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36results about How to "Simplify layout and routing" patented technology

Focal plane assembly capable of realizing same viewing field splicing

InactiveCN102142432AOvercome the disadvantage of splicing missing pixelsAvoid mutual interferenceSolid-state devicesMountingsPrinted circuit boardRemote sensors
The invention discloses a focal plane assembly capable of realizing same viewing field splicing, belonging to the technical field of aerospace optical remote sensors. The focal plane assembly comprises three imaging circuit boards, three photosensitive devices, two reflecting mirrors, two bosses and a structural frame, wherein the three photosensitive devices are respectively positioned on three imaging circuit boards and are distributed on three planes; reflecting mirrors are cross to realize twice reflection and once perpendicular incidence, thereby overcoming the detect that image elementsare leaked when a big-shell photosensitive device is spliced by the traditional two-surface layout; and the physical structures of the photosensitive devices or the circuit board can be prevented from mutually interfering on the splicing direction, the photosensitive surfaces of the three photosensitive devices are connected end to end, and parts of regions of the junction are overlapped so as torealize seamless splicing. According to the focal plane assembly, three (which can be expanded to multiple pieces) photosensitive devices, especially three big-shell devices, can be subjected to seamless same viewing field splicing, the size requirement on an imaging circuit is lowered, the performance is improved, the cost is lowered, and the focal plane size is enlarged so as to enlarge the ground coverage width.
Owner:BEIJING RES INST OF SPATIAL MECHANICAL & ELECTRICAL TECH

A self-powered power supply circuit for a flyback power converter

The invention relates to a self-supply circuit for a flyback power converter. A bus voltage supply module supplies power to a control chip after the bus is powered on. After the control chip is powered on, the primary winding of the transformer is controlled to work by the power supply control module, and the secondary auxiliary winding of the transformer obtains voltage from the coupling of the primary winding to supply power to the secondary winding of the transformer. The power supply module of the secondary winding of the transformer is charged to supply power to the control chip. The switching module turns off the power supply output of the bus voltage supply module to the control chip after the secondary winding power supply module of the transformer is fully charged. After the powersupply module of the secondary winding of the transform is charged, The bus voltage is cut off, and the auxiliary winding supplies power to the control chip alone. If the power supply module of the secondary winding of the transformer fails or the PWM driving output duty ratio of the control chip is small, and the power supply control module is abnormal, etc., the fault recovery can be carried out, and the control chip can not be powered down.
Owner:BEIJING RES INST OF PRECISE MECHATRONICS CONTROLS +1

High-end storage PCIE interchanger and management module thereof

The invention discloses a high-end storage PCIE interchanger and a management module thereof. The management module comprises a substrate and a CPU board card used for controlling and monitoring the PCIE interchanger, the CPU board card is connected with the substrate in a detachable manner, the substrate is provided with an external communication interface providing backboard PCIE signals, and the substrate is also provided with an external output network interface and an external output serial port for the CPU board card. When placement and routing are carried out to the management module of the high-end storage PCIE interchanger, placement and routing are carried out to the CPU board card and the substrate, the CPU board card and the substrate are modularized in design, and placement and routing are simpler. When the high-end storage PCIE interchanger is upgraded later, only the CPU board card needs to be upgraded again, placement and routing are carried out to the CPU board card again, then the upgraded new CPU board card is connected to the substrate, placement and routing of communication interfaces, output network interfaces and serial ports are avoided, the placement and routing difficulty level is further reduced, and the research and development cost is reduced at the same time.
Owner:INSPUR BEIJING ELECTRONICS INFORMATION IND

High-precision magnetic field detection and decoding circuit based on CAN bus

The invention discloses a high-precision magnetic field detection and decoding circuit based on a CAN bus. Bipolar magnetic steel is designed and arranged in a rudder shaft, the magnetic steel rightlyfaces a magnetic coding chip, and the coding chip measures a rotating magnetic field; a special SSC interface is used for sending a measuring result to a main control chip MCU; and the MCU completesreceiving and decoding of the magnetic field to obtain a corresponding rotating angle of the rudder shaft. After the MCU completes calculation, digital signals are sent to a servo control circuit in real time through a CAN bus control module, and closed-loop control over a servo system is achieved. According to the high-precision magnetic field detection and decoding circuit based on the CAN bus,non-contact measurement of a system is achieved by adopting a non-contact measuring method based on magnetic field detection and decoding, and the working reliability of a product is improved. The difficulty of circuit design is greatly lowered based on a CAN bus communication mode, circuits can be implemented more easily in the distributing and wiring process, the space size of a circuit board can be effectively saved, and meanwhile the circuit design cost can be effectively saved.
Owner:贵州航天控制技术有限公司

High-frequency and high-speed electronic circuit board based on high thickness-radius ratio deep hole electroplating technology

