The invention discloses a
microstrip line design method based on high-frequency pure glue and a circuit board. The method comprises the following steps: acquiring the thickness of the high-frequency pure glue of a
microstrip line and the initial
line width of the
microstrip line; and based on the thickness of the high-frequency pure glue of the microstrip line, the initial
line width of the microstrip line and the non-fringing field
capacitance of the microstrip line, calculating the
line width of the fringing field at the
tail end of the microstrip line. The circuit board comprises a top reference
ground layer and a base material layer, and the top reference
ground layer is provided with the microstrip designed and manufactured by adopting the design method.
Capacitance is increased and impedance is adjusted by adjusting the line width of the
tail end of the microstrip line, meanwhile, unit area stress of high-frequency pure glue of the microstrip line is dispersed, and collapse is reduced; impedance abrupt change in the microstrip line testing process is reduced,
return loss is increased, and the influence of a horizontal probe on a transition position is remarkably reduced; through the circuit
board structure and the microstrip line designed by adopting the design method, the
dielectric constant and
dielectric loss of the high-frequency pure glue can be directly obtained, the test of the single pure glue is realized, and the test result is not influenced by the electrical property of the substrate.