5results about "Particle application" patented technology

A magnetic film includes a plurality of magnetically permeable particles dispersed between opposing first and second major surfaces of the magnetic film. The first and second major surfaces are spaced apart a distance D. The particles are agglomerated so as to form a plurality of substantially continuous layers of particles generally extending along orthogonal first and second directions and arranged along a third direction. Each substantially continuous layer of particles has a length L along the first direction from a first to an opposing second edge of the magnetic film and a width W along the second direction extending from the first to the second major surface. L / D≥100.

A soft magnetic resin composition includes a solid content containing flat soft magnetic particles and a resin component, and a dispersion medium. Furthermore, a viscosity (A) at a shear rate of 38.1 s-1 is 300 mPa·s or more. Furthermore, a ratio (A / C) of the viscosity (A) at a shear rate of 38.1 s-1 with respect to a viscosity (C) at a shear rate of 191.5 s-1 is 1.7 or more.

A magnetic paste comprising: (A) a magnetic powder; and (B) a thermosetting resin, wherein (A) the magnetic powder has an average particle diameter of 10 µm or less, and a water content in the magnetic paste is 1000 ppm or less.

This invention discloses a laser-direct-write magnetic thin-film encapsulation method for chip-based inductive elements, relating to the field of integrated circuit packaging technology. The method involves uniformly mixing magnetic nanoparticles with a curable adhesive to form a magnetic slurry, which is then uniformly coated onto a chip containing an inductive element. A laser is used to directionally irradiate the magnetic slurry above the inductive element, causing it to solidify and form a magnetic thin film that adheres tightly to the chip. Uncured magnetic slurry on the chip is then cleaned away, resulting in an inductive element encapsulated with the magnetic thin film. This method solidifies the magnetic film within a designated area of ​​the chip's inductive element, avoiding direct contact with the element's surface. This prevents chip interface damage and device failure, as well as issues such as secondary diffusion failure of active devices due to excessive temperature. It is fully compatible with standard semiconductor processes, facilitating commercial applications. The encapsulation process is simple, efficient, and flexible.

Provided herein are methods and compositions comprising a non-toxic ferromagnetic ink composition. Also provided herein are plastic objects containing a surface coating of a food-safe ferromagnetic ink composition. The coating imparts functionality to a plastic object such that the object is capable of being mechanically separated from waste stream using a commercial magnetic separator. The food-safe ink composition, which can be printed using high-speed flexographic, intaglio, offset printing or pad printing, combined with heat transfer printing or hot foil stamping consists of an ingestible magnetically susceptible pigment capable of rendering the printed template with magnetically active properties. The surface of the plastic object described can consist of geometric designs which increase printable surface area without significant changes in dimensions of the said object.