73results about How to "Solve heat dissipation difficulties" patented technology

The invention discloses a piece of parallel light curing equipment with staggered area array light sources. The parallel light curing equipment comprises a conveying device, an area array light source curing device, a cooling device, a light source control device and a working table, wherein the cooling device is connected with the area array light source curing device, the light source control device is connected with the area array light source curing device, and the area array light source curing device is installed on the working table. The working table comprises a trolley. The trolley is movably arranged inside the working table. A longitudinal guiding rail and a guiding rail driving mechanism are arranged at the upper portion of the trolley. The area array light source curing device is arranged on the guiding rail of the trolley. The conveying device fixes a workpiece to be cured in a vacuumized mode and conveys the workpiece to be cured to the portion over the area array light source curing device or the portion under the area array light source curing device. The invention further discloses a curing method by utilizing the curing equipment. According to the parallel light curing equipment with the staggered area array light sources and the curing method, due to the fact that the staggered movements of the area array light sources and the workpiece are controlled, the evenness of curing is improved, and due to the fact that a condensing lens converts UV light beams into parallel light, the curing efficiency and precision are improved.

The invention discloses a transformer cooling coil structure. The cooling coil structure also comprises a conductive cooling circulating structure, wherein the conductive cooling circulating structure comprises a connecting pipe, a conductive wire section, a comprehensive pipe, an outer cooling pipe, a four-way valve and a refrigeration device, the outer cooling pipe is arranged at a peripheral enclosure turn of a low-voltage coil, an outer pipe clamping groove is formed in the inner side pipe wall of the outer cooling pipe, the outer pipe clamping groove is clamped on the low-voltage coil, the low-voltage coil and the outer cooling pipe are fixed, the connecting pipe, the conductive wire section, the comprehensive pipe and the outer cooling pipe are respectively connected into the four-way valve so as to realize the interconnection, one end of the conductive wire section is connected with a low-voltage connector, the other end of the low-voltage coil is connected with the comprehensive pipe in the four-way valve, the connecting pipe is connected with the refrigeration device, the low-voltage coil is a hollow coil, a coil hollow cavity is formed inside the low-voltage coil, the low-voltage coil, the comprehensive pipe and the connecting pipe collectively form a closed pipeline, and under the action of the refrigeration device, cooling insulation gas circularly flows in the closed pipeline. The transformer cooling coil structure has the advantages of good cooling effect, double heat dissipation functions and simple structure.

Disclosed is an electronic product frame integrally-formed structural part. The electronic product frame integrally-formed structural part comprises a carbon fiber sheet material outer frame made from carbon fiber sheet materials and a metal inner frame made from metal, wherein the carbon fiber sheet material outer frame and the metal inner frame are integrally formed into one body through an injection molding carbon fiber resin composite material. The manufacturing method for the electronic product frame integrally-formed structural part comprises the steps of manufacturing the carbon fiber sheet material outer frame; manufacturing the metal inner frame; and putting the carbon fiber sheet material outer frame and the metal inner frame into an injection molding die, and enabling the carbon fiber sheet material outer frame and the metal inner frame to be combined and formed into one body through the injection molding carbon fiber resin composite material. By adoption of the electronic product frame integrally-formed structural part and the manufacturing method therefor, light and thin overall machine structure, high strength, low weight, and high forming precision can be realized, so that the frame body complex structure can be realized by a simple process in a low-cost and high-quality manner.

Provided are a built-in nanometer channel cooling quantum cascade semiconductor laser and a preparation method thereof, belonging to the novel quantum cascade laser technical field. The laser comprises: diversion apertures, built-in nanometer channels, a terahertz quantum cascade laser core layer and a substrate. The terahertz quantum cascade laser core layer comprises an optical waveguide and non-luminance chip areas, and is prepared on the substrate; the diversion apertures are prepared in the non-luminance chip areas, and have depths deep enough to penetrate a plurality of built-in nanometer channels in a terahertz quantum cascade laser, and less than the depth sum between the terahertz quantum cascade laser core layer and the substrate. The laser directly cools chips, has high efficiency, and avoids the heat dissipation difficulty caused by thermal resistance of the substrate. The built-in nanometer channels can be prepared on the substrate, and can also be prepared in a semiconductor laser core layer. Appropriate work substances are selected to realize the operation of the terahertz quantum cascade laser under different temperatures.

The invention relates to the technical field of optical communication, in particular to a heat dissipation mainboard and an optical module. The heat dissipation mainboard is used for packaging a chipand comprises a circuit board and a heat dissipation piece. The heat dissipation piece is located on one side of the circuit board. The chip is arranged on the other side of the circuit board. A heatdissipation through hole is formed at a position, corresponding to the chip, of the circuit board and penetrate through the two sides of the circuit board. At least one part of the heat dissipation piece extends into the heat dissipation through hole and can make contact with the chip, so that heat generated when the chip works can be transmitted out, heat transfer resistance is reduced. The effective heat dissipation is achieved on the chip. The problem that a COB bare chip is difficult to dissipate heat is solved. The optical module comprises the heat dissipation mainboard, a chip and a shell. The heat dissipation mainboard and the chip are located in the shell. The heat dissipation piece of the heat dissipation mainboard makes contact with the chip and the shell respectively so that heat generated by the chip can be rapidly transmitted to the shell. Therefore, the effect of efficient heat dissipation is achieved.

