This invention provides a packaging method, apparatus, and storage medium suitable for
baseband modulation and
encryption circuits. It relates to
data processing technology, which involves feature
processing of a substrate image corresponding to a circuit board to identify abnormal components located on the circuit board and determine the type of
abnormality for each component. Based on the substrate image, it identifies an identification region with an
abnormality identification relationship to each abnormal component and forms a pointing identifier based on the identification region. Furthermore, during the identification process, it analyzes the data in a circuit component
database for any component, solder joint, pin
interconnection relationship, pin surface features, and structural features. This invention, based on image recognition and
big data technologies, offers advantages such as high packaging efficiency, high accuracy, and high
yield rate during the packaging process, meeting the packaging characteristics of
baseband modulation and
encryption circuits and ensuring
high bandwidth and good
encryption during later use.