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32results about How to "Small height change" patented technology

Coreless packaging substrate and method for fabricating the same

A coreless packaging substrate includes: a substrate body including an auxiliary dielectric layer having opposing first and second surfaces, an inner wiring formed on the second surface, and a built-up structure formed on both the second surface of the auxiliary dielectric layer and the inner wiring; and a plurality of conductive bumps including metal pillars having opposing first and second ends and a solder layer formed on the first end, wherein the second ends of the metal pillars are disposed in the auxiliary dielectric layer and electrically connecting with the inner wiring, and the first ends of the metal pillars with the solder layer protrude from the first surface of the auxiliary dielectric layer, thereby achieving ultra-fine pitch and even-height conductive bumps. A method for fabricating the coreless packaging substrate as described above is further provided.
Owner:UNIMICRON TECH CORP

Geosynchronous orbit circular track SAR imaging method using beam pointing control

The invention belongs to the technical field of synthetic aperture radar and particularly relates to a geosynchronous orbit circular track SAR imaging method using beam pointing control. By using such a method, a circular track geosynchronous satellite having a 8-shaped sub satellite point locus is taken as a radar platform, 12 hours corresponding to the half 8 shape where an object to be observed is arranged are regarded as an imaging period, the two-dimension antenna wave beam directional control is carried out in the imaging period by means of a stepping technique, so that the satellite can be in the corresponding movement process of the half 8-shaped sub satellite point locus, the antenna wave beam can always point to the imaged ground object to be observed, the 360-degree relative movement of radar relative to the object is formed, and the circular track SAR imaging based on the geosynchronous orbit satellite platform is realized.
Owner:INST OF ELECTRONICS CHINESE ACAD OF SCI

Coreless packaging substrate and method for fabricating the same

A coreless packaging substrate includes: a substrate body including an auxiliary dielectric layer having opposing first and second surfaces, an inner wiring formed on the second surface, and a built-up structure formed on both the second surface of the auxiliary dielectric layer and the inner wiring; and a plurality of conductive bumps including metal pillars having opposing first and second ends and a solder layer formed on the first end, wherein the second ends of the metal pillars are disposed in the auxiliary dielectric layer and electrically connecting with the inner wiring, and the first ends of the metal pillars with the solder layer protrude from the first surface of the auxiliary dielectric layer, thereby achieving ultra-fine pitch and even-height conductive bumps. A method for fabricating the coreless packaging substrate as described above is further provided.
Owner:UNIMICRON TECH CORP

Method and device for attenuating on an aircraft the effects of a vertical turbulence

The invention concerns a device (1) comprising means (4) for determining automatically, using a vertical wind component, a level of severity concerning a vertical turbulence, and means (5) for computing automatically, using said vertical wind component, a control instruction for a controllable member (2), which enables the amplitude of load factors generated on the aircraft by the vertical turbulence to be minimized.
Owner:AIRBUS OPERATIONS (SAS)

High reflective object surface light field deflection technique measuring system and method

The invention relates to a high reflective object surface light field deflection technique measuring system and method, and is used for three-dimensional reconstruction of the high reflective object surface, the system adopts a light ray reflection principle to acquire normal information of the high reflective object surface and curved surface information, the system is projected by the light field, and the system is sensed through the light ray. The correspondence of an incident ray and a reflection ray are determined through a phase retrieval method, and 3D points on the to-be-detected object surface are calculated. According to the invention, compared with the common phase deflection technique, the system and the method does not have non-unique normal problem, and in light field camera mode, the system has higher response characteristics for object surface height variation, can get higher measuring precision and can fill the blank of domestic and overseas deflection technique measuring system based on light field.
Owner:SHANGHAI UNIV

Method for Forming Carbonaceous Material Protrusion and Carbonaceous Material Protrusion

This method of forming a carbonaceous material projection structure includes: the step of applying a resist 11 onto a diamond substrate 10; the step of forming holes 12 in the applied resist 11, the holes 12 being provided according to a predetermined arrangement, a wall 12b of each of the holes 12 being inversely tapered from an aperture 12a toward a bottom; the step of depositing a mask material through the aperture 12a to form a mask deposition 14 in each of the holes 12; the step of lifting off a mask material 13 deposited on the resist 11 together with the resist 11; and etching the diamond substrate 10 using the mask deposition 14 as a mask to form a carbonaceous material projection.
Owner:SUMITOMO ELECTRIC IND LTD

