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81results about How to "Solve the shift" patented technology

Wafer level fan-out chip packaging method

The invention relates to a wafer level fan-out chip packaging method, comprising the following technological processes: a stripping foil and a film dielectric layer I are sequentially covered on the surface of the wafer of a carrier, a photoetching pattern opening I is formed on the film dielectric layer I; a metal electrode and a re-wiring metal routing wire which are connected with a base plate end are arranged on the photoetching pattern opening and the surface thereof, a film dielectric layer II is covered on the surface of the metal electrode, the surface of the re-wiring metal routing wire, and the surface of the film dielectric layer I which are connected with the base plate end, and a photoetching pattern opening II is formed on the film dielectric layer II; a metal electrode connected with a chip end is arranged on the photoetching pattern opening II, after a chip is arranged on the metal electrode connected with the chip end in an inverting way, the injection molding of packaging material and solidification are carried out, so as to form a packaging body with plastic-packaging material; the wafer of the carrier and the stripping foil are separated from the packaging body with plastic-packaging material, so as to form a plastic-packaging wafer; a welding sphere back returns to form a welding ball salient point; cutting is carried out by uniwafers for forming the final structure of the fan-out chip. The method has low cost and a carrying function, and can well solve the problem that the chip is shifted in the technological process.
Owner:JIANGYIN CHANGDIAN ADVANCED PACKAGING CO LTD

Wafer level fan-out chip packaging structure

The invention relates to a wafer level fan-out chip packaging structure, comprising a film dielectric layer I (101), a photoetching pattern opening I (1011) is formed on the film dielectric layer I (101), a metal electrode (102) and a re-wiring metal routing wire (103) which are connected with a base plate end are arranged on the photoetching pattern opening and the surface of the film dielectric layer I (101), a photoetching pattern opening I (1011) is formed on the film dielectric layer I, a film dielectric layer II (104) is covered on the surface of the metal electrode, the surface of the re-wiring metal routing wire, and the surface of the film dielectric layer I which are connected with the base plate end, and a photoetching pattern opening II (1041) is formed on the film dielectric layer II; a metal electrode (105) connected with a chip end is arranged on the photoetching pattern opening II, a chip (106), a metal column/metal salient point (107) and a welding flux are arranged on the metal electrode connected with the base plate end in an inverting way, so as to form a wafer with an inverted chip, packaging material (109) is injected on the surface of the wafer, and a welding ball salient point (110) is arranged on the metal electrode (102) connected with the base plate end. The packaging is low, has a carrying function and can well solve the problem that the chip is shifted in the technological process.
Owner:JIANGYIN CHANGDIAN ADVANCED PACKAGING

Wafer level fan-out chip packaging method

The invention relates to a wafer level fan-out chip packaging method, comprising the following technological processes: a stripping foil and a film dielectric layer I are sequentially covered on the surface of the wafer of a carrier, a photoetching pattern opening I is formed on the film dielectric layer I; a metal electrode and a re-wiring metal routing wire which are connected with a base plateend are arranged on the photoetching pattern opening and the surface thereof, a film dielectric layer II is covered on the surface of the metal electrode, the surface of the re-wiring metal routing wire, and the surface of the film dielectric layer I which are connected with the base plate end, and a photoetching pattern opening II is formed on the film dielectric layer II; a metal electrode connected with a chip end is arranged on the photoetching pattern opening II, after a chip is arranged on the metal electrode connected with the chip end in an inverting way, the injection molding of packaging material and solidification are carried out, so as to form a packaging body with plastic-packaging material; the wafer of the carrier and the stripping foil are separated from the packaging bodywith plastic-packaging material, so as to form a plastic-packaging wafer; a welding sphere back returns to form a welding ball salient point; cutting is carried out by uniwafers for forming the finalstructure of the fan-out chip. The method has low cost and a carrying function, and can well solve the problem that the chip is shifted in the technological process.
Owner:JIANGYIN CHANGDIAN ADVANCED PACKAGING CO LTD

Multi-light guide gain amplification laser equipment

The invention relates to multi-light guide gain amplification laser equipment comprising a plurality of laser devices, a plurality of socket type photoconductive coupling devices and a socket type multi-light guide gain amplification device, wherein the laser devices are connected with the socket type multi-light guide gain amplification device by supporting plates; and the socket type photoconductive coupling devices are connected with the socket type multi-light guide gain amplification device by a single optical fiber. The multi-light guide gain amplification laser equipment has a structure that through a photoconductive coupling seat, the socket type photoconductive coupling devices are installed on the supporting plates connected with the laser devices so that once optical fibers on the socket type photoconductive coupling devices need to be replaced, just lock nuts of the coupling devices need to be loosened; and after reinstalled, the socket type photoconductive coupling devices do not need to be adjusted, thereby being convenient for operation, saving labor and time and leading the work efficiency to be high. Besides, by utilizing a positioning fastening device and lock nuts, the socket type multi-light guide gain amplification device leads multiple beam optical fibers to be in direct butt joint with the single beam optical fiber, and any other optical lens are not needed, thereby avoiding energy loss and increasing the coupling efficiency.
Owner:TIANJIN LEIYI LASER TECH

