42results about How to "Improve the passing rate of one-time inspection" patented technology

Disclosed is a method for protecting a paint spraying figurative protected zone. According to the method, before a part is sprayed with paint, protection is quickly and accurately carried out on a circular protected zone by using paper adhesive tape and two types of tools, namely two concentric-circle punches made of high-temperature alloy or stainless steel, and a circular punch made of high-temperature alloy or stainless steel; a bottom lamp is arranged at the bottom of a worktable, the surface of the worktable is made of transparent resin or transparent glass, and the bottom lamp irradiates on the part on the surface of the worktable through the worktable. The method includes the following specific technological processes: adhering the paper adhesive tape to rubber or plastic, punching a paper bag by using the concentric-circle punches and the circular punch to remove the rest surface adhesive tape, taking down the punched figurative adhesive tape, adhering the concentric-circle adhesive tape to the surface of the part, aligning small holes by using the bottom lamp, and covering the concentric-circle adhesive tape with the circular adhesive tape. The method for protecting the paint spraying figurative protected zone has the advantages that a protected zone on the periphery of a part hole can be made neat, circular shapes are regular, moving is prevented, and the qualification ratio under one-time acceptance check of products is improved.

The invention discloses a low-alloy high-strength high-impact-energy extra-large special-shaped ring forging. Low-alloy high-strength steel comprises, by weight, 0.08-0.12% of C, 0.5-0.6% of Mn, lessthan or equal to 0.006% of P, less than or equal to 0.006% of S, 0.5-0.65% of Si, 1.4-1.5% of Cr, 0. 55-0.65% of Mo, 0.1-0.2% of Ni, less than or equal to 0.15% of Cu, less than or equal to 0.04% of V, 0.03-0.04% of Nb, 0.02-0.04% of Al, less than or equal to 0.01% of Sn, less than or equal to 0.01% of As, less than or equal to 0.0012% of Sb and the balance Fe and impurities, then through nozzle cold sawing, riser collection, riser heat chopping, then three times of upsetting and two times drawing, broaching chambering, special-shaped ring rolling, preparatory heat treatment, rough turning, sawing, preheating and arc finishing. In this way, chemical compositions of raw materials are optimized, a reasonable matching heat treatment system is adopted, the stability of the impact work can be improved through maximum simulated post-weld heat treatment of the materials, the product once inspection pass rate is increased to 100%, energy waste caused by rework and repair is avoided, the production cycle is shortened, the manufacturing cost is reduced, and the competitiveness of enterprises is improved.

The invention relates to a method for improving the adhesion of a metal film layer of a high dielectric constant ceramic substrate, belonging to the technical field of fine processing of microwave integrated circuits. The surface layer of the above-mentioned substrate is roughened by array scribe etching with a specific performance ultraviolet laser, and the above-mentioned roughened substrate is calcined under high temperature conditions by using a specific temperature curve, so that the roughness obtained on the surface of the substrate is The Ra value is stable in the range of 0.25-0.3mm, and has good roughening uniformity, which improves the adhesion between the metal film layer and the substrate in the process of making microwave integrated thin film circuits when the substrate with high dielectric constant is used as the substrate.