The invention relates to a
semiconductor technology system, in particular an EUV
lithography system, comprising: a housing (25) in which a plurality of preferably reflective optical elements (M1, M2, ...) are arranged in a beam path (33) of the
semiconductor technology system, and an inspection device, in particular a camera (30) which has an imaging optic (31) for imaging at least a partial area (T1, T2, ...) of an
optical surface (M1', M2', ...) of at least one optical element (M1, M2, ...) to be inspected in the housing (25) onto a spatially resolving
detector (32). The inspection device is designed to inspect at least the partial area (T2, T3, ...) of the
optical surface (M2', M3', ...) of the optical element (M2, M3, ...) to be inspected via at least one
optical surface (M1', M2', ...) of at least one in the beam path (33) between the optical element (M2, M3, ...) to be inspected.) and the optical element (M1, M2, ...) arranged in the housing (25) of the inspection device. The invention also relates to an associated method.