The utility model discloses a high -performance DFN
lead frame, including frame body, frame body adopts
etching process production, and frame body includes the main function area of four big units in the centre, and the positioning area for positioning is designed to the upside and downside two sides, and the
adhesive uncovering area for uncovering
adhesive is used to the left and right two sides, and the back four corners are designed to have the foolproof frame for preventing
adhesive tape to paste offset, and every big unit includes the
small unit of vertical and horizontal interlaced distribution in the centre, and the air hole for identifying
cutting and releasing stress is used to the four around, and the glue inlet hole for the glue inlet is designed between every two big units. The high -performance DFN
lead frame of the new type is applicable to 0.5mm thickness's
package, can adopt BBOS
lead bonding process, need not form Bump ball, solves the quality hidden danger of pad wire
tail, improves the yield of product, and the
lead frame arrangement is more compact, can effectively save the space of material, improves the utilization of material, and production efficiency is effectively improved, and the cost of production and material is saved.