LED lamp for student learning

The invention discloses an LED lamp for student learning. The LED lamp comprises an LED lamp body, a movable adjusting rod and a plate body, the LED lamp body is connected with one end of the movableadjusting rod; the other end of the movable adjusting rod is connected with a first mounting pipe; wherein the first mounting pipe is of a hollow structure with an opening in one end, a second mounting pipe is of a hollow mechanism, one end of the second mounting pipe is inserted into the opening end of the first mounting pipe and connected with the first mounting pipe through the mounting mechanism, the other end of the first mounting pipe is mounted on the plate body, and the plate body is mounted on a wall body; the driving assembly is located at the end close to the plate body, the limiting assembly is located in the position close to the first mounting pipe, the outer wall of the second mounting pipe is sleeved with the positioning sleeve, the driving assembly is connected with the limiting assembly through the sliding rod, and limiting holes matched with the limiting assembly are symmetrically formed in the inner wall of the first mounting pipe; the desk has the advantages that the desk is convenient to mount and demount on the wall, the occupied area of the desk top is reduced, mosquito repelling and heat dissipation are combined, and the working efficiency of the desk top and the wall is greatly improved.
Owner:马鞍山三投光电科技有限公司

A method for the expansion and support of return airway in soft rock working face of coal mine

The invention relates to a method for repairing and supporting an air return roadway in a soft rock working face of a coal mine. Firstly, a side loader is used to pull the bottom, and a roadway repair machine is used to carry out roof lifting and side expansion; For the net cable, use steel sheds for inclined miners, trough-type wooden piles and sided wooden piles to strengthen the support; for the U-shaped steel shed support section roadway, re-erect U-shaped steel sheds, trough-type wooden piles and sided wooden piles for reinforcement support. The present invention is mainly to solve the problem that during the mining process of the working face, under the influence of mine pressure and mining disturbance, the soft rock roadway will converge on the roof, floor and two sides, resulting in a significant reduction in the roadway section, affecting ventilation, pedestrians, material transportation, Coal transportation and other problems. Through the implementation of the present invention, it is also possible to effectively reduce the repair frequency of the roadway, reduce the labor intensity of workers, and increase the advancing speed of the working face, which is of great significance for improving the economic benefits of the mine.
Owner:李洪彪

Woven bag continuous shearing and bag opening twisting device and processing technological method thereof

ActiveCN110315803ASolve the shiftPlay the role of auxiliary clamping and fixingBag making operationsPaper-makingEngineeringHot melt
The invention discloses a woven bag continuous shearing and bag opening twisting device and a processing technological method of the woven bag continuous shearing and bag opening twisting device. Thewoven bag continuous shearing and bag opening twisting device and the processing technological method of the woven bag continuous shearing and bag opening twisting device are characterized in that a left movement mechanism and a right movement mechanism are adopted to guarantee the restraint and press in the woven bag shearing process, telescopic cylinders can drive the movement mechanisms to moveat the same time, and an upper clamping transmission roller and a lower clamping transmission roller also play a role in assisting in clamping and fixing woven bags; an upper shearing roller and a lower shearing roller are arranged in the up-and-down direction, and rotate in the opposite directions at the same speed, and therefore the quick shearing operation of the woven bags is achieved by means of the high temperature and the shearing force on two shearing knives; and the two shearing knives are rotated to be separated, and therefore the situation that after the woven bags are molten, thewoven bags adhere to blades cannot exist, the shearing effect is improved, quick separation can be automatically achieved in the hot shearing process, the degree of automation is high, the damage to the notch edges cannot be caused, and the processing efficiency and the processing quality of the woven bags can be improved manyfold.
Owner:HUBEI UNIV OF TECH

Wafer level fan-out chip packaging structure

The invention relates to a wafer level fan-out chip packaging structure, comprising a film dielectric layer I (101), a photoetching pattern opening I (1011) is formed on the film dielectric layer I (101), a metal electrode (102) and a re-wiring metal routing wire (103) which are connected with a base plate end are arranged on the photoetching pattern opening and the surface of the film dielectriclayer I (101), a photoetching pattern opening I (1011) is formed on the film dielectric layer I, a film dielectric layer II (104) is covered on the surface of the metal electrode, the surface of the re-wiring metal routing wire, and the surface of the film dielectric layer I which are connected with the base plate end, and a photoetching pattern opening II (1041) is formed on the film dielectric layer II; a metal electrode (105) connected with a chip end is arranged on the photoetching pattern opening II, a chip (106), a metal column / metal salient point (107) and a welding flux are arranged on the metal electrode connected with the base plate end in an inverting way, so as to form a wafer with an inverted chip, packaging material (109) is injected on the surface of the wafer, and a welding ball salient point (110) is arranged on the metal electrode (102) connected with the base plate end. The packaging is low, has a carrying function and can well solve the problem that the chip is shifted in the technological process.
Owner:JIANGYIN CHANGDIAN ADVANCED PACKAGING CO LTD

Mold opening and closing mechanism

The invention discloses a mold opening and closing mechanism. The mold opening and closing mechanism mainly comprises a combined mold and a driving mechanism. When a rotary driving mode is adopted, a motor drives a lead screw to rotate through a reversing apparatus and a transmission shaft, partition plates connected to the lead screw move forwards or backwards along with rotation of the lead screw, and due to the fact that the two partition plates of the same set of combined mold are connected to right-hand threads and left-hand threads respectively, when the lead screw rotates, the two partition plates move face to face or back to back at the same time, and mold closing or mold opening of the mold is achieved; when a direct driving mode is adopted, driving cylinders are arranged at the two sides respectively, the driving cylinder at one side is fixedly connected to the partition plate at one side of the combined mold through a driving frame and a driving rod, and the driving cylinder at the other side is fixedly connected to the partition plate at the other side of the combined mold; and when the driving cylinders at the two sides push towards middle or pull towards two sides at the same time, the partition plates at the two sides of the combined mold move face to face or back to back at the same time, and mold closing or mold opening of the mold is achieved. The mold opening and closing mechanism has the advantages of being simple in structure, convenient to operate and easy to implement.
Owner:FOSHAN YUANFANG GENERAL MACHINERY TECH CO LTD
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