39results about How to "Reduce fabrication" patented technology

A method of wafer or substrate bonding a substrate made of a semiconductor material with a substrate made from a metallic material is disclosed. The method allows the bonding of the two substrates together without the use of any intermediate joining gluing, or solder layer(s) between the two substrates. The method allows the moderate or low temperature bonding of the metal and semiconductor substrates, combined with methods to modify the materials so as to enable low electrical resistance interfaces to be realized between the bonded substrates, and also combined with methods to obtain a low thermal resistance interface between the bonded substrates, thereby enabling various useful improvements for fabrication, packaging and manufacturing of semiconductor devices and systems.

A laser diode system is disclosed in which a substrate made of a semiconductor material containing laser diodes is bonded to a substrate made from a metallic material without the use of any intermediate joining or soldering layers between the two substrates. The metal substrate acts as an electrode and / or heat sink for the laser diode semiconductor substrate. Microchannels may be included in the metal substrate to allow coolant fluid to pass through, thereby facilitating the removal of heat from the laser diode substrate. A second metal substrate including cooling fluid microchannels may also be bonded to the laser diode substrate to provide greater heat transfer from the laser diode substrate. The bonding of the substrates at low temperatures, combined with modifications to the substrate surfaces, enables the realization of a low electrical resistance interface and a low thermal resistance interface between the bonded substrates.

A composite casing structure is applied to a housing of an electronic device. The composite casing structure includes a plastic frame and a metal plate. The plastic frame has a plurality of side walls surrounding four side edges thereof, and at least one open portion is formed by the side walls. The metal plate is combined with the plastic frame, and at least one reinforcing rib is formed on a surface of the metal plate, such that a position of the reinforcing rib is corresponding to a position of the open portion. With such a structural design, the composite casing has a lightweight and high-strength structure.

An improved power supply terminal to prevent defects and output voltage drop of the power supply and reduce the total cost, and to bridge a power supply connector and insertion slots of a mainboard includes twenty-four first coupling slots on an upper end and twenty or twenty-four second coupling slots on a lower end. The coupling slots are opposing each other and not connected by conductive wires. Thereby it can be coupled with different types of power supply connectors and mainboard insertion slots. Defects and output voltage drop of the power supply can be prevented. Due to no conductive wires and separated design of the coupling slots and the coupling pins is not necessary, molding, material, and fabrication and assembly costs are reduced.

A semiconductor chip electrical connection structure includes electrode pads formed on a surface of a semiconductor chip, wherein the semiconductor chip is mounted via another surface thereof on a carrier; a plurality of conductive bumps formed on the electrode pads respectively, and exposed from a dielectric layer applied on the semiconductor chip and the carrier; and a plurality of electrical connection pads formed on the dielectric layer and electrically connected to the conductive bumps exposed from the dielectric layer so as to provide outward electrical extension for the semiconductor chip via the electrical connection pads.

A method of wafer or substrate bonding a substrate made of a semiconductor material with a substrate made from a metallic material is disclosed. The method allows the bonding of the two substrates together without the use of any intermediate joining gluing, or solder layer(s) between the two substrates. The method allows the moderate or low temperature bonding of the metal and semiconductor substrates, combined with methods to modify the materials so as to enable low electrical resistance interfaces to be realized between the bonded substrates, and also combined with methods to obtain a low thermal resistance interface between the bonded substrates, thereby enabling various useful improvements for fabrication, packaging and manufacturing of semiconductor devices and systems.

Methods, systems, and apparatuses for ball grid array land patterns are provided. A ball grid array land pattern includes a plurality of land pads and electrically conductive traces. The plurality of land pads is arranged in an array of rows and columns. A perimeter edge of the array includes a pair of adjacent oblong shaped land pads. An electrically conductive trace is routed between the pair of adjacent oblong shaped land pads from a land pad positioned in an interior of the array to a location external to the array. The oblong shaped land pads are narrower than standard round land pads, and thus provide more clearance for the routing of traces. The oblong shaped land pads enable more land pads of the land pattern array to be routed external to the array on each routing layer, and thus can save printed circuit board component and assembly costs.