The invention discloses an automobile headlamp; the automobile headlamp comprises a lamp base, and a high beam, a low beam, a daytime running lamp and a steering lamp which are arranged in the lamp base, wherein the lamp base is provided with heat dissipation through holes; the high beam comprises a first luminous body, a mounting base plate and a first heat dissipation part; the first luminous body and the first heat dissipation part are respectively arranged at the two sides of the mounting base plate; the first heat dissipation part comprises a heat dissipation section and a cooling fan; the heat dissipation section comprises a first end and a second end; the first end is connected with the mounting base plate; and the cooling fan is arranged on the second end. The automobile headlamp is good in heat dissipation and in accordance with the requirements for the light distribution of automobile lamps in China.

The invention discloses a low-voltage high-current Mosfet power module. The low-voltage high-current Mosfet power module comprises an all-copper heat dissipation substrate, a ceramic plate, a driving protection circuit board and Mosfet chips; every two Mosfet chips are connected in parallel, so that a Mosfet chip array can be formed; the driving protection circuit board and the ceramic plate are both fixed on the all-copper heat dissipation substrate; the Mosfet chip array is fixed on the ceramic plate; the drain of each of the Mosfet chips is welded onto the ceramic plate; the gate and source of each of the Mosfet chips are connected with the driving protection circuit board; and the driving protection circuit board is used for outputting positive and negative voltage driving signals to the Mosfet chip array according to external on-off signals. According to the low-voltage high-current Mosfet power module of the invention, the all-copper heat dissipation substrate and the ceramic plate are combined together, so that the problem of difficult heat dissipation can be effectively solved; a large-area current channel can be provided; and the plurality of Mosfet chips are simultaneously driven, so that current passing through the low-voltage high-current Mosfet power module can exceed 3000A.

The invention provides a structure of a main transformer composed of multiple transformers in inverter power sources. The structure comprises a plurality of transformers, primary windings of the plurality of transformers are mutually connected in parallel, and secondary windings are connected in series to serve as secondary outputs. The primary windings use enameled wires to wind on frameworks which are fixed on printed circuit boards (PCBs); wires are printed in the PCBs, copper bars are welded on the PCBs, and copper bars are connected with wires in the PCB to form secondary windings of the transformers together; and magnetic cores are sleeved on peripheries of the copper bars and pressed tightly with the copper bars, and the frames are surrounded inside the magnetic cores. The structure has the advantages that the secondary windings of the main transformer are connected in series, uneven flow phenomena caused by parallel usage of main transformers in inverter power sources are overcome, and reliabilities of main circuit are improved; copper bars and PCBs are combined to form secondary windings, so that heat-dissipation problem of primary windings and secondary windings in transformers and fixing problems of the main transformer are solved; and heat dissipation of the main transformer and whole inverter power source circuits is facilitated, and reliabilities of inverter power source circuits are improved.

The invention discloses an electronic device's waterproof and drop-proof shell and its preparation method. The shell comprises a carbon fiber sheet structure, an injection molding structure integrally formed on the back surface and the periphery of the carbon fiber sheet structure, a soft rubber protection structure integrally formed on the front surface of the carbon fiber sheet structure, and a silicone waterproof structure integrally molded on the injection molding structure. The carbon fiber sheet structure is integrated with the injection molding structure to form a shell structure with a fixed appearance; a portion of the injection molding structure wraps the peripheral side of the carbon fiber sheet structure while the other portion of the injection structure forms an assembly structure on the back surface of the shell structure; the silicone waterproof structure is formed on the assembly structure so that when the assembly structure is assembled with corresponding structural parts, watertight sealing can be achieved for the elasticity of the silicone waterproofing structure and the interference fit of corresponding assembly components. As a result, it is possible to provide an electronic product shell which is thin in thickness, high in strength, light in weight, capable of realizing its complex structure with a simple process, and has excellent drop resistance and water resistance.

The invention discloses a preparation method of a vertical-structure purple light LED chip. The preparation method is characterized by taking a substrate provided with a low-temperature u-GaN repairing layer and a base as a growth foundation, then sequentially growing epitaxies of other layers at the smooth surface of the u-GaN repairing layer so as to acquire a purple light LED epitaxial wafer; and finally preparing the purple light LED epitaxial wafer into a vertical-structure LED. The process of preparing the purple light LED epitaxial wafer into an LED with a vertical structure mainly comprises the steps of performing deposition at the surface of the LED epitaxial wafer to form a reflector, preparing a metal electrode pattern, bonding the surface of the metal electrode pattern to a metal base plate by using a high-temperature metal bonding technology, and de-bonding the substrate by using a laser de-bonding technology; preparing another metal electrode pattern at the surface of the u-GaN repairing layer. The prepared vertical-structure LED single chip is high in power, the number of series-parallel connection LEDs is reduced, and user requirements can be met by the single chip. Meanwhile, the design of a driving circuit is simplified, and reliability of an LED product is greatly improved, and the service life of the LED product is greatly prolonged.

