60results about How to "Reduce space constraints" patented technology

A thin film transistor array substrate having a pixel arrangement structure includes a first sub-pixel for displaying a first color and a second sub-pixel for displaying a second color alternately located in a first column, and a third sub-pixel for displaying a third color in a second column adjacent to the first column, and via holes of the first through third sub-pixels in a same row are at different positions.

A combination aspiration / irrigation and illumination device using optical fibers circumferentially disposed around the aspiration conduit for transmitting illuminating light to a cavity to be aspirated. The aspiration conduit having a tip that is detachably affixed to and end of the aspiration conduit. The optical fibers terminated at a distance (d) from a distal end of the tip. Also provided is an image fiber(s) for transmitting image data from the distal end of the device.

A combination aspiration / irrigation and illumination device using optical fibers circumferentially disposed around the aspiration conduit for transmitting illuminating light to a cavity to be aspirated. The aspiration conduit having a tip that is detachably affixed to and end of the aspiration conduit. The optical fibers terminated at a distance (d) from a distal end of the tip. Also provided is an image fiber(s) for transmitting image data from the distal end of the device.

A method for attaching an integrated circuit chip to an organic substrate comprising the steps of providing an integrated circuit chip having an active and a passive surface, said active surface including a protective polymer layer; activating said polymer layer by exposing it to reactive ion etching plasma, thereby increasing the surface roughness and imparting affinity to adhesion; providing an electrically insulating substrate having first and second surfaces; and contacting said second surface of said substrate to said activated polymer layer on said chip, whereby strong adhesion is exerted at the interface between said layer and said substrate, directly attaching said substrate to said chip.

An image processing apparatus is provided. A silhouette extractor may extract a silhouette image of a target object from an input depth image. A first calculator may determine a location of at least one limb of the target object and a location of at least one joint connecting the at least one limb by applying a rectangle fitting algorithm with respect to the silhouette image.

A color calibration apparatus includes an image obtaining unit configured to obtain first and second photographed images which are generated by photographing first and second mono-color test images displayed on the display device; a controller configured to detect an ambient light area on which an ambient light is shining within the first photographed image based on pixel values of the first photographed image, and further configured to determine a remaining area of the first photographed image other than the ambient light area as a representative value calculating area; and an image processor configured to calculate a representative value based on pixel values of an area corresponding to the representative value calculating area within the second photographed image, and further configured to perform color calibration of the display device based on the representative value.

In a pattern-lock system of particle-beam apparatus wherein the imaging of the pattern is done by means of at least two consecutive projector stages of the projecting system, reference marks are imaged upon registering means to determine the position of the particle-beam, at the location of an intermediary image of the reference marks produced by a non-final projector stage, with the registering means being positioned at locations of nominal positions of an intermediary imaging plane. Furthermore, to produce a scanning movement over the registering means the reference beamlets are shifted laterally by means of deflector means provided in the pattern defining means in dependence of a time-dependent electric voltage.

A portable X-ray detector includes: a detection panel having an incident surface defined on a front surface thereof facing a generator and configured to generate an electrical signal for each position which is proportional to an incident amount of X-rays generated from the generator; a backing housing detachably fixed to a rear surface of the detection panel and having a sealed mounting space defined therein; and a communication module mounted in the mounting space and configured to wirelessly transmit the electrical signal generated from the detection panel.

An optical pickup actuator and optical disc drive using the same. The optical pickup actuator includes a blade holding an objective lens and supported on a base by a plurality of suspension wires so that it is elastically movable, a magnetic element positioned on the base, and a coil positioned horizontally on the blade to generate electromagnetic force in a focusing direction and / or a tilting direction through interaction with the magnetic element. The coil is divided into a plurality of subcoils separated vertically from one another.

The present invention provides composite shear wall and its construction process. The composite shear wall includes heat insulating core board and cross-linking steel bar network, and features that the bearing parts of the cross-linking steel bar network has one or several flat steel bar networks connected through hooks. The construction process of the composite shear wall includes the steps of: welding flat steel bar network; welding cross-linking steel bar network; hanging the bearing flat steel bar network; and in-situ casting concrete. The present invention has easy transportation, and the composite shear wall has high strength, high bearing capacity, convenient in-situ assembling and other advantages.

A method for attaching an integrated circuit chip to an organic substrate comprising the steps of providing an integrated circuit chip having an active and a passive surface, said active surface including a protective polymer layer; activating said polymer layer by exposing it to reactive ion etching plasma, thereby increasing the surface roughness and imparting affinity to adhesion; providing an electrically insulating substrate having first and second surfaces; and contacting said second surface of said substrate to said activated polymer layer on said chip, whereby strong adhesion is exerted at the interface between said layer and said substrate, directly attaching said substrate to said chip.

An electronic device includes a central processing unit (“CPU”), first and second display panels, and first and second display panel drivers. The CPU provides an image signal and an input control signal. The first and second display panels respectively display images. The first and second display panel drivers drive the first and second display panels according to the image signal and the input control signal. The CPU includes an interface transmission unit outputting an interface signal to control the first and second display panel drivers. The first and second display panel drivers respectively include first and second interface receiving units receiving the interface signal from the interface transmission unit. The interface signal includes a display panel selection bit and a data bit.

