The invention relates to a laminating method for multi-layer LED mixed-material circuit boards. The laminating method includes the following steps of firstly, subjecting a conductive material layer of a PNL (panel) board on each layer to oxygroup processing; secondly, selecting a ceramic material with two sides having protective films as an insulation material, and pre-baking the insulation material; thirdly, cutting the insulation material layer; fourthly, pre-staking the conductive material layer and the insulation material layer; fifthly, falsely laminating the pre-stacked board obtained in the fourth step, namely, enabling the insulation material layers and the conductive material layers of the adjacent PNL boards to be attached by the aid of a hot cylindrical rolled and pre-stacked board; and sixthly, according to the conventional manner, subjecting the pre-stacked board subjected to the false lamination in the fifth step to laminating, disassembling, drilling target holes with X-ray, turning and edging / filleting. By the laminating method, breakage of the insulation material and deviation among different material layers or various laminated surfaces can be effectively avoided and eliminated, local glue flowing can be avoided, the thickness uniformity of a medium layer can be guaranteed, and fusing degree of the insulation material layers and the conductive material layers is increased.