Swing spray gun and water jet equipment

The invention provides a swing spray gun and water jet equipment. The swing spray gun comprises a base, a bearing seat, a jet pipe and a third driving device, wherein the bearing seat is driven by a second driving device to rotate around a first axis relative to the base; the jet pipe is rotatably mounted on the bearing seat around a second axis, the top end of the jet pipe is connected with a high-pressure water source, and a nozzle located at the bottom of the jet pipe faces the layer to be treated; and third driving device is installed on the bearing seat, an eccentric structure is arrangedon an output shaft parallel to the second axis, an eccentric protrusion of the eccentric structure is hinged to a connecting rod, the other end of the connecting rod is hinged to the jet pipe, and the hinged position and the second axis position are arranged at intervals by a set distance to form a crank-rocker mechanism. According to the design, swing amplitude of the nozzle can be increased firstly, and then the working efficiency of the jet pipe during a single stroke can be increased; secondly, the same swing amplitude requires less driving force and prolongs the service life of the thirddriving device; and in addition, an injection pipe returns to the initial position in the non-working state without shaking, and the performance and reliability of the device are ensured.
Owner:CITIC HEAVY INDUSTRIES CO LTD

Method of Manufacturing Lapping Plate, and Method of Manufacturing Magnetic Head Slider using the Lapping Plate

InactiveUS20110239444A1Large abrasive grain heightSmall height variationElectrical transducersHeads using thin filmsMetallurgyAir bearing surface
A method of manufacturing a lapping plate which has abrasive grains fixed in the plate and which is used for lapping of the air bearing surface of a magnetic head. Abrasive grains fixed in the lapping plate are subjected to an abrasive digging process to selectively lap the surface of the lapping plate in the vicinity of the abrasive grains, and the dug abrasive grains are subjected to an equalization process to make their abrasive grain heights equal.
Owner:HITACHI LTD

Refrigeration tool with door hinge assembly

ActiveCN103836874AReduces the possibility of accidental rotationSmall height changeLighting and heating apparatusWing accessoriesRefrigerationHinge angle
The invention relates to a refrigeration tool. The refrigeration tool comprises a body, a door and a hinge assembly, wherein the hinge assembly can rotate around the rotating axis, is connected to the door and the body and comprises a regulating part (3), a second thread part (41) and a horizontal wall (23). The regulating part is used for regulating the height of the door relative to the body and provided with a first thread part (31) and an end wall (36) which is at least approximately parallel to the horizontal plane. When the regulating part (3) rotates around the rotating axis, one of the first thread part and the second thread part can move in the vertical direction along the other of the first thread part and the second thread part. At least a part of one of the horizontal wall and the end wall (36) is located on the other of the horizontal wall and the end wall. According to the scheme, one of the end wall and the horizontal wall is provided with at least one concave part (25), the other of the end wall and the horizontal wall is provided with at least one convex part (35), and each convex part (35) selectively drops into or being moved out of the at least one concave part.
Owner:BSH ELECTRICAL APPLIANCES JIANGSU

Vibrating device for forming of ceramic structural components

The invention relates to the technical filed of ceramic machining, and discloses a vibrating device for forming of ceramic structural components. The vibrating device comprises a bottom plate; supporting columns are arranged on the left and right sides of the upper surface of the bottom plate; a mounting plate is arranged at the upper parts of the supporting columns; through holes are formed in the left and right sides of the mounting plate; guiding rods are connected in the middles of the through holes in a penetrating manner; a supporting plate is arranged at the upper ends of the guiding rods; a driving motor is arranged in the middle of the bottom plate; an output shaft of the driving motor is fixedly connected with a first belt pulley; the first belt pulley is connected with a secondbelt pulley through a first belt; the second belt pulley is fixedly connected in the middle of a spindle; third belt pulleys are arranged on the front and back sides of the spindle; the third belt pulleys are connected with fourth belt pulleys through second belts; the fourth belt pulleys are fixedly connected with the front and back ends of rotating shafts; and cams are arranged in the middles ofthe rotating shafts. The invention is applicable to the vibrating device for forming of the ceramic structural components. One driving motor is arranged to drive the three rotating shafts to rotate simultaneously, so that the three cams begins to rotate simultaneously, and the contact frequency between the cams and the supporting plate is increased.
Owner:淄博松阳锆业科技有限公司