Systems and methods are described for a demand usable adapter memory access management. A method includes receiving a request to access a memory card address that lies outside a processor access range; scanning a data structure including a list of adapter memory segment offsets, each adapter memory segment offset associated with a memory adapter, for a suitable adapter memory segment offset; determining if a suitable adapter memory offset is available; converting the suitable adapter memory offset to a system address; and providing a processor with access to the suitable adapter memory offset via the system address. A method, includes scanning a data structure including a list of adapter memory segment offsets, each adapter memory segment offset associated with a memory adapter, for an empty entry; determining if an empty entry is available; providing access to the empty entry through a system address space; writing a new adapter memory segment offset into the list of adapter memory segment offsets at the empty entry; converting the new adapter memory segment offset to a system address; and providing a processor with access to the new adapter memory segment offset via the system address. A method, includes scanning a data structure including a list of adapter memory segment offsets, each adapter memory segment offset associated with a memory adapter, for a removable entry; determining if a removable entry is available; removing the removable entry from the list of adapter memory segment offsets, thus creating an empty entry; providing access to the empty entry through a system address space; writing a new adapter memory segment offset into the list of adapter memory segment offsets at the empty entry; converting the new adapter memory segment offset to a system address; and providing a processor with access to the new adapter memory segment offset via the system address. An apparatus includes a processor; a memory adapter, coupled to the processor; a memory coupled to the processor; and a data structure, stored in the memory, including a list of adapter memory segment offsets defining a first class of segment offsets and a second class of segment lengths.

Embodiments of the present disclosure relate to a micro display device and a display integrated circuit and, more specifically, to a micro display device and a display integrated circuit, which include: a pixel array chip including a pixel array zone in which a plurality of subpixels defined by a plurality of gate lines and a plurality of data lines are arranged, and a through-zone in which a plurality of through-electrodes connected to the plurality of gate lines and the plurality of data lines in an outer area of the pixel array zone are arranged; and a driver chip including a circuit zone in which a driver circuit configured to drive the plurality of gate lines and the plurality of data lines through the plurality of through-electrodes is disposed, and thus have a high yield.

A multi-status key panel (10) includes a panel (12) which defines at least one hole (14) and at least one multi-status key (20) which includes a key top (21). The key top has a sign area (22) with at least one sign marked on a surface thereof and a multi-status connector (25) provided at a bottom of the key top. The multi-status connector is for connecting with a PCB (30) (printed circuit board). The operation of the multi-status key panel is convenient and easy. In addition, the layout of each key can reduce the space limitations, so the multi-status key panel can be used in desirable miniaturization of devices such as mobile phones.

A robust, reliable and low-cost metal structure and process enabling electrical wire / ribbon connections to the interconnecting copper metallization of integrated circuits. The structure comprises a layer of barrier metal that resists copper diffusion, deposited on the non-oxidized copper surface in a thickness such that the barrier layer reduces the diffusion of copper at 250° C. by more than 80% compared with the absence of the barrier metal. The structure further comprises an outermost bondable layer which reduces the diffusion of the barrier metal at 250° C. by more than 80% compared with the absence of the bondable metal. Finally, a metal wire is bonded to the outermost layer for metallurgical connection. The barrier metal is selected from a group consisting of nickel, cobalt, chromium, molybdenum, titanium, tungsten, and alloys thereof. The outermost bondable metal layer is selected from a group consisting of gold, platinum, and silver.

A natural lighting system tracks natural light or sunlight, effectively draws the light, distributes the light to necessary places, and sequentially scans the light on the scanning area. The natural lighting system collects the sunlight and then reflects the collected sunlight to a target scanning area based on a sequential scanning mode, and includes at least one reflector disposed according to an optimum control angle for collecting the sunlight, and a sequential scanning drive continuously adjusting the reflector so as to allow the sunlight transferred from the reflector to be sequentially scanned on the target scanning area.

A method and an apparatus for uniform electroless plating of layers onto exposed metallizations in integrated circuits such as bond pads. The apparatus provides means for holding a plurality of wafers, and rotating each wafer at constant speed and synchronous within the plurality. Immersed in a plating solution flowing in substantially laminar motion and at constant speed, the method creates periodic superposition of directions and speeds of the motion of the wafers and the motion of the plating solution. The invention creates periodically changing wafer portions where the directions and speeds are additive and where the directions and speeds are opposed and subtractive. Consequently, highly uniformly layers are electrolessly plated onto the exposed metallizations of bond pads. If the plated layers are bondable metals, the process transforms otherwise unbondable pad metallization into bondable pads.

An image processing apparatus is provided. A silhouette extractor may extract a silhouette image of a target object from an input depth image. A first calculator may determine a location of at least one limb of the target object and a location of at least one joint connecting the at least one limb by applying a rectangle fitting algorithm with respect to the silhouette image.

The invention discloses an industrial robot arm joint cutting system. The cutting system comprises a mechanical hand, a transmission arm and a switching assembly, a base is arranged below the mechanical hand, the transmission arm is arranged in the mechanical hand, the switching assembly is arranged at the execution tail end of the mechanical hand, and multiple sets of reflectors are arranged in the transmission arm. The transmission arm changes the transmission direction of the optical path, and the switching assembly conducts switching on an end effector. The arm of the mechanical hand is ofa hollow structure, and therefore the weight of the arm is greatly reduced, the influence of inertia on the motion of the mechanical hand is reduced, and the positioning precision and the cutting precision of the mechanical hand are improved.