91 results about "Grounded capacitor" patented technology

The invention provides a broadband low-noise amplifier based on a three-coil coupling transformer. The broadband low-noise amplifier comprises an input matching network, a common-source differential output driving stage amplifier, an inter-stage matching network, a common-source differential output power stage amplifier and an output matching network which are connected in sequence, broadband matching is realized by using the input matching network and the inter-stage matching network, and the effective transconductance of the transistor is improved; through the cross-coupled capacitors, the LNA gain and stability on a broadband are improved, better isolation is realized, and input and output are decoupled; due to the design of the grounding capacitor, the linearity of the LNA is improved; through the combination of the three-coil coupling transformer and the differential topology, output signals are superposed in the same direction at the output end, and noise is cancelled in the reverse direction at the output end, so that the thermal noise is greatly inhibited, the isolation is improved through the output matching network, the insertion loss is reduced, and the output matching performance is optimized.

The invention provides a power management and power consumption control device and method of a continuous blood glucose detection circuit. Relates to the technical field of continuous blood glucose detection, solves the problems of power consumption control and switching in the prior art, and is characterized in that a power input end of a charge pump is connected with an anode of an external power supply; the control input end of the charge pump is connected with a mode control signal end; the power output end of the charge pump is connected with the first control end of the power switch device; the switching signal control end of the charge pump is connected with the second control end of the power switching device through the delayer; the output end of the power switch device is connected with the working voltage input end, and the working voltage output end is connected with the grounding capacitor; the power output end of the charge pump is connected with the input end of the power-on reset module, the power switch switching signal end of the power-on reset module is connected with the power switch switching signal end of the charge pump, and different working modes can be achieved, so that power consumption control is achieved.

A noise filter (1) comprises: a first ground capacitor (210) that is between a positive electrode bus bar (6) and the ground side, passes through the positive electrode bus bar and positive electrode wiring (610), and is connected to the ground side via ground wiring (810); and a second ground capacitor (220) that is between a negative electrode bus bar (7) and the ground side, passes through the negative electrode bus bar and negative electrode wiring (710), and is connected to the ground side via the ground wiring. The positive electrode wiring and the negative electrode wiring are each stacked and arranged with respect to the ground wiring. The first ground capacitor and the second ground capacitor are arranged on one end side of each wiring of the positive electrode wiring, the negative electrode wiring, and the ground wiring which are stacked and arranged, and a first connection part between the positive electrode bus bar and the positive electrode wiring, a second connection part between the negative electrode bus bar and the negative electrode wiring, and a third connection part between the ground side and the ground wiring are arranged on the other end side of said each wiring.

The invention discloses an insulation resistance testing device and a control method thereof. The testing device comprises a voltage measurement module, a switching module, a control module, a grounding terminal, a shielding terminal, two first current detection modules and two first measurement terminals. The switching module is used for changing a switching mode according to the control signal so as to connect the voltage-dividing capacitor or the ground capacitor to the test device for insulation resistance measurement; the first current detection module is used for detecting the current value of the branch; the voltage measurement module is used for measuring a voltage value between the first end of the switching module and the first end of the current detection module; the control module is used for calculating the insulation resistance of the ground capacitor and the insulation resistance between the voltage dividing capacitors according to the voltage value measured by the voltage measurement module and the current value measured by the first current detection module. All insulation resistance values of the CVT can be tested only through one-time test wiring, the operation is simple, and the working efficiency is improved.

The invention provides a power divider and microwave equipment, and relates to the power distribution technology, and the power divider comprises a substrate, a plurality of terminal electrodes disposed on the outer side of the substrate, and a plurality of inner electrodes disposed on the inner side of the substrate. The plurality of terminal electrodes comprise an input electrode, at least two output electrodes and at least one grounding electrode; the plurality of inner electrodes comprise a grounding metal plate and two power division assemblies connected with the input electrode in parallel, each power division assembly comprises a filtering inductor, a first grounding capacitor and a conductive piece, the first grounding capacitors and the filtering inductors are arranged at intervals in the reference direction, and the first grounding capacitors and the grounding metal plate are arranged in a stacked mode in the reference direction; all the first grounding capacitors can be close to the grounding metal plate and are jointly connected to the same grounding metal plate, the number of the grounding metal plates arranged in the base body is reduced, the process design difficulty and production cost of the power divider are reduced, the distance between the filter inductor and the first grounding capacitors is increased, and the power divider is more compact. And the parasitic effect generated between the grounding capacitor and the filter inductor is reduced.