Manufacturing method of wafer level package structure

A manufacturing method of a wafer level package structure includes the following steps. A chip is disposed on a supporting board, wherein the chip includes an active surface and a back surface opposite to the active surface, and a plurality of pads on the active surface, and the back surface of the chip is adhered to the supporting board through a die attach film (DAF). A molding is disposed on the supporting board to perform a wafer level exposed die molding procedure on the chip, wherein the molding surrounds the chip, and the pads of the chip are exposed out of the molding. A redistribution layer (RDL) is formed on the active surface of the chip, wherein the RDL is electrically connected to the pads. The supporting board and the DAF are removed from the chip.
Owner:POWERTECH TECHNOLOGY

Self-reset friction damping shock mount and damping bridge

ActiveCN107268431AGuaranteed normal functioningExtend the basic natural vibration periodBridge structural detailsHysteresisShock mount
The invention discloses a self-reset friction damping shock mount and a damping bridge, and relates to the technical field of damping. The self-reset friction damping shock mount comprises a first mount plate, a second mount plate, a supporting face plate, a friction piece, a first damping piece and a second damping piece. The first mount plate is connected with the supporting face plate. The two ends of the friction piece are connected with the end, away from the first mount plate, of the supporting face plate and the second mount plate respectively. The friction piece can slide relative to the supporting face plate and the second mount plate for friction energy consumption and damping. The two ends of the first damping piece are connected with the friction piece and the supporting face plate respectively. The two ends of the second damping piece are connected with the friction piece and the second mount plate respectively. Damping and resetting of the two damping pieces are realized through damping hysteresis. The invention further provides the damping bridge. The self-reset friction damping shock mount and the damping bridge are simple in structure, horizontal energy consumption and reset capacity can be effectively improved, and the mechanical structure of the bridge is not influenced.
Owner:SICHUAN UNIV

Automatic foot path

The pallet 6 moving substantially horizontally to convey a passenger is composed of ordinary color pallets 6A and colored pallets 6B arranged at a predetermined interval. A height position of a substantially horizontal main moving road surface P of the pallet 6 is substantially the same as a height position of a top face of a getting-on-and-off floor 4 upper face or is slightly higher than the latter position. An inclined road surface Q on which a getting-on-and-off floor 4 side is lower than the main moving road surface P is provided in a part where the pallet 6 comes in and out of the getting-on-and-off floor 4. An inclined floor surface 4B which is continuous with the inclined road surface Q and on which an anti-pallet side becomes low is provided on the getting-on-and-off floor 4. To provide a moving sidewalk allowing a passenger, in particular, a wheelchair user to move smoothly between a pallet and a floor side and capable of easily determining operation of the pallet and reducing thickness of a device.
Owner:HITACHI LTD

Low-speed damping mechanism of deceleration strip

The invention relates to the technical field of traffic safety, and discloses a low-speed damping mechanism of a deceleration strip, the low-speed damping mechanism comprises a shell, the upper end of an inner cavity of the shell is movably sleeved with a movable block, the cross section of the movable block is T-shaped, and the lower end of the movable block is provided with a first movable cavity. By arranging the low-speed damping mechanism, when a vehicle passes through the deceleration strip at a low speed, after a tire is pressed on the upper surface of the movable block, air at the lower end of the movable block moves downwards into the air cavity through the vent hole when the movable block overcomes the elastic force of the first spring, so that the movable block moves downwards by a certain distance; therefore, the gradient of the deceleration strip on the road surface is reduced, the vibration amplitude is small when a vehicle with a low speed passes through the deceleration strip, and when the vehicle passes through the deceleration strip at a high speed, air at the lower end of the movable block cannot quickly move into the air cavity due to the small hole diameter of the vent hole, so that the height change amplitude of the movable block is small. Therefore, the effect of warning deceleration is achieved.
Owner:淮北平坤锂电池科技有限公司

Tin alloy electroplating solution for solder bumps including perfluoroalkyl surfactant

