The invention relates to the technical field of
semiconductor memories, and discloses a nanoscale non-volatile
resistive random access memory unit utilizing a hemi-spherical grain (HSG)
electron beam
resist and a preparation method thereof. The memory mainly comprises a first conductive
electrode, a through-hole, a first resistive material, a second resistive material, a second
metal nano layer, a third resistive material and a third conductive
electrode, wherein the through-hole and the first resistive material are formed after a
hydrogen silsequioxane (HSQ)
electron beam
resist is exposed and developed via
electron beams. A part left after the HSQ
electron beam resist is exposed and developed is utilized as the through-hole, the
diameter of the through-hole can be as small as a nano magnitude, and the HSQ
electron beam resist which is not completely developed at the bottom of the through-hole can be used as a part or the whole of the first resistive material. By utilizing the preparation method, the resistance changing memory which has the advantages of small device area, high yield and good performance can be obtained; and the
semiconductor memory is apt to large-scale integration and practicality.