The invention discloses a high-frequency and high-speed electronic circuit board based on a high thickness-radius ratio deep hole electroplating technology. The high-frequency and high-speed electronic circuit board comprises a master control board and a signal transmission module, wherein the master control board comprises a receiving chip and a driving chip and adopts a double-sided flexible circuit board, a polyester resin material is further arranged on an outer surface of the master control board, a printed circuit board with high reliability and relatively high flexibility is fabricated by taking the polyester resin material as a substrate, four holes are drilled in an upper right end of the master control board, an output end of the master control board is connected with a voltage regulation module and a rectification module, the voltage regulation module is connected with a pulse generation module through a receiving end signal detection module, a signal transmission module is connected with a signal detection module, and the signal detection module is connected with a DC-DC converter. The circuit board has high heat dissipation, light weight, miniaturization and thinness are achieved by reducing a size, so that a component device and a wire are integratedly connected.
Owner:信丰共赢发展电子有限公司

A high-frequency and high-speed electronic circuit board based on high-thickness-diameter ratio deep-hole electroplating technology

The invention discloses a high-frequency and high-speed electronic circuit board based on a high thickness-radius ratio deep hole electroplating technology. The high-frequency and high-speed electronic circuit board comprises a master control board and a signal transmission module, wherein the master control board comprises a receiving chip and a driving chip and adopts a double-sided flexible circuit board, a polyester resin material is further arranged on an outer surface of the master control board, a printed circuit board with high reliability and relatively high flexibility is fabricated by taking the polyester resin material as a substrate, four holes are drilled in an upper right end of the master control board, an output end of the master control board is connected with a voltage regulation module and a rectification module, the voltage regulation module is connected with a pulse generation module through a receiving end signal detection module, a signal transmission module is connected with a signal detection module, and the signal detection module is connected with a DC-DC converter. The circuit board has high heat dissipation, light weight, miniaturization and thinness are achieved by reducing a size, so that a component device and a wire are integratedly connected.
Owner:信丰共赢发展电子有限公司

Focal plane assembly capable of realizing same viewing field splicing

InactiveCN102142432BOvercome the disadvantage of splicing missing pixelsAvoid mutual interferenceMountingsPrinted circuit boardRemote sensors
The invention discloses a focal plane assembly capable of realizing same viewing field splicing, belonging to the technical field of aerospace optical remote sensors. The focal plane assembly comprises three imaging circuit boards, three photosensitive devices, two reflecting mirrors, two bosses and a structural frame, wherein the three photosensitive devices are respectively positioned on three imaging circuit boards and are distributed on three planes; reflecting mirrors are cross to realize twice reflection and once perpendicular incidence, thereby overcoming the detect that image elements are leaked when a big-shell photosensitive device is spliced by the traditional two-surface layout; and the physical structures of the photosensitive devices or the circuit board can be prevented from mutually interfering on the splicing direction, the photosensitive surfaces of the three photosensitive devices are connected end to end, and parts of regions of the junction are overlapped so as to realize seamless splicing. According to the focal plane assembly, three (which can be expanded to multiple pieces) photosensitive devices, especially three big-shell devices, can be subjected to seamless same viewing field splicing, the size requirement on an imaging circuit is lowered, the performance is improved, the cost is lowered, and the focal plane size is enlarged so as to enlarge the ground coverage width.
Owner:BEIJING RES INST OF SPATIAL MECHANICAL & ELECTRICAL TECH

Integrated on-chip surge protection circuit

The invention provides a surge protection circuit integrated in a chip. The surge protection circuit integrated in the chip comprises a main bleeder circuit and a quick detection circuit. The main bleeder circuit comprises a first diode, a second diode, a second resistor and a first MOS (metal oxide semiconductor) tube. A cathode of the first diode is connected with a power end, an anode of the first diode is grounded through the second resistor, and a node between the first diode and the second resistor is a first node. A first connection end of the first MOS tube is connected with the power end, a second connection end of the first MOS tube is grounded, and a control end is connected with the first node. The quick detection circuit comprises a capacitor, a first resistor, a third diode and a second MOS tube. The capacitor is connected between the power end and the third diode, an anode of the third diode is grounded, and a node between the third diode and the capacitor is a second node. A first connection end of the second MOS tube is connected with the power end, a second connection end of the second MOS tube is connected with the first node, and a control end is connected with the second node. Compared with the prior art, the surge protection circuit integrated in the chip has the advantage that surge protection of an internal circuit of the chip can be realized.
Owner:WUXI ETEK MICROELECTRONICS

A point-to-multipoint udp real-time data transmission and confirmation method based on fpga

