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52results about How to "Difficulty occur" patented technology

Image pickup device-equipped rear-view mirror

The present invention is intended to provide an image pickup device-equipped rear view mirror with improved image pickup performance, glare prevention and appearance (design) in addition to improved performance as a vehicle mirror. A mirror element is formed by forming a reflecting film consisting of high refractive index material films and a low refractive index material film on a back surface of a transparent glass substrate. The integrating sphere reflectance of the mirror element in the visible range is 40% to 60% and the near-infrared transmittance is no less than 70% for the whole or part of the band belonging to the near-infrared range within the entire sensitive wavelength range of the near-infrared camera. A black mask member is attached to an entire back surface of the reflecting film. The near-infrared camera is arranged behind the black mask member. The region corresponding to the area for the image-pickup by the near-infrared camera within the entire region of the black mask member is formed of a visible-light absorption and near-infrared transmission filter. The near-infrared transmittance of the visible-light absorption and near-infrared transmission filter is no less than 70% for the whole or part of the band belonging to the near-infrared range within the entire sensitive wavelength range of the near-infrared camera.
Owner:MURAKAMI CORP

Optical element, light condensation backlight system, and liquid crystal display

An optical element comprising: a polarizing element (A), separating incident light into polarization to then emit light, and made of a cholesteric liquid crystal, wherein the polarizing element (A) has a distortion rate with respect to emitting light to incident light in the normal direction of 0.5 or more and a distortion rate with respect to emitting light to incident light at an angle inclined from the normal direction by 60 degrees or more of 0.2 or less, the polarizing element (A) has a function increasing a linearly polarized light component of emitting light as incidence angle is larger; a ½ wavelength plate (B); a retardation layer (C) giving almost zero retardation to incident light in the front direction (normal direction) and giving a retardation to incident light in a direction inclined from the normal direction; and a ¼ wavelength plate (D); being arranged in this order, and further a linearly polarized light reflection polarizer (E), transmitting linearly polarized light with one polarization axis and selectively reflecting linearly polarized light with the other polarization axis perpendicular to the one polarization axis, is arranged on the ¼ wavelength plate (D) so that the transmission axis of the linearly polarized light reflection polarizer (E) and an axis of the transmitted light, which is transmitted through the polarizing element (A) to the ¼ wavelength plate (D) in this order, are the same direction. The optical element is capable of condensation and collimation of incident light from a light source and capable of suppressing transmission of light in an arbitrary direction.
Owner:NITTO DENKO CORP

Apparatus used for manufacturing semiconductor device, method of manufacturing the semiconductor devices, and semiconductor device manufactured by the apparatus and method

An apparatus for manufacturing semiconductor devices having a roughly rectangular parallelepiped box-shape includes an internal insertion space for semiconductor packages, first guide grooves and arranged along the longitudinal direction in both side surfaces facing the insertion space and second guide grooves and arranged parallel to the first guide grooves and respectively. Edge portions of an upper semiconductor package (a semiconductor component) are loosely fitted into the second guide grooves so that the movement of the upper semiconductor package in the left and right direction is restricted. Further, edge portions of a lower semiconductor package (a substrate for mounting semiconductor components) are loosely fitted into the first guide grooves so that the movement of the lower semiconductor package in the left and right direction is restricted. By using the apparatus, it becomes possible to provide a semiconductor device in which poor connections are difficult to occur, and further to provide an apparatus for manufacturing semiconductor devices and a method of manufacturing semiconductor devices that enable to prevent the occurrence of such poor connections in the obtained semiconductor devices and also enable to reduce manufacturing costs.
Owner:SEIKO EPSON CORP
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