The invention relates to a
silicon through hole test circuit and a method thereof, a test circuit of a
silicon through hole group in a three-dimensional
integrated circuit and a method thereof. The circuit comprises an excitation source, two parallel circuit branches, a third circuit
branch and a detection circuit
branch, wherein the excitation source is connected to an input terminal of a TSV and is used for providing an
excitation signal; the two parallel circuit branches are connected to an output terminal of the TSV; one circuit
branch comprises an inverting device and the other circuit branch comprises a
level trigger device and a switch device; the switch device is used for controlling on and off of the circuit branch where the
level trigger device is located; the third circuit branch is connected to output terminals of the two parallel circuit branches and is used for giving corresponding output according to a
current conduction or disconnection state of the circuit branch; and the detection circuit branch is used for determining whether the TSV has an open circuit defect or a
short circuit defect according to an output
signal presentation of the third circuit branch. Through analyzing the
signal presentations of two circuit branch output terminals, the TSV defect is determined. Through using one set of test circuit, open circuit defect and
short circuit defect tests can be covered.