The utility model relates to a hot
pressboard capable of efficiently preventing
resonance of pins in a frame, and relates to the technical field of
chip bonding. The device comprises a heating block and a pressing plate, the pressing plate is positioned above the heating block; the heating block comprises at least two frame containing areas, and every two adjacent frame containing areas are attached to each other. The pressing plate is provided with an opening, and when the pressing plate makes contact with the heating block, the position of the opening corresponds to the at least two frame containing areas. The edge of the frame accommodating area has a dip angle; when the
hot pressing plate for efficiently preventing the
resonance of the pins in the frame is in a working state, the heating block is matched with the pressing plate, the frame accommodating area is used for accommodating a to-be-bonded
chip, and the pins of the to-be-bonded
chip are extruded by the inclination angles. In the
bonding process, through the design of the inclination angle in the frame accommodating area in the heating block, an
overpressure effect is generated on the pins of the to-be-bonded chip in the frame, and under the action of bonding ultrasonic
waves, the pins in the frame are not easy to slightly shake due to
resonance, so that lead crease and breakage abnormity caused by pin resonance are reduced.