The invention provides a superconducting parameter amplifier and a preparation method thereof, and the superconducting parameter amplifier comprises a Josephson junction array which is used for providing resonance nonlinearity; the ground capacitor is used for impedance matching; the linear cavity is used for phase matching; the coupling capacitor is used for coupling the linear cavity and the Josephson junction array; the first end of the Josephson junction array is connected with a signal source and used for receiving a pumping signal and an input signal, the second end of the Josephson junction array is connected with the first end of the ground capacitor and the first end of the coupling capacitor, the second end of the ground capacitor is grounded, the second end of the coupling capacitor is connected with the first end of the linear cavity, and the second end of the linear cavity is grounded. By optimizing the design and preparation process of the superconducting parameter amplifier, the linear cavity and the coupling structure are effectively improved, and the frequency response range of the superconducting parameter amplifier is greatly expanded, so that the quality of microwave quantum optics and superconducting quantum bit measurement signal processing can be effectively improved.

A phase-locked loop circuit includes an oscillator including a plurality of capacitor cells, and a control logic circuit that receives an output from the oscillator. The control logic circuit compares a target frequency with a first frequency of a first signal output from the oscillator, generates a first input code to control at least a portion of the plurality of capacitor cells to output a signal having the target frequency based on the comparison, generates a first output code corresponding to the first input code when the first input code is within a predetermined range of input codes, and controls at least two capacitor cells from among the plurality of capacitor cells based on the first output code. The oscillator may output a second signal having a second frequency through an electrical path including capacitor cells other than grounded capacitor cells from among the plurality of capacitor cells.

The application discloses a kind of hand-off detection method, system, controller and device of steering wheel, it is related to detection field, comprising: the first end and the second end of control sampling capacitor are connected with power supply first preset time, to be charged to ground capacitor and sampling capacitor, and obtain first voltage by acquisition end;The second end of control sampling capacitor is connected with ground first preset time, to be discharged to ground capacitor and sampling capacitor, and obtain second voltage by acquisition end;When the absolute value of the difference of first voltage and second voltage is greater than preset value, determine that the hand of user has not left steering wheel.By sampling capacitor and the detection of the capacitance of ground capacitor by controller, without integrated chip, can be changed by changing the capacitance of sampling capacitor to achieve change parameter, the degree of freedom of configuration is improved.At the same time, only by charging and discharging of the same time to determine the capacitance of ground capacitor and then determine whether the hand of user leaves steering wheel, the process of test is simpler.

A multi-feed antenna with a shared radiator comprises a ground capacitor, a first antenna module, a second antenna module, a first feed-in module, a second feed-in module and at least one sensing module. The first antenna module is grounded through the ground capacitor. The second antenna module is coupled with the first antenna module. The first feed-in module and the second feed-in module are connected with the second antenna module, and the first feed-in module and the second feed-in module are used to receive or send radio frequency signals through the first antenna module and the second antenna module. The at least one sensing module is connected with the first antenna module or the second antenna module, and the at least one sensing module is used to sense a capacitance value of a parasitic capacitance of the first antenna module or the second antenna module.

The utility model discloses a miniaturized LTCC low-pass filter with high out-of-band rejection, and the interior of a ceramic substrate is provided with an inner electrode, three inductors of an inductor layer and three parallel capacitors of a first capacitor layer form three resonators, and three transmission zero points are formed; the second capacitor layer and the third capacitor layer form a cross coupling capacitor, the third capacitor layer and the grounding layer form four grounding capacitors, and the three resonators are connected with one another and form a seven-order low-pass filter together with the four grounding capacitors; the bottom of the ceramic substrate is provided with an external electrode port, the external electrode port comprises two input / output ports and a grounding electrode port, the resonators are connected with the input / output ports, and the grounding capacitor is connected with a grounding point and the ports. According to the technical scheme, high suppression of multiple frequency multiplication is achieved, high-frequency warping points are suppressed, high-frequency stop-band suppression of the filter is improved, and the filter has the advantages of being small in size, low in loss, high in integration level, high in reliability and capable of being produced on a large scale.

