2results about How to "Reduce acquisition error" patented technology

This application relates to a UAV frame for bridge inspection, belonging to the technical field of UAVs. It includes a UAV body with a connecting frame at its bottom. This application utilizes a plug-in engagement between a plug and the connecting frame, and a limiting block driven by a push spring in a snap-fit ​​assembly to achieve automatic initial positioning. Simultaneously, a bidirectional lead screw driven by a first servo motor in the limiting assembly drives a moving frame and its locking block for a secure secondary locking. This significantly simplifies the installation and disassembly process of the UAV body and the connecting frame. Furthermore, a buffer assembly located on the outside of the connecting frame, with its support plate sliding within the damping sleeve of the support leg via a slide rod, compresses the buffer spring. This effectively absorbs and dissipates the impact energy generated during UAV takeoff and landing or sudden collisions, maximizing the protection of the precision components inside the UAV body and the shooting and detection devices within the mounting frame. This significantly reduces data acquisition errors and improves operational safety and data reliability.

The application discloses a kind of electric core connecting system and battery, belong to battery technical field, the electric core connecting system, comprising: wiring harness, busbar, voltage acquisition component and temperature acquisition component, wiring harness is suitable for with battery management system electric connection, busbar is suitable for electric connection multiple electric cores, voltage acquisition component is electrically connected with wiring harness and busbar respectively, voltage acquisition component collects the voltage of electric core by busbar, temperature acquisition component includes first circuit board and temperature sensor, in temperature acquisition component, the first heat conduction area of first circuit board can be directly contacted with electric core by its corresponding heat conduction material, the heat of electric core can be transferred to temperature sensor along first heat conduction area, heat conduction hole and second heat conduction area by heat conduction material, can improve the accuracy that temperature sensor acquires electric core temperature, reduce the acquisition error of temperature acquisition component.