Disclosed is a tin-based electroplating solution for forming solder bumps of a flip chip package. The tin-based electroplating solution includes tin methanesulfonate, silver methanesulfonate, methanesulfonic acid, a fluorinated surfactant, an aromatic polyoxyalkylene ether, and water. Also disclosed is a method for forming solder bumps by using the electroplating solution. The method includes (1) electroplating a silicon wafer having a protective layer through which an electrode pad is exposed and an under bump metallurgy (UBM) layer with a copper or copper / nickel plating solution to form copper or copper / nickel pillars on the under bump metallurgy layer and (2) electroplating the pillars with the tin-based electroplating solution to form solder bumps.
Owner:APCT

Automatic control welding platform for coaxial cable and 2M joint

The invention discloses an automatic control welding platform for a coaxial cable and a 2M joint and belongs to the technical field of circuit welding equipment. The automatic control welding platformfor the coaxial cable and the 2M joint comprises a machine table, a servo guide rail, a movable seat, a clamp seat, 2M elastic clamps, coaxial cable clamps, a support frame, extending-and-contractingarms, a welding mechanism and a structured light locating and distance measurement mechanism. The machine table is provided with the servo guide rail. The movable seat is arranged on the servo guiderail in a sliding manner. The clamp seat is detachably fixed to the movable seat and provided with the 2M elastic clamps and the coaxial cable clamps. The support frame is fixed to the machine table and provided with the two extending-and-contracting arms. The two extending-and-contracting arms are connected with the welding mechanism and the structured light locating and distance measurement mechanism correspondingly. The automatic control welding platform for the coaxial cable and the 2M joint has the beneficial effects that welding precision and welding efficiency are high, operation is convenient to conduct, and the automatic control welding platform is applicable to massive coaxial cable and 2M joint welding.
Owner:STATE GRID SHANDONG ELECTRIC POWER +1

Adjustable safety seat

The invention discloses an adjustable safety seat which comprises a safety seat main body, a headrest and an adjustable backrest; the headrest is fixedly connected to the top of the safety seat main body; the adjustable backrest is fixedly connected to the bottom of the headrest; an adjusting rod is fixedly connected to one side of the interior of the adjustable backrest; fixing wheels are fixedlyconnected to the middle part of the adjusting rod; fixed teeth are fixedly connected to one side of the adjusting rod; connecting belts are movably connected to one side of the interior of the adjustable backrest; and a heating pipe is fixedly connected to the middle part of the interior of the adjustable backrest. The heating pipe can heat the seat for a user to improve the use feeling of the user in winter, an pneumatic pump can perform inflation and exhaust on an air bag to improve the safety of the seat, and the adjustable backrest enables the user to freely adjust a height and an angle of the seat to greatly satisfy the use feeling of the user, so that the adjustable safety seat is convenient to use, high in safety and suitable for the field of automobile accessories and has a wide development prospect in the future.
Owner:诸暨市领跑管理咨询事务所

A kind of method of making finfet semiconductor device

The invention relates to a method for manufacturing a FinFET semiconductor device. The method includes the following steps: providing a semiconductor substrate; forming a hard mask layer with a shallow groove pattern on the semiconductor substrate; etching the semiconductor substrate so as to form shallow grooves and fins between the shallow grooves; depositing a first oxide layer on the semiconductor substrate so as to fill the shallow grooves partly; depositing a groove stop layer on the first oxide layer; depositing a second oxide layer on the groove stop layer; executing a first flattening step and stopping at the groove stop layer at the tops of the fins; executing a second flattening step and stopping at the hard mask layer; and back-etching the second oxide layer in the shallow grooves so as to expose the groove stop layer in the shallow grooves. According to the method, the technology change of back-etching of the oxide layers can be well controlled.
Owner:SEMICON MFG INT (SHANGHAI) CORP

An automatic following obstacle-crossing vehicle

The invention provides an automatic-following obstacle crossing vehicle comprising at least one inner planet type compound gear train unit. Each inner planet type compound gear train unit comprises an inner gear ring, a main bearing wheel, and a power device. The inner gear rings are arranged on the inner surfaces of tires, and the inner gear rings and the tires rotate in the same speed; the main bearing wheels are provided with gears engaged with the inner gear rings coaxially and can slide around the inner surfaces of the tires in a rolling mode; the power devices are used for driving force transmitting mechanisms and transmitting the rotating force to the main bearing wheels and the gears; and the main bearing wheels and the gears are connected with exterior loads through pin shafts. The automatic-following obstacle crossing vehicle can effectively cross an obstacle with the loads, the requirement for the pavement condition in the carrying process is low, the load weight is high, and excellent performance is achieved.
Owner:玄智(深圳)科技有限公司