The invention discloses a capacitor for high-voltage power transmission and distribution, which comprises a capacitor bank, a bypass switch, a bus voltage monitoring device and a bypass switch control device, and is characterized in that one end of the capacitor bank is connected with an alternating current bus, and the other end of the capacitor bank is grounded; the capacitor bank comprises a first capacitor unit and a second capacitor unit which are connected in series, and the bypass switch is connected in parallel with the second capacitor unit; the bus voltage monitoring device is connected with the AC bus and the bypass switch control device. The bypass switch control device is connected with the bypass switch; a bus voltage monitoring device monitors the voltage of an alternating current bus in real time to obtain real-time voltage data and transmits the real-time voltage data to a bypass switch control device; the bypass switch control device controls the bypass switch to be turned on or turned off according to the received real-time voltage data, so that the first capacitor unit and the second capacitor unit are connected to the alternating current bus, and the voltage supporting capacity when the voltage of the power grid is reduced due to disturbance is improved.

A display device is provided, including a circuit board, a display panel, a plurality of clock signal lines, and a plurality of grounding capacitors. The display panel is connected to the circuit board. Each clock signal line extends from the circuit board to the display panel. The plurality of grounding capacitors are disposed on the circuit board. Each grounding capacitor is connected to a corresponding clock signal line.

In a π-type noise filter using a common-mode choke coil, a simple structure is used to suppress deterioration of electromagnetic interference caused by a grounded capacitor. A resistor (54) of a noise filter (50) is arranged between a first input terminal (51a) and a second input terminal (51b) of a common-mode choke coil (51) and a ground line (EC). The resistor (54) is arranged so that current flowing between the first input terminal (51a) and the second input terminal (51b) of the common-mode choke coil (51) and a first output terminal (51x) and a second output terminal (51y) via a first front-stage capacitor (52) or a second front-stage capacitor (53) flows through the resistor (54).

The invention discloses a compact Marx generator based on an impact ionization semiconductor device, and relates to the field of a pulse power technology and a power semiconductor device crossing technology. Comprising N stages of sub Marx generators which are cascaded in sequence, and each sub Marx generator comprises an impact ionization semiconductor device, a first charging isolation element, a second charging isolation element, an energy storage unit, a first ground capacitor and a second ground capacitor; for any stage of sub Marx generator, the first end of the impact ionization semiconductor device is connected with the first end of the first charging isolation element, the first end of the first ground capacitor and the first end of the energy storage unit, the second end of the first ground capacitor is grounded, the second end of the impact ionization semiconductor device is connected with the first end of the second charging isolation element, and the second end of the second charging isolation element is grounded. The second end of the second charging isolation element is connected with the second end of the energy storage unit and the first end of the second ground capacitor, and the second end of the second ground capacitor is grounded. According to the compact Marx generator, the conduction safety is improved.

A traveling wave parametric amplifier (TWPA) transmission line with improved bandwidth includes one or more unit cells. Each unit cell includes a grounded capacitor and a Josephson junction in series, the Josephson junction configured to provide inductance and nonlinearity. One or more dispersive resonators are coupled to the transmission line. The dispersive resonator is configured to (i) use a first harmonic mode of the resonator for resonant phase matching in the transmission line, and (i i) prevent a second mode of the resonator from interacting with intermodulation products of the transmission line.

Technologies and implementations for a voltage management circuit. The voltage management circuit may be configured to facilitate management of behavior of electronic devices including management of process corners associated with semiconductor integrated circuit devices. The technologies and implementations may facilitate a controlled amplitude for a signal that may be configured to push a negative ground capacitor. The amplitude may decrease as a process corner becomes faster.

