A multilayer
semiconductor device includes: a substrate comprising
silicon carbide (SiC); and an epitaxial
transition layer on the substrate, the epitaxial
transition layer comprising a first epitaxial
oxide material or SiC. One or more epitaxial active regions comprising one or more second epitaxial
oxide materials are formed on the epitaxial
transition layer, and a
metal layer is formed over the one or more epitaxial active regions, the
metal layer comprising one or more
electrical contacts. The multilayer
semiconductor device includes one of the following: a
metal-
oxide-
semiconductor field-effect
transistor (
MOSFET), a vertically conductive
MOSFET, a lateral
MOSFET, a metal-semiconductor field-effect
transistor (MSFET), a
bipolar junction transistor (BJT), a junction field-effect
transistor (
JFET), a metal-insulator-semiconductor (MIS) device, a PN device, a PNP device, an NPN device, or an insulated-gate bipolar transistor (IGBT).