39results about How to "Improves airflow uniformity" patented technology

The invention provides a gas compressor plane cascade experimental system with a suction baffle structure. The gas compressor plane cascade experimental system comprises a suction device and a plane cascade experimental device. The plane cascade experimental device comprises a left end plate, a right end plate, an upper baffle, a plurality of experimental blades and a lower baffle, wherein the upper baffle is arranged between the left end plate and the right end plate, and the multiple experimental blades are distributed at intervals. The upper baffle and the lower baffle are connected between the left end plate and the right end plate through fixing shafts. The upper baffle is provided with suction holes. Left end plate suction holes are formed in the left end plate, and right end plate suction holes are formed in the right end plate. The suction holes are connected with a vacuum pump through a pipeline. A three-hole probe 1 is arranged between the left end plate and the right end plate. In the experimental process, the upper baffle and the lower baffle are adjusted so that a cascade can be good in periodicity, the boundary layer of incoming flow is sucked through the left end plate suction holes and the right end plate suction holes, the influence area of the boundary layer is reduced, and uniform incoming flow is achieved. The gas compressor plane cascade experimental system with the suction baffle structure is an effective path for exploring improvement of the performance of a gas compressor, the influence of the boundary layer of the incoming flow is reduced, and meanwhile, the periodicity of the plane cascade is improved.

A microwave plasma reactor for manufacturing synthetic diamond material via chemical vapour deposition, the microwave plasma reactor comprising: a plasma chamber; a substrate holder disposed in the plasma chamber for supporting a substrate on which the synthetic diamond material is to be deposited in use; a microwave coupling configuration for feeding microwaves from a microwave generator into the plasma chamber; and a gas flow system for feeding process gases into the plasma chamber and removing them therefrom; wherein the gas flow system comprises a gas inlet nozzle array comprising a plurality of gas inlet nozzles disposed opposite the substrate holder for directing process gases towards the substrate holder, the gas inlet nozzle array comprising: at least six gas inlet nozzles disposed in a substantially parallel or divergent orientation relative to a central axis of the plasma chamber; a gas inlet nozzle number density equal to or greater than 0.1 nozzles/cm², wherein the gas inlet nozzle number density is measured by projecting the nozzles onto a plane whose normal lies parallel to the central axis of the plasma chamber and measuring the gas inlet number density on said plane; and a nozzle area ratio of equal to or greater than 10, wherein the nozzle area ratio is measured by projecting the nozzles onto a plane whose normal lies parallel to the central axis of the plasma chamber, measuring the total area of the gas inlet nozzle area on said plane, dividing by the total number of nozzles to give an area associated with each nozzle, and dividing the area associated with each nozzle by an actual area of each nozzle.

The invention relates to the technical field of wind tunnel experiment airflow uniformity, and discloses a device for improving aircraft experiment wind tunnel airflow uniformity and a parameter optimization method thereof. The device comprises a power section, a steady flow adjusting section and a contraction section; the power section comprises a circular-tube-shaped power main body section, a fan mounting structure arranged in the power main body section and a fan arranged on the fan mounting structure; and the method comprises the following steps: S1, preliminarily setting size parameters; S2, modeling a whole wind tunnel; S3, performing fluid simulation; and S4, judging whether the wind speed unevenness of the target area is less than 5% or not, if the unevenness is smaller than 5%, completing the design, and if not less than 5%, modifying the size parameters in the step S1, and repeating the steps S2-S4. According to the invention, the requirements of large air volume and large air speed during wind tunnel test of large aircrafts can be met, and the airflow uniformity can be improved.

Present invention discloses a drum type air handling assembly. It includes cylinder shape horizontal shell, round multi-leaf damper, fan-shaped or tube type primary filter, round surface heater, primary filter surface air coolers, humidifier, circular arc shape service door, and condensate pipe. Said invention has reasonable structure and fine working performance.

The invention provides a diagonal fan and a household appliance. The diagonal fan comprises a wheel cover assembly and a diagonal wind wheel. The wheel cover assembly comprises multiple sleeved wheelcovers, the wheel covers are provided with air inlets, the wheel cover located on the outer side stretches downstream relative to the wheel cover located on the inner side in any two adjacent wheel covers, a backflow passageway is formed between any two adjacent wheel covers, and the backflow passageways communicate with the air inlets. The diagonal wind wheel is partially arranged in the wheel cover on the innermost side in the multiple wheel covers. The diagonal wind wheel comprises a hub and multiple blades arranged on the hub, and the tops of the blades can correspond to inlets of the backflow passageways. By means of the technical scheme, the operating stability of the diagonal fan is improved, the pneumatic performance of the diagonal fan is improved, and meanwhile the probability that the blade frequency doubling noise is increased is reduced.

