The invention discloses a multi-layer circuit board via hole non-stub preparation device, and relates to the field of multi-layer circuit board preparation, the multi-layer circuit board via hole non-stub preparation device comprises a multi-layer circuit board and a
processing groove used for
processing the surface of the multi-layer circuit board, the multi-layer circuit board is provided with a plurality of through holes, and the
processing groove is fixedly connected with a moving track. A vertical moving
assembly is fixedly connected to the moving end of the moving rail and used for driving the vertical moving
assembly to move in the length direction of the processing groove. Local plugging of the through hole is achieved through the plugging
assembly, the through hole is divided into a
copper-plating-free area and a target
copper-plating area through the two
silicon rubber cases on the plug, only
electroplating liquid is allowed to enter the target
copper-plating area through the
open hole in the connecting
pipe, and generation of redundant copper columns is eradicated fundamentally; meanwhile, the check ring precisely limits the
insertion depth of the plug, it is ensured that the
copper plating area is precisely positioned, interference of the stub on high-speed
signal transmission is effectively avoided, the
signal integrity and reliability of the multi-layer circuit board are improved, and the use requirements of high-end
electronic equipment are met.