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32results about How to "Small height change" patented technology

High reflective object surface light field deflection technique measuring system and method

The invention relates to a high reflective object surface light field deflection technique measuring system and method, and is used for three-dimensional reconstruction of the high reflective object surface, the system adopts a light ray reflection principle to acquire normal information of the high reflective object surface and curved surface information, the system is projected by the light field, and the system is sensed through the light ray. The correspondence of an incident ray and a reflection ray are determined through a phase retrieval method, and 3D points on the to-be-detected object surface are calculated. According to the invention, compared with the common phase deflection technique, the system and the method does not have non-unique normal problem, and in light field camera mode, the system has higher response characteristics for object surface height variation, can get higher measuring precision and can fill the blank of domestic and overseas deflection technique measuring system based on light field.
Owner:SHANGHAI UNIV

Swing spray gun and water jet equipment

The invention provides a swing spray gun and water jet equipment. The swing spray gun comprises a base, a bearing seat, a jet pipe and a third driving device, wherein the bearing seat is driven by a second driving device to rotate around a first axis relative to the base; the jet pipe is rotatably mounted on the bearing seat around a second axis, the top end of the jet pipe is connected with a high-pressure water source, and a nozzle located at the bottom of the jet pipe faces the layer to be treated; and third driving device is installed on the bearing seat, an eccentric structure is arrangedon an output shaft parallel to the second axis, an eccentric protrusion of the eccentric structure is hinged to a connecting rod, the other end of the connecting rod is hinged to the jet pipe, and the hinged position and the second axis position are arranged at intervals by a set distance to form a crank-rocker mechanism. According to the design, swing amplitude of the nozzle can be increased firstly, and then the working efficiency of the jet pipe during a single stroke can be increased; secondly, the same swing amplitude requires less driving force and prolongs the service life of the thirddriving device; and in addition, an injection pipe returns to the initial position in the non-working state without shaking, and the performance and reliability of the device are ensured.
Owner:CITIC HEAVY INDUSTRIES CO LTD

Refrigeration tool with door hinge assembly

ActiveCN103836874AReduces the possibility of accidental rotationSmall height changeLighting and heating apparatusWing accessoriesRefrigerationHinge angle
The invention relates to a refrigeration tool. The refrigeration tool comprises a body, a door and a hinge assembly, wherein the hinge assembly can rotate around the rotating axis, is connected to the door and the body and comprises a regulating part (3), a second thread part (41) and a horizontal wall (23). The regulating part is used for regulating the height of the door relative to the body and provided with a first thread part (31) and an end wall (36) which is at least approximately parallel to the horizontal plane. When the regulating part (3) rotates around the rotating axis, one of the first thread part and the second thread part can move in the vertical direction along the other of the first thread part and the second thread part. At least a part of one of the horizontal wall and the end wall (36) is located on the other of the horizontal wall and the end wall. According to the scheme, one of the end wall and the horizontal wall is provided with at least one concave part (25), the other of the end wall and the horizontal wall is provided with at least one convex part (35), and each convex part (35) selectively drops into or being moved out of the at least one concave part.
Owner:BSH ELECTRICAL APPLIANCES JIANGSU

Vibrating device for forming of ceramic structural components

The invention relates to the technical filed of ceramic machining, and discloses a vibrating device for forming of ceramic structural components. The vibrating device comprises a bottom plate; supporting columns are arranged on the left and right sides of the upper surface of the bottom plate; a mounting plate is arranged at the upper parts of the supporting columns; through holes are formed in the left and right sides of the mounting plate; guiding rods are connected in the middles of the through holes in a penetrating manner; a supporting plate is arranged at the upper ends of the guiding rods; a driving motor is arranged in the middle of the bottom plate; an output shaft of the driving motor is fixedly connected with a first belt pulley; the first belt pulley is connected with a secondbelt pulley through a first belt; the second belt pulley is fixedly connected in the middle of a spindle; third belt pulleys are arranged on the front and back sides of the spindle; the third belt pulleys are connected with fourth belt pulleys through second belts; the fourth belt pulleys are fixedly connected with the front and back ends of rotating shafts; and cams are arranged in the middles ofthe rotating shafts. The invention is applicable to the vibrating device for forming of the ceramic structural components. One driving motor is arranged to drive the three rotating shafts to rotate simultaneously, so that the three cams begins to rotate simultaneously, and the contact frequency between the cams and the supporting plate is increased.
Owner:淄博松阳锆业科技有限公司

Manufacturing method of wafer level package structure

A manufacturing method of a wafer level package structure includes the following steps. A chip is disposed on a supporting board, wherein the chip includes an active surface and a back surface opposite to the active surface, and a plurality of pads on the active surface, and the back surface of the chip is adhered to the supporting board through a die attach film (DAF). A molding is disposed on the supporting board to perform a wafer level exposed die molding procedure on the chip, wherein the molding surrounds the chip, and the pads of the chip are exposed out of the molding. A redistribution layer (RDL) is formed on the active surface of the chip, wherein the RDL is electrically connected to the pads. The supporting board and the DAF are removed from the chip.
Owner:POWERTECH TECHNOLOGY

