The invention discloses a
chip cooling device which comprises a cooling room positioned at the bottom of the device and matched with the
chip, a cooling liquid pond stored with cooling liquid, a firstmicro channel, a first
micro pump, a second micro channel, a micro
nozzle, a third micro channel, a second
micro pump, a fourth micro channel, a condenser and a micropore, wherein one end of the first
micro pump is communicated with the cooling liquid pond by the first micro channel and the other end is communicated with the micro
nozzle by the second micro channel; the micro
nozzle is arranged above the cooling room and communicated with the cooling room; one end of the second micro pump is communicated with the cooling room by the third micro channel and the other end is communicated with the condenser by the fourth micro channel; the condenser is positioned above the cooling liquid pond and a condensing channel is arranged in the interior of the condenser; and a radiating fin is arranged on the top of the condensing channel which is communicated with the cooling liquid pond by the micropore. The
chip cooling device has small volume,
high heat dissipation efficiency, very high
controllability and working flexibility and can meet the cooling requirements of the chip in different working conditions.