36results about How to "Avoid downsizing" patented technology

Provided is an optical access system, including: an optical line terminal, a plurality of optical network units and an optical switching unit. The optical line terminal sends to the optical switching unit a control frame including a switching time when the optical switching unit is to make a switch from one of the optical communication paths between the optical line terminal and the plurality of optical network units to another, and an identifier of an optical communication path to which the switch is made in order to switch the optical communication paths between the optical line terminal and the plurality of optical network units. The optical switching unit switches the optical communication paths between the optical line terminal and the plurality of optical network units based on the switching time and the identifier of the optical communication path after switching which are included in the control frame.

In a method of manufacturing a semiconductor device, a second wiring substrate is stacked over a first wiring substrate using a conductive paste, where each wiring substrate has mounted thereon an electronic component. The conductive paste is hardened to form a metal column which forms an electrical connection between the first wiring substrate and the second wiring substrate. The wiring substrates are sealed with a resin. The semiconductor device can be downsized, thinned, and made highly reliable, and its manufacturing cost can be reduced. By using conductive paste for the electrical connection between the wiring substrates, a connecting pitch can be smaller than that in a connecting method of using a solder ball including Cu core, and a connection at low temperature can be achieved. Also, by coating the conductive paste by a print-coating or dispense-coating method, manufacturing is simplified and the manufacturing cost is reduced.

In a display device, the display unit chassis is configured by including a peripheral wall section which is disposed to cover the circumference of a liquid crystal panel, and a bezel case section which is disposed between the liquid crystal panel and the peripheral wall section in a state of covering a surface of a peripheral edge of the liquid crystal panel, side-edge sections whose engagement is limited only to the liquid crystal panel are disposed on both of left and right sides of the bezel case section.

An automatic transmission is configured to achieve at least ten forward speeds and one reverse speeds. This is achieved through the use of two planetary gear sets with a plurality of clutches and brakes configured to operably couple different components of the two planetary gears to achieve different speeds. For example, operation of a first clutch inputs decelerated rotation of a reduction planetary gear to a third sun gear. Operation of a second clutch transmits from an input shaft to a third ring gear, a third clutch inputs decelerated rotation of the reduction planetary gear to the second sun gear, a fourth clutch transmits from the input shaft to the second carrier, a first brake prevents a second sun gear from rotating, a second brake prevents a carrier from rotating, a third brake capable prevents a third ring gear from rotating.

The flexible printed circuit includes a first insulator including a first insulating layer, a second insulator including a second insulating layer, and a wiring layer formed of a conductive material. Each of the first insulator and the second insulator meets IEC 60950. The flexible printed circuit includes a region where insulation of the wiring layer is required, the region is hermetically sealed by the first insulator and the second insulator.

An image pickup device includes: an image pickup element; a spacer surrounding a light receiving surface of the image pickup element; a cover glass attached to the spacer, the cover glass being disposed opposing to the light receiving surface; and an insulative resin configured to thermally couple the image pickup element with the cover glass, and to have a thermal conductivity of not less than 8 W / mK. An endoscope includes: the image pickup device; an image pickup optical system; a drive circuit; a light guide configured to radiate light from a illumination light source; a tubular body configured to accommodate the image pickup device, the image pickup optical system, the drive circuit, the light guide, and a forceps opening; and a first insulative resin having a thermal conductivity of not less than 8 W / mK, and adapted to thermally couple the image pickup device with the drive circuit.

The invention provides a manufacturing method of a semiconductor device, and relates to the semiconductor technical field; the method comprises the following steps: S101, providing a semiconductor substrate; S102, forming an antireflective layer in a boundary between a zone wherein ion injection is to be carried out and a zone wherein an ion implantation shielding layer is to be formed on the semiconductor substrate; S103, employing photoresist to form the ion implantation shielding layer on the semiconductor substrate. The manufacturing method of the semiconductor device adds the step in which the antireflective layer is formed in a boundary between the zone wherein ion injection is to be carried out and the zone wherein the ion implantation shielding layer is to be formed; in a process to expose a photoresist film so as to form the ion implantation shielding layer, the reflection light from the semiconductor substrate can be prevented or stopped from entering the photoresist film, so the reflection light cannot cause size reduction of the ion implantation shielding layer, thereby ensuring key size of the ion implantation shielding layer, and improving performance of the semiconductor device.