An unreinforced,
halogen-free
polyamide moulding composition which is provided with
flame retardants and from which it is possible to produce electric and / or electronic components which can be reliably soldered, i.e. in particular without
blisters being formed in the
soldering process, in particular at 260° C. and possibly higher temperatures after water absorption and in the case of critical designs of the components, and which have an elongation at break of at least 5% and reliably achieve the UL94 classification V0. These
polyamide moulding compositions have the following composition: (A) 62-87% by weight of a partially aromatic, partially crystalline copolyamide having a
melting point of 270° C. to 320° C. and made up of 100% by weight of diacid fraction composed of: 50-100% by weight of
terephthalic acid (TPA) and / or naphthalenedicarboxylic acid; 0-50% by weight of
isophthalic acid (IPA), and 100% by weight of
diamine fraction composed of at least one
diamine selected from the group consisting of: butanediamine, pentanediamine, hexanediamine, octanediamine, methyloctanediamine, nonanediamine, decanediamine, undecanediamine and dodecanediamine; (B) 5-15% by weight of
ionomer; (C) 8-18% by weight of
flame retardants; (D) 0-5% by weight of additives; where the components (A)-(D) add up to 100% by weight.