The application provides a
semiconductor structure manufacturing method, and is applied to the technical field of semiconductors. In the application, a charge induction layer, such as aluminum
oxide, is formed on the back surface of a
semiconductor substrate, such as a
silicon substrate, and then a
field effect passivation layer is formed on the charge induction layer. Due to the high
negative charge effect of aluminum
oxide, the negative
fixed charge of aluminum
oxide can guide the ordered accumulation and
neutralization of holes at the holes on the damaged
silicon surface, reduce the random recombination of holes and electrons, thereby inhibiting the fluctuation of
dark current, and finally improving the RTS
noise. Secondly, due to the low defect density of aluminum oxide, the probability of
carrier capture or release by interface defects and / or bulk defects can be reduced, random current fluctuation can be avoided, and the RTS
noise amplitude can be directly reduced. Furthermore, due to the good
thermal stability of aluminum oxide, the
material structure and electrical properties thereof do not deteriorate within the
working temperature range of the device, and the long-term
noise suppression effect and
dark current stability can be ensured.