32results about How to "Eliminate the effects of thermal deformation" patented technology

The invention discloses a fishbone simulation type dry gas seal structure. The fishbone simulation type dry gas seal structure comprises a moving ring and a static ring, wherein a seal inlet is formedin the outer diameter side, namely the high-pressure side, of the moving ring, a seal inlet is formed in the outer diameter side, namely the high-pressure side, of the static ring, a seal outlet is formed in the inner diameter side, namely the low-pressure side, of the moving ring, and a seal outlet is formed in the inner diameter side, namely the low-pressure side, of the static ring. A plurality of fishbone simulation type grooves are evenly distributed on the high-pressure side of at least one end face of the moving ring in the circumferential direction, and a plurality of fishbone simulation type grooves are evenly distributed on the high-pressure side of at least one end face of the static ring in the circumferential direction. A non-hole area between every two adjacent fishbone simulation type grooves in the circumferential direction is a sealing weir 4. Annular sealing dams 8 are arranged below the fishbone simulation type grooves. The fishbone simulation type dry gas seal structure has the remarkable advantages of being high in opening capacity, high in stability, low in leakage quantity, less in sealing end face deformation and capable of carrying out two-way rotation, and the like, and thereby having broad market prospect.

The invention discloses a stop valve. The stop valve comprises a cavity and a lantern ring, wherein the cavity is defined by assembled a valve seat and a valve element; the lantern ring is mounted on the valve seat; the valve seat comprises a medium inlet and a medium outlet; a first sealing ring part located between the medium inlet and the medium outlet is arranged on the lantern ring; the valve core is located between the medium inlet and the medium outlet, and can coordinate with the first sealing ring part to switch on / off the medium inlet and the medium outlet; the stop valve is characterized in that a conical surface matched with the first sealing ring part is arranged on the valve element; the lantern ring is of normal pore diameter, normal inner wall thickness and a second pore diameter forming the first sealing ring part; the second pore diameter is smaller than the normal pore diameter; a radiating ring part which is in interval with the first sealing ring part is further arranged on the lantern ring. The two ring parts are arranged on the lantern ring of the stop valve, so that the radiating area can be effectively increased, the influence scope of thermal distortion can be reduced, and the stable sealing effect can be achieved.

The invention discloses a non-contact silicon wafer deformation compensating device, comprising: a forward air flotation unit; the forward air flotation unit includes a shell and a groove; an electrostatic adsorption unit; a static electrode is arranged at the inner bottom of the groove array; the forward air flotation unit includes several air inlets arranged on the shell for introducing compressed air.

The invention provides a solvent acrylic ester heat dissipation coating. The solvent acrylic ester heat dissipation coating is formed by first enabling a coolant to be scattered in monomer solution and then performing in situ polymerization, the weight ratio between the coolant and a monomer is (1-4):(6-9), the coolant is composed of 70-90% of carbon fiber and 10-30% of nano material, and the monomer is one or more of modified acrylic ester, acrylic acid or acrylic ester. Due to the fact that in situ polymerization of the solution is adopted, the evenly-scattered heat dissipation coating in which the carbon fiber and nano material composite heat dissipation particles are added is obtained, heat transfer and heat dissipation efficiency can be improved, the heat dissipation coating is coated on the surface of a back plate of a light-emitting diode (LED) liquid crystal module, part of heat generated by an LED is dissipated in an infrared radiation mode, the heat dissipation performance of the LED liquid crystal module is improved, the heat dissipation amount is increased on the same heat dissipation area, and the heat dissipation efficiency is improved.

A valve body of a solenoid valve (1) is formed by jointing a second valve body (10) and a first valve body (4) through fusion welding. Pipes (30, 32) are jointed with the second valve body through brazing (R). A valve core (50) is guided to slide by an internal circumferencial surface (42) of the first valve body (40). The first valve body (40) is not influenced by thermal deformation of brazing (R), so that good sliding performance of built-in components is guaranteed. According to the electric driving valve, thermal deformation of the sliding surface is avoided when the pipes are jointed with the valve body through brazing.