Gravity loading mechanism of high pressure extrusion mill

InactiveCN103691519ASmall height changeAvoid Response LagGrain treatmentsHigh pressureWire rope
The invention discloses a gravity loading mechanism of a high pressure extrusion mill. The gravity loading mechanism comprises a heavy loading block, a wire rope connected with the heavy loading block, a bracket used for supporting the wire rope to suspend the heavy loading block, and a buffering device arranged on the top of the bracket, wherein the wire rope bypasses the buffering device to buffer the height change of the heavy loading block caused by retreat of the a buffering roller. The integral function of the gravity loading mechanism of high pressure extrusion mill disclosed by the invention is similar to that of a hydraulic loading mechanism of a high pressure double-roller extrusion mill in the prior art, however, the integral system damp of the gravity loading mechanism provided by the invention is smaller than that of the hydraulic loading mechanism, so that the response speed can be greatly improved.
Owner:铜陵迈臣机电科技有限责任公司

A swinging spray gun and water jet equipment

The invention provides a swing spray gun and water jet equipment. The swing spray gun comprises a base, a bearing seat, a jet pipe and a third driving device, wherein the bearing seat is driven by a second driving device to rotate around a first axis relative to the base; the jet pipe is rotatably mounted on the bearing seat around a second axis, the top end of the jet pipe is connected with a high-pressure water source, and a nozzle located at the bottom of the jet pipe faces the layer to be treated; and third driving device is installed on the bearing seat, an eccentric structure is arrangedon an output shaft parallel to the second axis, an eccentric protrusion of the eccentric structure is hinged to a connecting rod, the other end of the connecting rod is hinged to the jet pipe, and the hinged position and the second axis position are arranged at intervals by a set distance to form a crank-rocker mechanism. According to the design, swing amplitude of the nozzle can be increased firstly, and then the working efficiency of the jet pipe during a single stroke can be increased; secondly, the same swing amplitude requires less driving force and prolongs the service life of the thirddriving device; and in addition, an injection pipe returns to the initial position in the non-working state without shaking, and the performance and reliability of the device are ensured.
Owner:CITIC HEAVY INDUSTRIES CO LTD

Tin alloy electroplating solution for solder bumps including perfluoroalkyl surfactant

Disclosed is a tin-based electroplating solution for forming solder bumps of a flip chip package. The tin-based electroplating solution includes tin methanesulfonate, silver methanesulfonate, methanesulfonic acid, a fluorinated surfactant, an aromatic polyoxyalkylene ether, and water. Also disclosed is a method for forming solder bumps by using the electroplating solution. The method includes (1) electroplating a silicon wafer having a protective layer through which an electrode pad is exposed and an under bump metallurgy (UBM) layer with a copper or copper / nickel plating solution to form copper or copper / nickel pillars on the under bump metallurgy layer and (2) electroplating the pillars with the tin-based electroplating solution to form solder bumps.
Owner:APCT

Tendon pulling plate for ankle pump movement

The invention provides an ankle pump movement tendon stretching plate which comprises a base, auxiliary supporting pieces are arranged on the two sides of the base, and an arc groove is formed in each auxiliary supporting piece; the arc surfaces of the cylindrical surface supporting pieces are in relative sliding connection with the arc grooves in the auxiliary supporting pieces; and the two pedals are fixedly connected with the two cylindrical surface supporting pieces correspondingly, and the rotation centers of the pedals are located in the middle positions of the pedals. According to the muscle and ligament state of a user, the muscle stretching angle can be automatically adjusted, the situation that the muscle stretching angle of the user is too large, and consequently the muscle is pulled is avoided, and the functions that the muscle stretching angle is controllable, muscle stretching is conducted on the two legs respectively, and ankle pump movement is conducted are achieved.
Owner:合肥辩日医疗科技有限公司
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