The present invention discloses a bonding and packaging impedance matching device for a superconducting quantum chip and a quantum processor, which relates to the field of superconducting quantum technology and includes a PCB board, bonding wires, and a chip. Pad-to-ground capacitors are provided in both the PCB board and the chip; the transmission line of the PCB board is connected to the transmission line of the chip through the bonding wires, and the bonding wires act as inductors to form a low-pass filter with the two pad-to-ground capacitors to reduce the reflectivity at the bonding wire; the two pad-to-ground capacitors are independently provided, and the capacitance size is adjusted by changing the pad shape; the bonding and packaging impedance matching device and the quantum processor solve the reflection problem at the chip packaging; at the same time, there is no need to introduce external chip capacitors and add additional matching circuits, so the space of the chip and the PCB board is greatly saved.

The invention relates to a filtering combination module which comprises a shielding cover, a common mode inductor group, overline capacitors and four grounding capacitors, an inductor base is arranged in the shielding cover, the common mode inductor group is arranged on the upper surface of the inductor base, the overline capacitors are arranged on the lower surface of the inductor base, and the grounding capacitors are arranged on the upper surface of the inductor base. The four grounding capacitors are arranged on the two sides of the overline capacitor in pairs, a lead of the common mode inductor set is connected with leads of the grounding capacitors and the overline capacitor, and an insulating plate is arranged at the bottom of the shielding cover. The grounding capacitors are arranged on the two sides of the overline capacitor, the common-mode inductor group is arranged on the upper sides of the overline capacitor and the grounding capacitors, through integrated packaging in the vertical direction, the size occupied by overall board arrangement can be reduced, the installation technology requirement is reduced, therefore, the welding procedure is reduced, the technology cost is reduced, and the structure is especially suitable for high-density and small-sized electronic equipment. And the structure is optimized, various safety problems are avoided, and the filtering function is met.

A multiplexer, a radio frequency module and an electronic device relate to the field of electronic circuits, the multiplexer comprises a resonator series branch, a parallel resonator and a capacitor bank, one end of the parallel resonator is connected with one end, far away from an antenna port, of a series resonator corresponding to the parallel resonator in the resonator series branch, and the other end of the parallel resonator is grounded. The capacitor banks are connected in parallel with target parallel resonators of target unit filters in the N unit filters in a one-to-one correspondence manner, the target parallel resonators are connected in parallel with the capacitor banks, and the target parallel resonators in the target unit filters are connected in parallel with the capacitor banks; the series resonant frequency of the unit filter where the capacitor bank is located exceeds the passband of the adjacent unit filter, so that signals on the adjacent unit filter are prevented from being leaked from the unit filter, and mutual interference between the adjacent unit filters is prevented.

The utility model discloses a high-temperature film grounding capacitor, which relates to the technical field of capacitors and comprises a high-temperature-resistant film grounding capacitor body, two first pins are arranged on the front surface of the high-temperature-resistant film grounding capacitor body, and second pins are welded at the front ends of the first pins. After production, a second pin and a first pin are separated and accommodated in an accommodating mechanism, and the first pin is totally accommodated in an insulating plastic protective frame, so that the whole high-temperature film grounding capacitor is small in size, does not need a relatively large packaging box or packaging bag, and is convenient to use. Meanwhile, the two pins cannot be collided, mail and transportation of manufacturers are facilitated, during use, the second pin and the first pin can be accurately butted firstly and then welded, at the moment, welding is convenient, connection is firm, and subsequent normal use of the high-temperature film grounding capacitor cannot be affected.

The invention provides a broadband harmonic suppression matching circuit, a power amplifier and a power amplifier module, and the broadband harmonic suppression matching circuit comprises a first harmonic suppression and biasing circuit and a second harmonic suppression and biasing circuit, comprising a first circuit element and a ground capacitor which constitute a bias circuit, a second circuit element and a third circuit element which are connected with the first circuit element and constitute a resonant network, and the sum of the electrical lengths of the first circuit element and the second circuit element is lambda / 6; the second harmonic suppression and fundamental wave impedance matching circuit comprises a multi-order LC resonance network, the multi-order LC resonance network comprises a fourth circuit element and a fifth circuit element which are connected with the third circuit element in series, and the fourth circuit element and the fifth circuit element are used for completing in-band fundamental wave impedance matching; wherein each circuit element is a microstrip line or a lumped element.