Self-reset friction damping shock mount and damping bridge

ActiveCN107268431AGuaranteed normal functioningExtend the basic natural vibration periodBridge structural detailsHysteresisShock mount
The invention discloses a self-reset friction damping shock mount and a damping bridge, and relates to the technical field of damping. The self-reset friction damping shock mount comprises a first mount plate, a second mount plate, a supporting face plate, a friction piece, a first damping piece and a second damping piece. The first mount plate is connected with the supporting face plate. The two ends of the friction piece are connected with the end, away from the first mount plate, of the supporting face plate and the second mount plate respectively. The friction piece can slide relative to the supporting face plate and the second mount plate for friction energy consumption and damping. The two ends of the first damping piece are connected with the friction piece and the supporting face plate respectively. The two ends of the second damping piece are connected with the friction piece and the second mount plate respectively. Damping and resetting of the two damping pieces are realized through damping hysteresis. The invention further provides the damping bridge. The self-reset friction damping shock mount and the damping bridge are simple in structure, horizontal energy consumption and reset capacity can be effectively improved, and the mechanical structure of the bridge is not influenced.
Owner:SICHUAN UNIV

Low-speed damping mechanism of deceleration strip

The invention relates to the technical field of traffic safety, and discloses a low-speed damping mechanism of a deceleration strip, the low-speed damping mechanism comprises a shell, the upper end of an inner cavity of the shell is movably sleeved with a movable block, the cross section of the movable block is T-shaped, and the lower end of the movable block is provided with a first movable cavity. By arranging the low-speed damping mechanism, when a vehicle passes through the deceleration strip at a low speed, after a tire is pressed on the upper surface of the movable block, air at the lower end of the movable block moves downwards into the air cavity through the vent hole when the movable block overcomes the elastic force of the first spring, so that the movable block moves downwards by a certain distance; therefore, the gradient of the deceleration strip on the road surface is reduced, the vibration amplitude is small when a vehicle with a low speed passes through the deceleration strip, and when the vehicle passes through the deceleration strip at a high speed, air at the lower end of the movable block cannot quickly move into the air cavity due to the small hole diameter of the vent hole, so that the height change amplitude of the movable block is small. Therefore, the effect of warning deceleration is achieved.
Owner:淮北平坤锂电池科技有限公司

Tin alloy electroplating solution for solder bumps including perfluoroalkyl surfactant

Disclosed is a tin-based electroplating solution for forming solder bumps of a flip chip package. The tin-based electroplating solution includes tin methanesulfonate, silver methanesulfonate, methanesulfonic acid, a fluorinated surfactant, an aromatic polyoxyalkylene ether, and water. Also disclosed is a method for forming solder bumps by using the electroplating solution. The method includes (1) electroplating a silicon wafer having a protective layer through which an electrode pad is exposed and an under bump metallurgy (UBM) layer with a copper or copper / nickel plating solution to form copper or copper / nickel pillars on the under bump metallurgy layer and (2) electroplating the pillars with the tin-based electroplating solution to form solder bumps.
Owner:APCT

Automatic control welding platform for coaxial cable and 2M joint

The invention discloses an automatic control welding platform for a coaxial cable and a 2M joint and belongs to the technical field of circuit welding equipment. The automatic control welding platformfor the coaxial cable and the 2M joint comprises a machine table, a servo guide rail, a movable seat, a clamp seat, 2M elastic clamps, coaxial cable clamps, a support frame, extending-and-contractingarms, a welding mechanism and a structured light locating and distance measurement mechanism. The machine table is provided with the servo guide rail. The movable seat is arranged on the servo guiderail in a sliding manner. The clamp seat is detachably fixed to the movable seat and provided with the 2M elastic clamps and the coaxial cable clamps. The support frame is fixed to the machine table and provided with the two extending-and-contracting arms. The two extending-and-contracting arms are connected with the welding mechanism and the structured light locating and distance measurement mechanism correspondingly. The automatic control welding platform for the coaxial cable and the 2M joint has the beneficial effects that welding precision and welding efficiency are high, operation is convenient to conduct, and the automatic control welding platform is applicable to massive coaxial cable and 2M joint welding.
Owner:STATE GRID SHANDONG ELECTRIC POWER +1

A swinging spray gun and water jet equipment

The invention provides a swing spray gun and water jet equipment. The swing spray gun comprises a base, a bearing seat, a jet pipe and a third driving device, wherein the bearing seat is driven by a second driving device to rotate around a first axis relative to the base; the jet pipe is rotatably mounted on the bearing seat around a second axis, the top end of the jet pipe is connected with a high-pressure water source, and a nozzle located at the bottom of the jet pipe faces the layer to be treated; and third driving device is installed on the bearing seat, an eccentric structure is arrangedon an output shaft parallel to the second axis, an eccentric protrusion of the eccentric structure is hinged to a connecting rod, the other end of the connecting rod is hinged to the jet pipe, and the hinged position and the second axis position are arranged at intervals by a set distance to form a crank-rocker mechanism. According to the design, swing amplitude of the nozzle can be increased firstly, and then the working efficiency of the jet pipe during a single stroke can be increased; secondly, the same swing amplitude requires less driving force and prolongs the service life of the thirddriving device; and in addition, an injection pipe returns to the initial position in the non-working state without shaking, and the performance and reliability of the device are ensured.
Owner:CITIC HEAVY INDUSTRIES CO LTD
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