The invention belongs to the field of
hybrid bonding, and particularly discloses a bonding head for
hybrid bonding and a bonding method.The bonding head comprises a bonding head body, the lower surface of the bonding head body is of a horizontal structure, and an annular air
pressure groove with a downward opening is formed in the lower surface of the bonding head body along the edge; the positive-negative air pressure device is used for adjusting the air pressure in the annular air
pressure groove; and the moving rod
assembly comprises a main moving rod and a plurality of auxiliary moving rods, the main moving rod and the auxiliary moving rods penetrate through the bonding head body, and the auxiliary moving rods are arranged around the
peripheral side of the main moving rod. According to the bonding head, the annular air
pressure groove is formed in the bonding head body, the adsorption force on the to-be-bonded
chip is increased, in the
bonding process, the main moving rod and the auxiliary moving rod can push the to-be-bonded
chip to enable the to-be-bonded
chip to have enough deformation quantity, the chip cannot be separated from the bonding head body, the bonding effect of
hybrid bonding is improved, and the bonding efficiency is improved. And voids on the bonding interface are avoided.