The invention provides an upper electrode structure and a plasma reinforced chemical vapor deposition device. The upper electrode structure comprises a central electrode plate and a peripheral electrode plate surrounding the central electrode plate and connected to the central electrode plate, wherein the bottom surface of the peripheral electrode plate is lower than that of the central electrode plate, and a ventilation pore passage penetrating through the upper electrode structure is formed in the upper electrode structure. The bottom surface of the peripheral electrode plate is lower than the bottom surface of the central electrode plate, and the ventilation pore passage penetrating through the upper electrode structure is formed in the upper electrode structure, so that an arch structure is formed on the bottom surface of the upper electrode structure, the airflow uniformity of process gas passing by the upper electrode structure can be improved, and a film formed by utilizing the process vapor deposition is good in uniformity; moreover, the upper electrode structure comprises the central electrode plate and the peripheral electrode plate, which are connected with each other, so that the position relation between the central electrode plate and the peripheral electrode plate can be adjusted, and the airflow uniformity of the process gas can be further optimized.

A process chamber having high conductance and a method of manufacturing the process chamber are disclosed. The process chamber is machined from a single piece of aluminum where a process cavity and a pump cavity are created by intersecting cylinders. A substrate opening is also created at a bottom of the process cavity to provide conduit for services, such as cooling gas and electrical connections. A large undercut area is formed at a top of the pump cavity between the pump cavity and the process cavity. The undercut extends past the process chamber centerline at the process cavity. A circular saw is used to remove material and create a plenum which extends beyond the process cavity centerline.

The invention discloses an energy saving and noise reducing multifunctional decoration wind gap capable of homogenizing air currents and an application method thereof. The wind gap comprises a rotating extension section, a rectification section, multiple external guide plates, at least two one-layer shutters, and a wind gap probe for detecting the exhaust temperature and/or the flowing speed; one end of the rectification section is connected with the rotating extension section, and the external guide plates are uniformly mounted around the other end; the rectification section has an outward concave arched windward surface; angles between the external guide plates and the rectification section are adjustable; the one-layer shutters are arranged in the rectification section; and the rotating extension section can drive the rectification section to change a wind blowing angle. The wind gap optimizes the streamline shape of the air currents sprayed by the wind gap, can increase or reduce actual travel distance of the air currents according to the demands, and improves the uniformity of the air currents and the indoor ventilation effect. The one-layer shutters replace double-layer shutters of a traditional wind gap, so that the wind resistance is reduced, and the noise of the wind gap and the energy consumption are reduced. In addition, the wind gap has a decoration effect.

The invention discloses semiconductor processing equipment. The semiconductor processing equipment comprises a reaction chamber and a process pipe, wherein at least part of the process pipe is positioned in the reaction chamber, the process pipe is provided with an accommodating part, an air inlet part and an air outlet part, the air inlet part is provided with an air inlet, the air outlet part isprovided with an air outlet, the process pipe is provided with a plurality of air inlets and a plurality of air outlets, the air inlets and the air outlets are distributed at intervals in the axis direction of the process pipe, the air inlets are communicated with an accommodating part, and the air outlets are communicated with the accommodating part. The semiconductor processing equipment is advantaged in that a problem that in existing semiconductor processing equipment, the effect of improving the uniformity of gas in the reaction chamber is poor can be solved.

The invention provides a high-temperature nitridation airflow field control device and method. The control device comprises an impeller used for driving gas in a furnace body to flow, a first gas inlet used for feeding ammonia gas and a second gas inlet used for feeding power gas for driving the impeller to rotate, the first gas inlet is arranged below the impeller, the second gas inlet is arranged above the side of the impeller, and the power gas is argon. According to the high-temperature nitridation airflow field control device, the impeller driven by argon is arranged on the inner wall of a furnace door of the device, on one hand, ammonia gas and argon in the furnace are mixed to be uniform by means of rotation of the impeller; on the other hand, fed argon also can serve as diluent gas of high-purity ammonia gas to adjust the concentration of ammonia gas in the furnace.

