4results about How to "Solve signal attenuation" patented technology

The invention belongs to the technical field of mobile communication, and particularly discloses a communication and sensing integrated RIS intelligent coverage optimization system and method, and the system comprises an intelligent cooperative control center, a train signal terminal disposed on a train, a plurality of 6G communication and sensing integrated base stations disposed at intervals along a train route, and a plurality of RIS array modules disposed at intervals along the train route. Through collaborative optimization of the 6G communication and induction integrated base station and the RIS array, a 6G signal propagation path can be accurately remodeled, the problem of signal attenuation in a weak coverage area is effectively solved, the 6G signal receiving power of a train is improved, and continuous coverage of 6G high-bandwidth services is guaranteed; doppler frequency shift can be accurately offset through dynamic phase adjustment, so that the signal distortion rate is reduced, and the stability of 6G communication of a train in a high-speed running state is ensured; and the channel feedback time delay of traditional base station switching can be eliminated, the success rate of uninterrupted signal switching is improved, and the continuity of 6G key services such as train control and passenger service is guaranteed.

The embodiment of the present application relates to a kind of high-density optoelectronic co-packaging module and its preparation method, longitudinal extension network, the high-density optoelectronic co-packaging module, comprising: bare chip integrated circuit;Multiple optical communication chips, each of the optical communication chip at least shares a semiconductor functional layer, and the semiconductor functional layer is bonded with the bare chip integrated circuit by a bonding layer, each of the optical communication chip is configured to independently / collectively emit target modulation laser under the driving of the bare chip integrated circuit.The high-density optoelectronic co-packaging architecture provided in the application can solve the bottleneck problem of existing optoelectronic co-packaging technology in high-density integration, signal integrity, thermal management and manufacturing cost, etc., and provides a high-energy efficient, high-density, high-reliability optical communication solution for next-generation AI computing and data center interconnection.

This invention provides an infrared beam anti-interference device and method for sowing monitoring, belonging to the field of agricultural sowing technology. The device includes a main control module, a pulse drive module, an infrared beam module, and a signal processing module. The main control module is electrically connected to the pulse drive module, the infrared beam module, and the signal processing module. The main control module is used to output timing control and high-frequency pulse signals, receive detection signals and determine the next sowing state, and simultaneously complete control processing including parameter configuration and timing synchronization. The pulse drive module is used to execute high-frequency pulse signals from the main control module and supports time-division multiplexing control. The infrared beam module is configured to use high-frequency pulse signals for signal transmission and reception and electrical signal conversion under the time-division multiplexing mechanism. The signal processing module is used to process the electrical signals into detection parameters that can be recognized by the main control module. The anti-interference method is based on the above-mentioned anti-interference device. This solution can significantly improve signal recognition accuracy and greatly reduce stray light interference.

The application discloses a high signal-to-noise ratio signal acquisition method and device for electrocardio-cardiac sound integration, and belongs to the technical field of biomedical signal acquisition. The circuit adopts two instrument amplifiers to collect electrocardio signals and cardiac sound signals respectively, and fuses a programmable gain amplifier-low pass filter fusion circuit and an analog-to-digital converter through a switch array time-sharing multiplexing. The instrument amplifier integrates chopping modulation and an auxiliary loop to suppress noise and improve input impedance; the fusion circuit adopts a switched capacitor topology to realize programmable adjustment of gain and bandwidth. A clock manager uniformly controls channel switching and circuit parameter reconfiguration. The application realizes high signal-to-noise ratio synchronous acquisition of double-mode signals, and has low power consumption, small area and good wearable integration characteristics.