The invention discloses an FPGA-based method for transmitting and confirming UDP real-time data from a point to multiple points, which comprises the following steps: (1) firstly, a real-time data collecting and controlling system, which is composed of a plurality of process-quantity collecting and controlling terminals, an FPGA-based communication controlling device and one or multiple upper-layer data processing devices, is established; (2) Secondly, a universal network interface card and a real-time operating system (RTOS) are configured in an industrial personal computer system so as to constitute the upper-layer data processing devices; (3) an ACK field is added into the header of application data of a UDP datagram which is from the communication controlling device to the upper-layer data processing devices; (4) after receiving the UDP datagram of the upper-layer data processing devices, the communication controlling device transmits and arbitrates the UDP datagram; and (5) after receiving the UDP datagram, the data processing devices check the self-related values in the ACK field; if the value is 1, then the current frame is confirmed, otherwise, the current frame is retransmitted after the timer overflow is sent.
Owner:NANJING PANENG TECHNOLOGY DEVELOPMENT CO LTD

Partially-depleted silicon-on-insulator triode structure

The invention provides a partially-depleted silicon-on-insulator triode structure. The partially-depleted silicon-on-insulator triode structure comprises a buried oxygen layer, a collector electrode region, a base region, an ultra-shallow trench isolation region, a base electrode region and a collector electrode contact region, wherein the buried oxygen layer is arranged on a substrate, the collector electrode region is arranged on the buried oxygen layer, the base region is located on the collector electrode region, the ultra-shallow trench isolation region and the base electrode region are arranged on the two sides of the base region respectively, and the collector electrode contact region is arranged on the side, opposite to the base region, of the ultra-shallow trench isolation region; the doping concentration of the collector electrode contact region is larger than that of the collector electrode region, the collector electrode region is connected with the collector electrode contact region, and the collector electrode contact region, the ultra-shallow trench isolation region, the base region and the base electrode region are located on the surface of a silicon wafer. Moreover, the partially-depleted silicon-on-insulator triode structure further comprises a polycrystalline silicon emitting electrode arranged on the surface of the silicon wafer.
Owner:SHANGHAI HUAHONG GRACE SEMICON MFG CORP

Layout and wiring method, device and equipment and readable storage medium

The invention discloses a layout and wiring method and device, equipment and a readable storage medium. According to the method and the device, for the functional module of which the data processing logic is matched with the star topology structure, the constraint modes with different constraint capabilities can be utilized to constrain each sub-module in the functional module to perform layout and wiring according to the star topology structure, so that each layout and wiring result is obtained; then, the layout wiring result meeting the preset index requirement is selected from all the layout wiring results to serve as the layout wiring scheme of the function module, layout wiring in the module can be simplified, the probability of occurrence of problems such as winding congestion, short circuit, time delay and function errors is reduced, line resources, chip power consumption and chip area are saved, and the production efficiency is improved. And a layout and wiring scheme meeting the preset index requirement can be selected, so that the performance, manufacturability and time sequence convergence effect of the chip can be improved. Correspondingly, the invention also provides a layout and wiring device, equipment and a readable storage medium, which also have the above technical effects.
Owner:山东云海国创云计算装备产业创新中心有限公司

Power supply system and power supply method in sdi mode

The invention relates to a power supply system and a power supply method in SDI mode. The system includes a control module and an SDI power supply module connected to the control module. The SDI power supply module detects the voltage and current signals input by the connected video input device and transmits them to the control module, and then the control module detects the voltage and current according to the detection module. The signal controls the working mode of the SDI power supply module; the SDI power supply module includes a power supply switch, a power switch, a first power supply, a second power supply and a first resistor, and one end of the power supply switch is respectively connected to the first power supply and the second power supply through the power supply switch , the other end of the power supply switch is connected to the first resistor, and the SDI power supply module realizes detection of voltage and current signals input by the video input device through the first resistor. The invention can reduce the wiring of the video monitoring, can realize the power supply of the camera and the signal transmission of the video by using a coaxial cable, improves the reliability of the system work and simplifies the layout and wiring of the system.
Owner:FUJIAN FORECAM OPTICS CO LTD

A self-sufficient power supply circuit for flyback power converter

The invention relates to a self-supply circuit for a flyback power converter. A bus voltage supply module supplies power to a control chip after the bus is powered on. After the control chip is powered on, the primary winding of the transformer is controlled to work by the power supply control module, and the secondary auxiliary winding of the transformer obtains voltage from the coupling of the primary winding to supply power to the secondary winding of the transformer. The power supply module of the secondary winding of the transformer is charged to supply power to the control chip. The switching module turns off the power supply output of the bus voltage supply module to the control chip after the secondary winding power supply module of the transformer is fully charged. After the powersupply module of the secondary winding of the transform is charged, The bus voltage is cut off, and the auxiliary winding supplies power to the control chip alone. If the power supply module of the secondary winding of the transformer fails or the PWM driving output duty ratio of the control chip is small, and the power supply control module is abnormal, etc., the fault recovery can be carried out, and the control chip can not be powered down.
Owner:BEIJING RES INST OF PRECISE MECHATRONICS CONTROLS +1
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