39results about How to "Reduce fabrication" patented technology

An improved power supply terminal to prevent defects and output voltage drop of the power supply and reduce the total cost, and to bridge a power supply connector and insertion slots of a mainboard includes twenty-four first coupling slots on an upper end and twenty or twenty-four second coupling slots on a lower end. The coupling slots are opposing each other and not connected by conductive wires. Thereby it can be coupled with different types of power supply connectors and mainboard insertion slots. Defects and output voltage drop of the power supply can be prevented. Due to no conductive wires and separated design of the coupling slots and the coupling pins is not necessary, molding, material, and fabrication and assembly costs are reduced.

A method of wafer or substrate bonding a substrate made of a semiconductor material with a substrate made from a metallic material is disclosed. The method allows the bonding of the two substrates together without the use of any intermediate joining gluing, or solder layer(s) between the two substrates. The method allows the moderate or low temperature bonding of the metal and semiconductor substrates, combined with methods to modify the materials so as to enable low electrical resistance interfaces to be realized between the bonded substrates, and also combined with methods to obtain a low thermal resistance interface between the bonded substrates, thereby enabling various useful improvements for fabrication, packaging and manufacturing of semiconductor devices and systems.

An RF circuit having a transcoupler, a multifunctional RF-circuit element that can operate both as an impedance inverter and as a signal coupler. When connected to a fixed load impedance, the transcoupler can also operate as an impedance transformer. The impedance-transformer / inverter functionality of the transcoupler can be used, e.g., to modulate the load of a power amplifier. The signal coupler functionality of the transcoupler can be used, e.g., to generate a corresponding feedback signal indicative of phase and / or amplitude distortions in the amplifier. The use of various embodiments of the transcoupler in an RF circuit can be advantageous, for example, because the transcoupler has a lower insertion loss than a cascade consisting of a prior-art impedance inverter and a prior-art directional coupler, occupies a relatively small area on the printed circuit board, and helps to reduce the per-unit fabrication and operating costs.

A semiconductor chip electrical connection structure includes electrode pads formed on a surface of a semiconductor chip, wherein the semiconductor chip is mounted via another surface thereof on a carrier; a plurality of conductive bumps formed on the electrode pads respectively, and exposed from a dielectric layer applied on the semiconductor chip and the carrier; and a plurality of electrical connection pads formed on the dielectric layer and electrically connected to the conductive bumps exposed from the dielectric layer so as to provide outward electrical extension for the semiconductor chip via the electrical connection pads.

A package structure having MEMS elements includes: a wafer having MEMS elements, electrical contacts and second alignment keys; a plate disposed over the MEMS elements and packaged airtight; transparent bodies disposed over the second alignment keys via an adhesive; an encapsulant disposed on the wafer to encapsulate the plate, the electrical contacts and the transparent bodies; bonding wires embedded in the encapsulant and each having one end connecting a corresponding one of the electrical contacts and the other end exposed from a top surface of the encapsulant; and metal traces disposed on the encapsulant and electrically connected to the electrical contacts via the bonding wires. The present invention eliminates the need to form through holes in a silicon substrate as in the prior art so as to reduce fabrication costs. Further, the present invention accomplishes wiring processes by using a common alignment device to thereby reduce equipment costs.

An improved power supply terminal to prevent defects and output voltage drop of the power supply and reduce the total cost, and to bridge a power supply connector and insertion slots of a mainboard includes twenty-four first coupling slots on an upper end and twenty or twenty-four second coupling slots on a lower end. The coupling slots are opposing each other and not connected by conductive wires. Thereby it can be coupled with different types of power supply connectors and mainboard insertion slots. Defects and output voltage drop of the power supply can be prevented. Due to no conductive wires and separated design of the coupling slots and the coupling pins is not necessary, molding, material, and fabrication and assembly costs are reduced.

Methods, systems, and apparatuses for ball grid array land patterns are provided. A ball grid array land pattern includes a plurality of land pads and electrically conductive traces. The plurality of land pads is arranged in an array of rows and columns. A perimeter edge of the array includes a pair of adjacent oblong shaped land pads. An electrically conductive trace is routed between the pair of adjacent oblong shaped land pads from a land pad positioned in an interior of the array to a location external to the array. The oblong shaped land pads are narrower than standard round land pads, and thus provide more clearance for the routing of traces. The oblong shaped land pads enable more land pads of the land pattern array to be routed external to the array on each routing layer, and thus can save printed circuit board component and assembly costs.

A composite casing structure is applied to a housing of an electronic device. The composite casing structure includes a plastic frame and a metal plate. The plastic frame has a plurality of side walls surrounding four side edges thereof, and at least one open portion is formed by the side walls. The metal plate is combined with the plastic frame, and at least one reinforcing rib is formed on a surface of the metal plate, such that a position of the reinforcing rib is corresponding to a position of the open portion. With such a structural design, the composite casing has a lightweight and high-strength structure.