58results about How to "Increased convection cooling" patented technology

A magnetically enhanced convection heat sink comprises a heat sink member for dissipating heat from a heat source. A magnetic source creates a magnetic field concentrated at a first location, the intensity of the magnetic field decreasing from the first location to a second location. The heat sink member is positioned within the magnetic field and in a gas flow path between the first and second locations. Gas, having paramagnetic properties, entering the heat sink at the first location is heated by the heat sink member, and as the gas becomes warmer is displaced by cooler gas causing the warmer gas to move toward the second location as it is further heated by the heat sink.

A cooling system of ring segment is provided with: a collision plate that has a plurality of small holes; a cooling space that is enclosed by the collision plate and a main body of the segment body; a first cavity that arranged is the upstream end portion of the segment body in the flow direction of the combustion gas so as to be perpendicular to the axial direction of a rotating shaft; a first cooling passage that communicates from the cooling space to the first cavity; and a second cooling passage that communicates from the first cavity to a fire combustion gas d gas space in the downstream end portion of the segment body in the flow direction of the combustion gas.

A cooling system is provided for automatic transmission torque converter assemblies having a housing shell and flex plate. The cooling system includes a housing cover having opposing exterior and interior surfaces that define a wall portion and a preferably circular base portion. The base portion is configured to attach to the flex plate, preferably by one or more stud members, to be rotated thereby. The wall portion extends from a periphery of the base portion and is configured to attach to the housing shell. The cooling system also includes a plurality of vane members positioned along the outer periphery of the base portion. The vane members are configured to increase convective dissipation of heat from the torque converter assembly to surrounding ambient air by increasing the heat transfer coefficient and surface area. Optimally, the vanes have a turbine fin configuration, but may alternatively have curved fin or a straight-fin configuration.

A heat dissipation structure (2) for a lighting device (1), comprising: at least two separate heat sinks (20, 10) for a light source (3) and a driver (7) for the light source (1), respectively, each heat sink (20, 10) comprising fins (21, 22, 11) and a wall arrangement (15, 25), wherein said at least two separate heat sinks (20, 10) are disposed along an axial direction of the lighting device (1), wherein the fins (21, 22, 11) of said at least two separate heat sinks (20, 10) are enclosed by the wall arrangements (15, 25) to form a chimney structure (30) arranged along said axial direction of the lighting device (1), and wherein the chimney structure (30) comprises at least two sub-chimney structures (31, 32) arranged fluidly in parallel to provide two air flows simultaneously, which reduces heat concatenation.

A cooling system of ring segment is provided with: a collision plate that has a plurality of small holes; a cooling space that is enclosed by the collision plate and a main body of the segment body; a first cavity that arranged is the upstream end portion of the segment body in the flow direction of the combustion gas so as to be perpendicular to the axial direction of a rotating shaft; a first cooling passage that communicates from the cooling space to the first cavity; and a second cooling passage that communicates from the first cavity to a fire combustion gas d gas space in the downstream end portion of the segment body in the flow direction of the combustion gas.

The invention discloses a cooling structure and a cooking method of a photovoltaic (PV) inverter. The cooling structure of the PV inverter mainly comprises convection air inlet channels on two sides and at the bottom of a cooling chamber, and a heat dissipation air channel of a rear chamber. A main air channel is a middle passing-through air flow channel located between a front chamber and the rear chamber of the inverter. An auxiliary air channel is located in the rear chamber of the inverter, and auxiliary heat dissipation air channels are formed from an air inlet to an air outlet and from the air inlet to an air exhaust groove of the cooling chamber. In order to meet the cooling requirement under a high-temperature environment, a fan is used for carrying out forced air cooling heat dissipation. Through the multiple air channel cooling method, the problems that when a traditional radiator method is used, heat cannot be dissipated sufficiently, and the temperature cannot be lowered sufficiently, so that the inverter is overheated to cause a failure and equipment accidents, or the service life of the inverter is shortened, and the like can be solved.

The invention relates to a high-power LED lamp which comprises a lamp cap, a heat radiating barrel, a heat-conducting insulating strip, a reflecting plate and an LED chip packaging support; the heat radiating barrel consists of metal sheets which are radially and vertically arranged into a circular barrel, wherein the upper parts and the lower parts of the inner cavities of the metal sheets are connected into a whole and metal sheets; the heat radiating barrel is connected with the lamp cap in a positioning manner, and gaps are formed among the metal sheets at the middle part of the inner cavity of the heat radiating barrel and are not mutually stuck together so as to be convenient for air convection for heat emission; a ferrule is fastened at the upper part of the outer wall of the heatradiating barrel, has the function of a chimney with air draught and further improves the heat radiating effect; and a heat-conducting base plate is fastened at the lower end of the inner cavity of the heat radiating barrel, the LED chip packaging support is installed in a slot opening where a base plate of the reflecting plate and the heat-conducting insulating strip with holes are mutually aligned, LED chips, and fluorescent powder for covering the LED chips and silica gel mixture are put in the LED chip packaging support, and the basal area of the coverage area of the fluorescent powder and the silica gel mixture is 10-30 times of the surface area of the LED chips, therefore, the luminescent efficiency and the reflecting efficiency can be greatly improved.