The embodiment of the invention discloses an LED (Light-Emitting Diode) constant-current source which is used for solving the problem that heat of an LED lamp T2 is difficult to radiate. The LED constant-current source provided by the embodiment of the invention comprises a direct-current input end T1, the LED lamp T2, an MOS (Metal Oxide Semiconductor) tube T3, a DC (Direct-Current)/DC circuit T4, a constant-current control circuit T5, a controller T7 and a voltage fine turning control module T8, wherein the direct-current input end T1 is connected with the LED lamp T2; the LED lamp T2, the MOS tube T3 and the DC/DC circuit T4 are sequentially connected; the MOS tube T3 is connected with one end of the DC/DC circuit T4; the other end of the DC/DC circuit T4 is grounded; the controller T7 is connected with the MOS tube T3 through the constant-current control circuit T5; and the voltage fine turning control module T8 is connected with the DC/DC circuit T4. With the adoption of the LED constant-current source provided by the invention, the problem that the heat of the LED lamp T2 is difficult to radiate can be effectively solved.

The invention belongs to the field of LED (light-emitting diode) lamps, in particular to an LED lamp heat radiation method and a heat radiation structure thereof. An oil-cooling-method LED lamp manufacturing method comprises the steps: a paper substrate coated with clear coatings is placed between a light-transmitting lampshade and a sealing shell, and a power supply interface of the paper substrate is led out of the sealing shell; the light-transmitting lampshade and the sealing shell are sealed and fixed; paraffin oil is injected into the inner part of the sealing shell by virtue of an oil inlet; lamp beads of the paper substrate are powered on continuously by virtue of the power supply interface; the oil inlet is immediately closed off when the temperature of the paper substrate is raised to boil the paraffin oil; the cooled paraffin oil forms vacuum in the sealing space. An oil-cooling-method LED lamp comprises the sealing shell, the light-transmitting lampshade, the paper substrate and the lamp beads arranged on the paper substrate; each paper substrate surface is coated with one clear coating, a gap between the sealing shell and the light-transmitting lampshade is filled with the paraffin oil, and the coatings seal the whole paper substrate and insulate the paper substrate from the outside. The oil-cooling-method LED lamp manufacturing method and the LED lamp thereof have the advantages of simple structure, high heat radiation effect and low cost.

The invention belongs to the field of machining of sawing machines with circular saw blades, and in particular, discloses a door sheet cutting saw. The door sheet cutting saw comprises a motor and a disc; and the center of the disc is connected to an output end of the motor. The door sheet cutting saw further comprises a liquid storage box and multiple saw tooth units; the saw tooth units are distributed at the periphery of the disc; a cavity is formed in the disc, and is communicated with the liquid storage box; a one-way valve from the liquid storage box to the cavity is arranged between the cavity and the liquid storage box; an energy storer is arranged in the liquid storage box; an overflow valve is arranged in the cavity; the saw tooth units include hydraulic cylinders; pressing parts with inclined surfaces are arranged on piston rods of the hydraulic cylinders, and are provided with saw teeth; and the hydraulic cylinders are communicated with the cavity. The door sheet cutting saw solves the problem of difficult heat dissipation of the saw blades.

The invention provides a server cabinet. The server cabinet comprises a rack, a plurality of layers of fan sets and two power sources. A plurality of layers of servers are placed in the rack. Each fan set comprises two fans which are arranged on the back portion of the rack side by side, one fan of each fan set is electrically connected to one power source, and the other fan of each fan set is electrically connected to the other power source. The invention further provides a fan power source connecting method applied to the server cabinet. According to the server cabinet, the two power sources are provided for supplying power to different fans in the common fan sets, when one power source breaks down, the phenomenon that the two fans in each fan set stop rotating at the same time so that the servers cannot radiate easily is effectively avoided, and radiating of the servers even cannot be affected.

The invention belongs to the field of machining of sawing machines with circular saw blades and particularly discloses a circular saw used for cutting a door plank. The circular saw used for cutting the door plank comprises a motor and a disc. The center of the disc is connected with the output end of the motor. The circular saw further comprises multiple sawtooth units. A first cavity and a second cavity are formed in the disc. Each sawtooth unit comprises a hydraulic cylinder, a first piston rod, a second piston rod and a piston, wherein two overflow valves and two one-way valves from the second cavity to the hydraulic cylinder are arranged on the hydraulic cylinder. Liquid outlets of the overflow valves are connected with the first cavity. The pistons are located in the hydraulic cylinders. The first piston rods and the second piston rods are installed on the two sides of the pistons correspondingly. The first pistons are provided with first pressing parts with slants, the second piston rods are provided with second pressing parts with slants, and sawteeth are arranged on the first pressing parts and the second pressing parts. According to the scheme, the problem of difficult heat dissipation of the saw blades is solved.