The invention discloses a
junction temperature calibration method based on a mathematical filtering
algorithm, and the
junction temperature calibration method belongs to the field of electronic device tests. The traditional
semiconductor device
junction temperature measurement methods include an electrical method, an
infrared method and the like. Due to the existence of theoretical errors and
noise in the measurement process, the traditional methods cannot measure junction temperature of a
semiconductor device accurately. The junction temperature calibration method regards a
semiconductor device as a temporally discrete dynamic
system with single input and double outputs, wherein the input is a thermal
power matrix x<k-1><+> at a previous moment, and the double outputs are respectively junction temperature T<k><+> and a thermal
power matrix x<k><+> at the moment. The junction temperature of the
semiconductor device is effectively calibrated in real time through continuous
recursion operation. The junction temperature calibration method is an
algorithm for carrying out
optimal estimation of
system states by utilizing a
linear system state equation and observing
system outputs through system input. The
algorithm can estimate states of the dynamic system from a series of data with
noise under the condition that measured variance is known, and obtains data closer to a true value.