The invention provides a band elimination filter capable of switching between single frequency and double frequency and adjustable in double-frequency bandwidth and an application method, the upper half part comprises a first micro-strip transmission line, a second micro-strip transmission line and a first micro-strip coupling line which are connected in sequence, and the lower half part comprises a second micro-strip coupling line, a third micro-strip coupling line, a first switch, a second switch and a grounding capacitor. The first microstrip coupling line, the second microstrip coupling line and the third microstrip coupling line are connected with a first port and a second port of the switchable band-stop filter, the first switch is connected with one end of a microstrip line in the second microstrip coupling line and the third microstrip coupling line, the other end of the microstrip line is connected with the grounding capacitor through the second switch, and the second switch is connected with the stop-band adjusting capacitor in series. Switching among the narrow-band dual-frequency band-stop filter, the adjustable dual-frequency band-stop filter and the broadband band-stop filter is achieved by changing the connection and disconnection states of the first switch and the second switch, the more flexible performance in the multi-band and complex environment is guaranteed, and the hardware burden of the system is effectively reduced.

The invention discloses a semiconductor structure and a forming method thereof, and the semiconductor structure comprises a substrate which comprises a substrate and a shielding metal layer located on the substrate; the dummy metal layer is located on the substrate and located above the shielding metal layer; the grounding ring is located on the substrate and surrounds the pseudo metal layer, the grounding ring is provided with an opening, the grounding ring is electrically connected with the shielding metal layer, and the grounding ring is used for grounding; and the capacitor is positioned above the dummy metal layer and is positioned right above the shielding metal layer. The invention is beneficial to improving the quality factor of the semiconductor structure.

The invention discloses a capacitance equivalent modeling method for lightning stroke response of a triangular connection side of a three-phase transformer, and the method comprises the steps: forming a triangular topology for a three-phase coupling network model based on the ground capacitance and turn-to-turn capacitance of a winding at the triangular connection side through node connection, precisely simulating the inter-phase coupling in a lightning stroke transient state, and obtaining the lightning stroke response of the triangular connection side; the method can effectively reflect the high-frequency capacitance characteristics of the triangular connection side of the three-phase transformer, determines the capacitance parameters of the three-phase coupling network model through the frequency domain impedance measurement and capacitance calculation mathematical model, improves the accuracy of the capacitance parameters, provides a more reliable basis for lightning stroke protection design, and improves the reliability of lightning stroke protection design. The technical problem that the prediction precision is insufficient in a high-frequency transient state due to the fact that existing transformer lightning stroke modeling neglects the inter-phase coupling effect in triangular connection of a three-phase transformer and does not fully consider the complex influence of a winding series-parallel connection structure on capacitance parameters is solved.

A circuit for Flyback switching power supply includes a transformer having a primary winding, a secondary winding and an auxiliary winding, a power switch coupled to a dotted terminal of the primary winding, and a switch. A first terminal of the switch is connected to a non-dotted terminal of the auxiliary winding through a capacitor, a second terminal of the switch and a dotted terminal of the auxiliary winding are connected, respectively, to a ground. A common node of the capacitor and the auxiliary winding is configured to connect to a non-dotted terminal of the primary winding. A control circuit is configured to generate, based on a voltage at the common node of the capacitor and the auxiliary winding, a control signal to control the switch in order to achieve zero voltage switch (ZVS) of the power switch.

The utility model discloses a positive and negative metering voltage sampling circuit, which comprises a resistor R78, a resistor R79, a resistor R80, a resistor R81, a resistor R82, a resistor R86, a resistor R87, a resistor R88 and a resistor R89, the resistor R88, the resistor R87, the resistor R81, the resistor R79, the resistor R78, the resistor R80, the resistor R82, the resistor R86 and the resistor R89 are sequentially connected in series, a first grounding circuit is electrically connected between the resistor R88 and the resistor R87, the two ends of the resistor R88 are connected with a grounding capacitor C80 in parallel, and the two ends of the resistor R88 are connected with a second grounding circuit in parallel. The two ends of the resistor R87 are connected with a grounding capacitor C81 in parallel, and the end, away from the resistor R86, of the resistor R89 is electrically connected with a second grounding circuit. According to the circuit structure provided by the utility model, the metering chip U6 and the metering chip U2 are respectively connected to the UAP point and the V3P point by utilizing the current direction change of alternating current, so that bidirectional voltage metering can be realized in the same circuit, voltage sampling resistors can be saved, the number of the sampling resistors is effectively reduced, the occupied area of a PCB (Printed Circuit Board) is relatively reduced, and the cost is relatively reduced; and the market competitiveness is improved.

