The invention relates to the technical field of rotating target materials, in particular to a centrifugal binding method of a large-size ITO rotating target material, which comprises the following steps: step 1, pretreatment of a contact surface:
degreasing and cleaning the inner wall of the ITO target material and the outer surface of a
metal back tube, and then respectively
sputtering nickel or
copper for metallization treatment, with the thickness of a
sputtering layer being 0.5-2 microns; step 2, assembling and positioning: coaxially assembling to form a 0.1-0.3 mm uniform binding gap, and mounting a sealing check ring; 3, centrifugal binding is conducted, specifically, rotation is conducted at the rotating speed of 800-1500 r / min, high-purity
indium solder at the temperature of 180-200 DEG C is injected, and
inert gas protection is conducted; and 4, cooling molding: cooling to
room temperature at 5-10 DEG C / min. Uniform filling of the
welding flux is achieved through
centrifugal force, the binding rate reaches 99% or above, the binding strength is larger than or equal to 25 MPa, the problems that a large-size target material is large in binding defect number and low in strength are effectively solved, and the method is suitable for industrial production.