The invention discloses a TR
assembly gold
wire bonding process parameter prediction method based on a
multilayer perceptron neural network, and belongs to the technical field of
microwave device intelligent manufacturing. According to the method, an intelligent mapping model of gold
wire bonding geometric parameters and
radio frequency performance is constructed by fusing a multi-layer
perceptron neural network and parameterized
electromagnetic simulation. The method specifically comprises the following steps: generating 45 groups of samples in a process parameter space by adopting Latin
hypercube sampling; obtaining an S parameter
data set through
batch processing electromagnetic simulation; box-Cox conversion and normalization preprocessing are carried out on the data; the method comprises the following steps: constructing an MLP neural
network model of a 3-32-16-2 structure, and determining hyper-parameters by using
Bayesian optimization; and after training is completed, rapid
reverse mapping from target performance to process parameters is realized. According to the method, the number of traditional tests is reduced from more than 200 to 45, the predicted root-mean-
square error of S21 is smaller than or equal to 0.12 dB, the determination coefficient is larger than or equal to 0.96, and the parameter
backstepping time lt is obtained; according to the method, full-process
automation from
simulation, training, optimization to production and issuing is realized, and the development efficiency of the TR component is remarkably improved.