A package structure having MEMS elements includes: a wafer having MEMS elements, electrical contacts and second alignment keys; a plate disposed over the MEMS elements and packaged airtight; transparent bodies disposed over the second alignment keys via an adhesive; an encapsulant disposed on the wafer to encapsulate the plate, the electrical contacts and the transparent bodies; bonding wires embedded in the encapsulant and each having one end connecting a corresponding one of the electrical contacts and the other end exposed from a top surface of the encapsulant; and metal traces disposed on the encapsulant and electrically connected to the electrical contacts via the bonding wires. The present invention eliminates the need to form through holes in a silicon substrate as in the prior art so as to reduce fabrication costs. Further, the present invention accomplishes wiring processes by using a common alignment device to thereby reduce equipment costs.

A light delivery system to provide light treatment to a patient includes a catheter assembly having a plurality of light sources that transmit light towards a target site within a patient. In one embodiment, the light delivery system has a plurality of light sources mounted to a flexible transparent base that extends at least partially through a distal tip of the catheter assembly. The light sources can be wire bonded or mounted in a flip chip arrangement onto the base. In one embodiment to produce the distal tip, an array of light energy sources can be held by an array of holders of a fixture device. A vacuum is applied to secure each light energy source in a corresponding holder. While the vacuum is applied, the energy sources are electrically connected by wire bonding. The vacuum can be reduced or stopped thereby permitting removal of the light energy sources from the fixture device.

An RF circuit having a transcoupler, a multifunctional RF-circuit element that can operate both as an impedance inverter and as a signal coupler. When connected to a fixed load impedance, the transcoupler can also operate as an impedance transformer. The impedance-transformer / inverter functionality of the transcoupler can be used, e.g., to modulate the load of a power amplifier. The signal coupler functionality of the transcoupler can be used, e.g., to generate a corresponding feedback signal indicative of phase and / or amplitude distortions in the amplifier. The use of various embodiments of the transcoupler in an RF circuit can be advantageous, for example, because the transcoupler has a lower insertion loss than a cascade consisting of a prior-art impedance inverter and a prior-art directional coupler, occupies a relatively small area on the printed circuit board, and helps to reduce the per-unit fabrication and operating costs.

A method of forming a self-locating fastener includes determining a shape of a first contoured surface and a shape of a second contoured surface. The method continues by determining an offset of the shape of the first contoured surface and an offset of the shape of the second contoured surface. An inner contoured surface of a fastener is formed having a shape based at least in part on the offset of the shape of the first contoured surface. An outer contoured surface of the fastener is formed having a shape based at least in part on the offset of the shape of the second contoured surface. The fastener is operable to self-locate on the first and second contoured surfaces.

An interconnection retaining a radome upon a periphery of a reflector dish has a plurality of curved channel portions, each of the channel portions provided with an open periphery slot and an open retention slot. The periphery slot dimensioned to receive the peripheries of the radome and reflector dish. The channel portions are arranged end-to-end adjacent to one another, encircling the peripheries of the radome and reflector dish seated within the periphery slot. A gap may be provided between one or more of the channel portions. A link member is seated within the retention slot at an end of each adjacent channel portion. The retention slot at the end of each of the adjacent channel portions is crimped upon the link member. The link member may be, for example, a portion of threaded rod or a molded portion of polymer material.

An improved method for the fabrication of Micro-Electro-Mechanical Systems (MEMS), Nano-Electro-Mechanical Systems (NEMS), Photonics, Nanotechnology, 3-Dimensional Integration, Micro- and Nano-Fabricated Devices and Systems for both rapid prototyping development and manufacturing is disclosed. The method includes providing a plurality of different standardized and repeatable process modules usable in fabricating the devices and systems, defining a process sequence for fabricating a predefined one of the devices or systems, and identifying a series of the process modules that are usable in performing the defined process sequence and thus in fabricating the predefined device or system.

A liquid crystal display device includes an array substrate including: gate and data lines crossing each other to define a pixel region on a first substrate; a thin film transistor connected to the gate and data lines; and first and second height adjusters; an opposing substrate facing the array substrate; a liquid crystal layer between the array substrate and the opposing substrate; a gap spacer corresponding to the first height adjuster and contacting the array substrate and the opposing substrate; a first press-buffer spacer corresponding to the second height adjuster, contacting the opposing substrate and spaced apart from the array substrate; and a second press-buffer spacer contacting the opposing substrate and spaced apart form the array substrate, wherein a distance between the first press-buffer spacer and the array substrate is substantially less than a distance between the second press-buffer spacer and the array substrate.

