein the foil bag (11) has an opening (13) along a fourth side (12); II. Forming the foil bag (11) to receive an explosive-containing molded body through the opening (13); III. Inserting the molded part into the foil bag (11); wherein the insertion is carried out using pliers, by means of which a distance is maintained between the explosive molded part and the foil bag (11) during the insertion of the molded part; IV. Vacuum sealing and diffusion-tight welding of the foil bag (11) along the opening (13) by applying at least one line weld (15), wherein the foil bag provided in step I is formed from a composite film (4) comprising at least a diffusion barrier layer (2) and a weldable material; and wherein the marking agent is dimethyl dinitro butane and that the diffusion barrier layer (2) is designed to prevent the diffusion of this marking agent.
Owner:MUNI BERKA

Intelligent wafer package identification method, system and equipment

The invention belongs to the technical field of packaging, and relates to an intelligent wafer packaging identification method, system and equipment. The method comprises the following steps: acquiring a label image and preprocessing the label image; a label front view is obtained according to the preprocessed label image, so that label information is clearer and easier to read; obtaining a label text according to the label front view, and automatically completing extraction and recognition of text information; the corresponding packaging program is selected according to the label text, and the packaging program is started, so that packaging automation is realized, the production efficiency is improved, and the problem that errors are easily caused when the packaging program is manually selected is solved; the packaging picture after packaging is obtained, whether the packaging mode meets the requirement or not is judged through the packaging picture, the packaging quality is monitored and detected in real time, and it is ensured that the packaging mode meets the requirement. According to the invention, the label image of the wafer can be accurately identified and read, the packaging program can be accurately called, the packaged packaging bag can be accurately identified, and the packaging quality of the wafer is ensured.
Owner:NEXCHIP SEMICON CO LTD

Spraying equipment and method for inductor production

The invention relates to the technical field of inductor spraying, in particular to inductor production spraying equipment and method. Comprising a spraying box and a rotary spraying head in the spraying box; the rotary spray head can spray the coating towards the inductor; a feeding hole is formed in one end of the spraying box, and a discharging hole is formed in the other end of the spraying box; the spraying box is connected with the rail base in a penetrating mode along the feeding port and the discharging port. A driving roller, a steering roller and a driven roller are arranged on the face, facing the rotary spray head, of the rail base. The driving roller and the driven roller are arranged close to the end part of the track seat; according to the inductor pin protection device, transmission is achieved through the two conveying belts making contact with each other, so that inductor pins are shielded while inductor spraying clamping is achieved, spraying can be rapidly completed while the pins of an inductor are protected, compared with existing inductor spraying, the inductor pin wrapping procedure is omitted, the production efficiency is improved, and the production cost is reduced. And the inductor production efficiency is indirectly improved.
Owner:YUEXI HONGTENG ELECTRONICS CO LTD

Numerical control packaging machine tool

The invention discloses a numerical control packaging machine tool which comprises a supporting frame, the supporting frame is used for supporting and positioning the numerical control packaging machine tool, an adjustable positioning feeding mechanism is fixedly arranged at one end of the top of the supporting frame, a packaging plastic packaging mechanism is fixedly arranged at one end of the top of the supporting frame, and an adjustable counting feeding mechanism is fixedly arranged at the other end of the top of the supporting frame. The multiple collecting frames rotationally connected to one side of the first fixing frame and one side of the second fixing frame correspond to the bottom ends of the multiple counting feeding frames in turn, after feeding is completed, the whole device is driven by the supporting columns to rotate in an exchange mode, the emptied collecting frames are stabilized at the bottom ends of the counting feeding frames, and after the collecting frames completing feeding rotate, the collecting frames are separated from the counting feeding frames. The position of the collection frame at the end exactly corresponds to the position of the guide frame, the collection frames after feeding are subjected to a packaging procedure, the situation that a packaging mechanism of the numerical control packaging machine tool waits for work of a counting mechanism is avoided, the waiting time is shortened, the time cost is reduced, and the packaging efficiency of the numerical control packaging machine tool is improved.
Owner:JIANGSU HOUDAO TECH CO LTD

An intelligent wafer packaging identification method, system and device

The present invention belongs to the technical field of packaging, and relates to an intelligent wafer packaging identification method, system and device. The method of the present invention preprocesses the label image by acquiring the label image; obtains the front view of the label according to the preprocessed label image to make the label information clearer and easier to read; obtains the label text according to the front view of the label, and automatically completes the extraction and recognition of the text information; selects the corresponding packaging program according to the label text and starts the packaging program, which is beneficial to realizing packaging automation, improving production efficiency, and solving the problem that it is easy to make mistakes in manually selecting the packaging program; obtains the packaging picture after packaging, and judges whether the packaging method meets the requirements through the packaging picture, and monitors and detects the packaging quality in real time to ensure that the packaging method meets the requirements. The present invention can accurately identify and read the label image of the wafer, accurately call the packaging program, accurately identify the packaging bag after packaging, and ensure the packaging quality of the wafer.
Owner:NEXCHIP SEMICON CO LTD

