68results about How to "Reduced likelihood of cracks" patented technology

A ball grid array type semiconductor package includes a semiconductor chip formed with bonding pads, an elastomer bonded to the semiconductor chip, a flexible wiring substrate bonded to the elastomer and formed with wirings connected at one end of the bonding pads of the semiconductor chip, a solder resist formed on the main surface of the flexible wiring substrate and solder bump electrodes connected to the other ends of the wirings. The elastomer is bonded to the flexible wiring substrate on the side of the tape, the solder resist is formed on the side of the wirings, and the solder bump electrodes are connected with the wirings by way of through holes formed in the solder resist.

The invention discloses a TSV front end portion interconnection process. The process includes preparing a plurality of TSV holes in a substrate by means of the etching technology; preparing insulating layers on the inner walls of the TSV holes and on the surface of the substrate; forming TSV conductive columns in the TSV holes and on the surfaces of the insulating layers through electroplating; eliminating a silicon substrate with a certain thickness including the TSV conductive columns through the CMP technology; carrying out annealing on the TSV conductive columns so that the TSV conductive columns can extrude out of the substrate at a certain height; preparing passivation layers on the substrate and the surfaces of the TSV conductive columns, and eliminating a part of the passivation layers so that the tops of the TSV conductive columns can be exposed out of the passivation layers; preparing a metal interconnection structure of the TSV conductive columns. The TSV front end portion interconnection process reduces or eliminates stress concentration areas at corners of the end portions of the TSV conductive columns, reduces probability that due to stress, delamination and cracks are formed between the insulating layers and the substrate, and meanwhile achieves interconnection of the TSV conductive columns and redistribution layer metal through use of the defect that after the TSV conductive columns are electroplated and processed through annealing, the TSV conductive columns will extrude.

The invention discloses a checkered plate roller. The surface of the roller is provided with lentil-shaped figure pressing grooves and is characterized in that the opening edge of each figure pressing groove is composed of two arcs which are symmetrical to each other, the opening lengths of the figure pressing grooves range from 30 mm to 35 mm, the opening widths of the figure pressing grooves range from 5 mm to 10 mm, the bottoms of the figure pressing grooves in the length direction are of an arc shape, an included angle between the two groove ledge surfaces in each figure pressing groove ranges from 80-85 degrees and the bottoms are smoothly connected by arcs with radii of 1.5-3.5 mm, and the largest depths of the bottoms of the figure pressing grooves range from 4-5 mm. According to the checkered plate roller and a using method thereof, the single engraved roller using times of the checkered plate special roller are increased and the roller consumption is reduced by optimizing the parameters of the figure pressing grooves of the checkered plate roller and the using technology of the roller.

An electronic device includes a first lead, a second lead, a touch sensitive display panel including a screen area and an extended area that extends from the screen area, and a control circuit. The touch sensitive display panel includes a flexible substrate, a thin film transistor (TFT) layer including a plurality of light-emitting elements, an insulation layer in which a via-hole is formed, and atouch sensor. The first lead is formed on the TFT layer in the screen area and the extended area and connects the control circuit and the plurality of light-emitting elements. The second lead is formed on the insulation layer in the screen area and on the TFT layer in the extended area, and extends from the screen area to the extended area through the via-hole formed in the insulation layer and connects the control circuit and the touch sensor.

The invention discloses a preparation process of an Al-Si-Mg-B-Mn casting alloy with excellent fluidity, wherein the composition of the Al-Si-Mg-B-Mn casting alloy is composed of: Si 6.50-7.50 %, Mg 0.25-0.45%, B0.02-0.03%, Mn 1.50-2.00%, Fe≤0.12%, Ti 0.10-0.20%, and the balance is aluminum. The present invention improves the microstructure and properties of the Al-Si alloy through batching, smelting and casting, heat treatment and other technological processes, which can ensure high strength and hardness while improving the fluidity of the alloy and reducing costs, which is beneficial It is widely used in the manufacturing industry of auto parts.

The invention relates to a construction method for a large cast-in-situ reinforced concrete water inlet channel. The construction method comprises the following steps: the construction of concrete near the water inlet channel is divided into five main parts, wherein the construction of the concrete around the water inlet channel adopts integral layered casting, the secondary pouring in the traditional casting process is eliminated, and the integration of the concrete around the water inlet channel is ensured; for the parts at which the concrete at the bottom of the elbow of the water inlet channel is not easily vibrated, a vibration guiding device is bound in advance when the parts pass through the bound steel bars, so that the density of the compact at the bottom is realized, and simultaneously a method for combining supporting and pulling is adopted for reinforcing a water inlet channel template. According to the construction method, the condition that a plurality of more complex construction areas are not mutually influenced can be guaranteed, so that the construction period is shortened, the possibility of large-volume concrete cracks is reduced, and the construction accuracy of the whole water inlet channel, the floating deformation resistance of the template in the construction process and the quality of products are better guaranteed. The construction method can be widely applied in construction of the large cast-in-situ reinforced concrete water inlet channel.

The present invention relates to the technical field of wall panels, and discloses a preparation process for concrete prefabricated wall panels, including the following steps: S1: mold preparation; S2: installation of steel bars; installation of steel bars in the mold after S1 mold preparation; S3: pouring Concrete; pouring concrete towards the mold after S2 treatment; the raw materials of the concrete include by weight: 180-240 parts of cement, 550-630 parts of coarse aggregate, 100-150 parts of fine aggregate, 300 parts of fly ash ‑430 parts, 6‑15 parts of calcium lignosulfonate, 60‑80 parts of water, 20‑40 parts of fatty alcohol polyoxyethylene ether and 13‑37 parts of acrylamide grafted co-polymerized starch; S4: Vibration curing; S3 vibrating and curing the poured concrete; S5: dismantling the mold; S6: continuous curing; after the continuous curing in S6, the concrete prefabricated wall panel is obtained. The manufactured prefabricated wall panels can avoid cracks, thereby improving the compressive strength of the prefabricated wall panels.