A semiconductor chip electrical connection structure includes electrode pads formed on a surface of a semiconductor chip, wherein the semiconductor chip is mounted via another surface thereof on a carrier; a plurality of conductive bumps formed on the electrode pads respectively, and exposed from a dielectric layer applied on the semiconductor chip and the carrier; and a plurality of electrical connection pads formed on the dielectric layer and electrically connected to the conductive bumps exposed from the dielectric layer so as to provide outward electrical extension for the semiconductor chip via the electrical connection pads.

A light delivery system to provide light treatment to a patient includes a catheter assembly having a plurality of light sources that transmit light towards a target site within a patient. In one embodiment, the light delivery system has a plurality of light sources mounted to a flexible transparent base that extends at least partially through a distal tip of the catheter assembly. The light sources can be wire bonded or mounted in a flip chip arrangement onto the base. In one embodiment to produce the distal tip, an array of light energy sources can be held by an array of holders of a fixture device. A vacuum is applied to secure each light energy source in a corresponding holder. While the vacuum is applied, the energy sources are electrically connected by wire bonding. The vacuum can be reduced or stopped thereby permitting removal of the light energy sources from the fixture device.

An RF circuit having a transcoupler, a multifunctional RF-circuit element that can operate both as an impedance inverter and as a signal coupler. When connected to a fixed load impedance, the transcoupler can also operate as an impedance transformer. The impedance-transformer / inverter functionality of the transcoupler can be used, e.g., to modulate the load of a power amplifier. The signal coupler functionality of the transcoupler can be used, e.g., to generate a corresponding feedback signal indicative of phase and / or amplitude distortions in the amplifier. The use of various embodiments of the transcoupler in an RF circuit can be advantageous, for example, because the transcoupler has a lower insertion loss than a cascade consisting of a prior-art impedance inverter and a prior-art directional coupler, occupies a relatively small area on the printed circuit board, and helps to reduce the per-unit fabrication and operating costs.

A package structure having MEMS elements includes: a wafer having MEMS elements, electrical contacts and second alignment keys; a plate disposed over the MEMS elements and packaged airtight; transparent bodies disposed over the second alignment keys via an adhesive; an encapsulant disposed on the wafer to encapsulate the plate, the electrical contacts and the transparent bodies; bonding wires embedded in the encapsulant and each having one end connecting a corresponding one of the electrical contacts and the other end exposed from a top surface of the encapsulant; and metal traces disposed on the encapsulant and electrically connected to the electrical contacts via the bonding wires. The present invention eliminates the need to form through holes in a silicon substrate as in the prior art so as to reduce fabrication costs. Further, the present invention accomplishes wiring processes by using a common alignment device to thereby reduce equipment costs.

A backlight module is provided. The backlight module includes a light source and a group of replaceable optical elements. The light source emits a first light. The replaceable optical elements receive the first light and backlight light is then excited, wherein the replaceable optical elements include a first replaceable optical element and a second replaceable optical element. The first replaceable optical element has a first phosphor. The first phosphor can be excited by light and emits second light. The second replaceable optical element has a second phosphor. The second phosphor can be excited by light and emits third light.

Methods, systems, and apparatuses for ball grid array land patterns are provided. A ball grid array land pattern includes a plurality of land pads and electrically conductive traces. The plurality of land pads is arranged in an array of rows and columns. A perimeter edge of the array includes a pair of adjacent oblong shaped land pads. An electrically conductive trace is routed between the pair of adjacent oblong shaped land pads from a land pad positioned in an interior of the array to a location external to the array. The oblong shaped land pads are narrower than standard round land pads, and thus provide more clearance for the routing of traces. The oblong shaped land pads enable more land pads of the land pattern array to be routed external to the array on each routing layer, and thus can save printed circuit board component and assembly costs.

Cells of a composite cell array are cured by placing tool blocks in the cells and inserting thermally conductive elements in each of the tool blocks. The thermally conductive elements are convectively heated by a flow of hot air. The heated conductive elements conduct heat to the tooling blocks, which then conduct heat to the cells to cure the composite and adhesive.