Manufacturing method of 2.0 GPa grade gradient strength steel plate spring

The invention discloses a manufacturing method of a 2.0 GPa grade gradient strength steel plate spring, and belongs to the technical field of automobile parts. The manufacturing method comprises rolling, straightening, punching, lug rolling, edge cutting, lug wrapping, aerosol quenching, tempering, shot blasting, paint spraying and assembling, and is characterized in that aerosol quenching comprises the following steps: (1) after the lug wrapping procedure of the steel plate spring is finished, the steel plate spring is conveyed into a heating furnace to be heated and subjected to heat preservation, and the whole steel plate spring is uniformly austenitized; (2) the steel plate spring is rapidly transferred into an aerial fog quenching device, a quenching medium is adopted for conducting local aerial fog quenching on different parts of the steel plate spring obtained after uniform austenitizing, and the cooling rate of local aerial fog quenching ranges from 0.5 DEG C / s to 60 DEG C / s; the steel plate spring has gradient strength in the length direction and the thickness direction and has a gradient structure. Non-uniform mechanical property distribution can be achieved, the strength gradient gradually changing in the length direction and the thickness direction is obtained, and meanwhile the combined performance of high strength and high toughness is obtained.
Owner:DALIAN UNIV OF TECH

Product packaging system and method

The embodiment of the invention provides a product packaging system and method. The system comprises a product counting machine and a vacuum packaging machine. The product counting machine is used for receiving the product batch information, calling a preset program corresponding to the product batch information, detecting the product quantity information and sending a vacuum program signal corresponding to the product quantity information to the vacuum packaging machine; and the vacuum packaging machine is used for receiving the vacuum program signal, calling the corresponding preset vacuum packaging program according to the vacuum program signal, and performing vacuum packaging on the product according to the corresponding packaging parameter information set by the preset vacuum packaging program. And the interaction among the devices is smooth and accurate. The packaging efficiency is improved, errors possibly caused by manual operation are reduced, the quality of the semiconductor finished products in the packaging process is guaranteed, efficient and accurate operation of the whole process from product detection to packaging is achieved, and the overall level of semiconductor finished product packaging is powerfully improved.
Owner:TONGFU CHAOWEI (SUZHOU) MICROELECTRONICS CO LTD

Battery cell coating apparatus

ActiveCN224328718UFinal product manufactureLi-accumulatorsBattery cellWrapping procedure
The application discloses a kind of battery cell film wrapping devices, it is related to lithium battery technical field.The battery cell film wrapping device includes bottom plate and is set on the roller assembly, constraint component and scraper assembly of bottom plate, the bottom plate is used to place battery cell, the roller assembly is used to place blue film, the constraint component is movably connected with the bottom plate, for with the side wall of battery cell resistance, to constrain battery cell, the scraper assembly is movably connected with the bottom plate, can be contacted with the blue film attached to the surface of battery cell and relative to the bottom plate moves, to flatten the blue film.The battery cell film wrapping device can realize constraint to battery cell when film wrapping, improve the yield of mechanized film wrapping operation, can also be suitable for the film wrapping procedure of different sizes of battery cell, improve the compatibility of mechanized film wrapping operation, with the advantages of high production efficiency, less rework times, low production cost.
Owner:BATTEROTECH CO LTD

Method for manufacturing a coil of an electric motor device, winding device for manufacturing the coil of the electric motor device, correspondingly manufactured electric motor device, and electric motor with such an electric motor device

The invention relates to a method (10), in particular a coil winding method, for producing at least one coil (12-26, 110) of an electric motor device (28), in particular a stator, wherein in at least one method step (30) at least one receiving element (38-42), in particular a stator tooth, of the electric motor device (28) is wound with at least one electrical conductor (44), in particular a copper enamelled wire. It is proposed that the receiving element (38-42) is only partially wound with the electrical conductor (44) in at least one process step (30), in particular only with at least one wire layer, preferably with a maximum of two wire layers, wherein only after a further receiving element (46-56), in particular a further stator tooth, of the electric motor device (28) has been, in particular completely, wound with the electrical conductor (44) in at least one further process step (36) is the winding of the receiving element (38-42) with the electrical conductor (44) completed, in particular by winding the receiving element (38-42) with at least one further wire layer of the electrical conductor (44) onto the wire layer already present on the receiving element (38-42).
Owner:ROBERT BOSCH GMBH