The invention discloses a high-precision workpiece processing system and a processing method thereof. The main content is: the X-axis motion unit is installed on the inclined surface of the bed, and the angle between the inclined surface of the bed and the horizontal plane is 30°, and the Y-axis is compounded. The motion unit is installed on the X-axis motion unit, the tool rest unit is installed on the Y-axis compound motion unit, the workpiece headstock unit is fixed on the bed and the workpiece headstock unit is located on the left side of the tool post unit, and the top unit is installed on the bed. , the automatic tool setting unit is installed on the front side of the bed, the outer cover is fixedly installed on the bed, the control box is installed on the front side of the outer cover through the rotating shaft, and the workpiece feeding unit is installed on the right side of the bed. The invention automatically realizes the hobbing operation of the gear, has high machining accuracy and stable and reliable operation, and can process both shaft teeth and disk teeth. The inner cover shell and the outer cover shell are used to isolate the processing area and the non-processing area. The layout not only facilitates loading and unloading operations, but also improves its processing performance.

The invention provides a device for measuring thermal elongation of a ram based on a texture thermal elongation difference property. According to the device, a bonding point of a ram shell and a screw rod set is arranged at the fixed rear end of the ram. The device is structurally characterized in that the rear end of the ram is joined with the rear end of an aluminum pipe; the aluminum pipe and the front end of a steel rod are joined on a fixed part of the aluminum pipe and the steel rod; the rear end of the steel rod is connected with a measuring device; a design is that the thermal expansion coefficient of aluminum is two times as much as that of steel; when the temperature is changed, the ram shell extends for one thermal elongation unit along the positive direction, the aluminum pipe extends for two times along the positive direction and the steel rod is moved for two times along the positive direction; however, the steel rod extends for one thermal elongation unit along the negative direction and the sum of the thermal elongation unit and the thermal elongation of the ram is equal to the thermal elongation amount of the aluminum pipe; a reference object of the thermal displacement of the ram is compounded; and a numerical value collected by the measuring device at the rear end of the steel rod is the thermal displacement of the ram, so that expensive mark post invar steel is replaced and the production cost of equipment is reduced obviously.

The invention provides a pressure-sensitive acrylic acid thermally conductive adhesive, formed by dispersing a thermally conductive agent in monomer solution at first, then performing an in-situ polymerization, wherein the dosage ratio of the thermally conductive agent to the monomer is (1 to 4): (6 to 9); the thermally conductive agent is composed of 75-90% of carbon fibres and 10-25% of carbon nano-tubes; and the monomer is acrylic acid and / or acrylate. The pressure-sensitive acrylic acid thermally conductive adhesive provided by the invention is excellent in thermal conductivility and goodin environmental protection property because of uniformly dispersing a thermally conductive agent consisting of specific components in an acrylic acid polymerized monomer to form a stable three-dimensional meshy thermally conductive structure. The pressure-sensitive acrylic acid thermally conductive adhesive can be used between an LED (light-emitting diode) lamp bar and a back plate, between the LED lamp bar and an aluminium alloy section, between the back plate and the aluminium alloy section, between the gaps of chips such as CPU and GPU and a radiator, and in case that the gap of two contact surfaces is narrow in a liquid crystal module.

The invention provides a substrate-free pressure-sensitive acrylic thermal conductive adhesive. A thermal conductive agent is dispersed in a monomer solution, and the thermal conductive adhesive is formed by curing and cross-linking after in situ polymerization; the consumption ratio of the thermal conductive agent to the monomer is (1-4): (6-9); the thermal conductive agent consists of 75 to 90 percent of carbon fibers and 10 to 25 percent of carbon nano tubes; and the monomer is acrylic acid and / or acrylate. Because the thermal conductive agent of specific components is uniformly dispersed in the acrylic polymerization monomer to form a stable three-dimensional netlike thermal conductive structure, so that the thermal conductive adhesive is good in thermal conductive performance and good in environment friendliness. The thermal conductive adhesive can be applied between a light emitting diode (LED) light bar and an aluminum alloy profile, between the aluminum alloy profile and a back plate, between the LED light bar and the back plate or between a chip and a radiator, is used as a double-sided adhesive tape, and is used under the condition of a big gap between two contact faces of liquid crystal modules.