A tunable distributed feedback (DFB) semiconductor laser based on a series mode or a series and parallel hybrid mode. A grating structure of the laser is a sampling Bragg grating based on the reconstruction-equivalent chirp technology. DFB lasers with different operating wavelengths based on the reconstruction-equivalent chirp technology are integrated together by a sampling series combination mode or a series / parallel hybrid mode, one of the lasers is selected to operate via a current, and the operating wavelength of the laser can be controlled by adjusting the current or the temperature, so that the continuous tuning of the operating wavelengths of the lasers can be realized. Various wavelength signals in parallel channels are coupled and then output from the same waveguide. An electrical isolation area (1-11) is adopted between lasers connected in series or lasers connected in series and connected in parallel to reduce the crosstalk between adjacent lasers.

A tendon is assembled in a horizontal orientation using connectors or by welding at a weld station on a barge or other vessel located at or near the installation site of a tension leg platform. During assembly, the tendon is pulled away from the assembly vessel and tensioned by a tug or offshore work vessel. When fully assembled, the tendon may be up-ended in a manner similar to a wet-towed tendon, and then either pre-installed using floats or passed over to a TLP which is on-site and ready to receive tendons.

A liquid crystal display device includes an array substrate including: gate and data lines crossing each other to define a pixel region on a first substrate; a thin film transistor connected to the gate and data lines; and first and second height adjusters; an opposing substrate facing the array substrate; a liquid crystal layer between the array substrate and the opposing substrate; a gap spacer corresponding to the first height adjuster and contacting the array substrate and the opposing substrate; a first press-buffer spacer corresponding to the second height adjuster, contacting the opposing substrate and spaced apart from the array substrate; and a second press-buffer spacer contacting the opposing substrate and spaced apart form the array substrate, wherein a distance between the first press-buffer spacer and the array substrate is substantially less than a distance between the second press-buffer spacer and the array substrate.

An electro-optic device (100) includes a conductive wiring board (110) on one surface of which a plurality of conductive wires (140) are arranged so as not to intersect with each other, and a plurality of optical elements (130) each of which is provided on the board (110), and in which an insulating base member (131), a lower electrode (132), a function layer (133), and an upper electrode (134) are sequentially formed on the board (110). In this device (100), the lower electrode (132) is electrically connected to one of the conductive wires (140); the upper electrode (134) is electrically connected to one of the conductive wires (140) which is not connected to the lower electrode (132); and each of the optical elements (130) is provided such that part of the optical element (130) overlaps with part of one or more of the conductive wires (140) in plan view.

An interconnection retaining a radome upon a periphery of a reflector dish has a plurality of curved channel portions, each of the channel portions provided with an open periphery slot and an open retention slot. The periphery slot dimensioned to receive the peripheries of the radome and reflector dish. The channel portions are arranged end-to-end adjacent to one another, encircling the peripheries of the radome and reflector dish seated within the periphery slot. A gap may be provided between one or more of the channel portions. A link member is seated within the retention slot at an end of each adjacent channel portion. The retention slot at the end of each of the adjacent channel portions is crimped upon the link member. The link member may be, for example, a portion of threaded rod or a molded portion of polymer material.

A composite casing structure is applied to a housing of an electronic device. The composite casing structure includes a plastic frame and a metal plate. The plastic frame has a plurality of side walls surrounding four side edges thereof, and at least one open portion is formed by the side walls. The metal plate is combined with the plastic frame, and at least one reinforcing rib is formed on a surface of the metal plate, such that a position of the reinforcing rib is corresponding to a position of the open portion. With such a structural design, the composite casing has a lightweight and high-strength structure.

Cells of a composite cell array are cured by placing tool blocks in the cells and inserting thermally conductive elements in each of the tool blocks. The thermally conductive elements are convectively heated by a flow of hot air. The heated conductive elements conduct heat to the tooling blocks, which then conduct heat to the cells to cure the composite and adhesive.

An automotive head-up display system with an ordinary windshield comprises an ordinary windshield and a display device, wherein the distance between the inner surface and the outer surface of the ordinary windshield is equal across the ordinary windshield, and the inner surface and the outer surface are non-processed and free of any optical film. The display device includes an image source and an optical imaging module. Compared with the traditional technologies, the automotive head-up display system with an ordinary windshield of the invention can effectively solve the ghost / double image problem and reduce the assembling and production costs of the automotive head-up display system without using the wedged windshield or any optical film.