The invention discloses a stove combustor with a temperature sensor. The stove combustor comprises a base, a fire cover, the temperature sensor, an outer ring gas injection pipe and an inner ring gas injection pipe; the base is provided with an outer ring cavity and an inner ring cavity, the outer ring cavity is communicated with the outer ring gas injection pipe, the inner ring cavity is communicated with the inner ring gas injection pipe, and the stove combustor is characterized in that a mounting cavity is formed in the center of the inner ring cavity, an opening is formed in the position, located at the bottom of the base, of the mounting cavity, and the temperature sensor is mounted in the mounting cavity. Compared with the prior art, the stove combustor has the beneficial effects that the mounting cavity used for mounting of the temperature sensor is formed in the center of the inner ring cavity of the stove combustor, and can achieve the flow guide effect, the uniformity of the gas flow inside the base is better, the gas mixing effect is better, in addition, after the temperature sensor is mounted in the mounting cavity, the gas mixing effect is not affected, and a mounting structure is reasonable.

The ventilation module comprises a shell, a hollow channel is defined by the shell, blocking ribs are arranged at the two ends of the channel respectively, the blocking ribs divide the two ends of the channel into a plurality of hollowed-out small holes respectively, and the interior and the exterior of the channel are communicated through the hollowed-out small holes respectively. By means of the arrangement, the two sides of the ventilation module can be communicated through the hollowed-out small holes of the communicating channels in the two ends, airflow on the two sides of the ventilation module can flow through the channels, and the purpose that gas on the two sides freely exchanges and flows under the action of pressure difference is achieved; meanwhile, the hollow small holes are formed in the end of the ventilation module at intervals, so that the uniformity of airflow flowing into the roller is improved, and the situation that water in the roller is discharged out of the ventilation module can be effectively prevented. Meanwhile, the invention further discloses a clothes processing device which comprises a roller which is installed in a shell and forms a sealed water container when the washing machine is in a washing state. And at least one ventilation module is arranged on the roller.

The present invention relates to a gate etching method, including BT step, main etching step and over etching step. It is characterized by that in the described main etching step the used gas contains Cl2, HBr and O2, On the premise of that its hardware design is not changed said method only can change the gas type and matching ratio of main etching step in gate etching process to raise gas flow uniformity of silicon wafer surface process gas so as to meet the requirements of advanced gate etching process.

The invention relates to cooking equipment which comprises a shell, a platform and a fan, a cooking cavity is formed in the shell, the platform is arranged in the shell, the fan is arranged on the platform, an air outlet communicates with the cooking cavity, and the platform and/or the fan can move relative to the shell so that the direction of the air outlet can change relative to the cooking cavity. By means of the mode, the confusion degree of the airflow in the cooking cavity is increased, the airflow acting on the food materials flows in all directions, then the food materials at all angles can be subjected to the airflow effect, and the airflow uniformity of the cooking equipment is improved.

The invention provides a filter cartridge dust remover, which comprises a dust removal chamber, an air inlet is arranged on the outer side of the dust removal chamber, the air inlet is communicated with the dust removal chamber, a filter cartridge frame is arranged in the dust removal chamber, and a filter cartridge is arranged on the filter cartridge frame; the air purification chamber is arranged above the dust removal chamber, a tubesheet is arranged between the air purification chamber and the dust removal chamber, the dust removal chamber and the air purification chamber are separated by the tubesheet, and the filter cartridge and the filter cartridge frame are arranged on the tubesheet; the air outlet is formed in the outer side of the air purification chamber and is communicated with the air purification chamber; the dust hopper is arranged below the dust removal chamber, and a dust discharging valve is arranged at the bottom of the dust hopper; and the iron powder removing device comprises an electromagnet and is arranged between the ash bucket and the dust removing chamber. By arranging the iron powder removing device, scrap iron dust or iron ore concentrate dust can be effectively separated, electrical equipment in the dust remover is prevented from being damaged, and the problems that maintenance is difficult and maintenance cost is high due to the iron dust are solved.

The invention relates to a spin-coating development device in the field of semiconductor manufacturing, and particularly provides a single-air-outlet spin-coating development cavity, which includes an upper spin-coating cavity, a middle spin-coating cavity, a flow reshaping board and a lower spin-coating cavity. The bottom of the lower spin-coating cavity is provided with an air outlet. The upper spin-coating cavity is disposed on the top of the lower spin-coating cavity. The middle spin-coating cavity is disposed between the upper spin-coating cavity and the lower spin-coating cavity. The flow reshaping board is arranged between the air outlet and a wafer, is in an annular shape and is provided with a plurality of holes circumferentially therein. The device is reduced in the number of air outlets and is reduced in size, and is improved in uniformity of air flow neighboring the waver.