The invention discloses a bonding packaging impedance matching device of a superconducting quantum chip and a quantum processor, and relates to the technical field of superconducting quantum, the bonding packaging impedance matching device comprises a PCB, a bonding wire and a chip, and the PCB and the chip are both provided with bonding pad ground capacitors; a transmission line of the PCB is connected with a transmission line of the chip through a bonding wire, and the bonding wire serves as an inductor and forms a low-pass filter with two bonding pad ground capacitors, so that the reflectivity at the bonding wire is reduced; the two bonding pad ground capacitors are independently arranged, and the sizes of the capacitors are adjusted by changing the shapes of the bonding pads; according to the bonding packaging impedance matching device and the quantum processor, the reflection problem at the chip packaging position is solved; and meanwhile, an external chip capacitor and an additional matching circuit do not need to be introduced, so that the space of a chip and a PCB (Printed Circuit Board) is greatly saved.

The invention provides a high-pass filter and electronic equipment, and relates to the technical field of filters, the high-pass filter comprises a base body and a plurality of filtering assemblies arranged on the base body; an input electrode, an output electrode and a grounding electrode are arranged on the outer side of the base body; the filtering assembly comprises an inductor, a first capacitor plate, a second capacitor plate, a third capacitor plate and a fourth capacitor plate, at least one filtering capacitor is formed between the first capacitor plate and the second capacitor plate, a grounding capacitor is formed between the third capacitor plate and the fourth capacitor plate, and the fourth capacitor plate is connected with the grounding electrode; and the plurality of inductors, the plurality of filter capacitors and the plurality of grounding capacitors in the plurality of filter assemblies are mutually connected to form a high-pass filter circuit. The layout mode of each capacitor plate in the substrate is simpler and more compact, the preparation difficulty of the high-order high-pass filter is reduced, and the overall size of the high-order high-pass filter can be reduced.

A noise filter comprises a first ground capacitor, provided between a positive electrode busbar and ground, connected to the positive electrode busbar via a positive electrode connection and to ground via a ground connection; and a second ground capacitor, provided between a negative electrode busbar and ground, connected to the negative electrode busbar via a negative electrode connection and to ground via a ground connection. Furthermore, each of the positive and negative electrode connections is arranged such that it is stacked on top of the ground connection.Furthermore, the first ground capacitor and the second ground capacitor are arranged at one end of each of the positive electrode wiring, the negative electrode wiring, and the ground wiring, which are arranged in a stacked configuration. A first connection section between the positive electrode busbar and the positive electrode wiring, a second connection section between the negative electrode busbar and the negative electrode wiring, and a third connection section between the ground side and the ground wiring are also arranged at another end of each of the wiring connections.

The utility model relates to a winding structure filter, including a winding copper busbar assembly, a grounding capacitor assembly, a filter bracket assembly and a magnetic ring. The winding copper busbar assembly and the grounding capacitor assembly are installed on the filter bracket assembly. One end of the grounding capacitor assembly is connected to the winding copper busbar assembly, and the other end is connected to the filter bracket assembly. The magnetic ring passes through the winding copper busbar assembly; the winding copper busbar assembly is a flat copper wire laminated arrangement structure. Compared with the prior art, the utility model has the advantages of adopting a winding copper busbar assembly with a flat copper wire laminated arrangement structure to increase the inductance and improve the filtering performance of the filter, and improve the ability of the filter to suppress differential mode noise; the winding copper busbar assembly passes through the same magnetic ring, which strengthens the ability of the filter to suppress differential mode noise; the structure of the first grounding capacitor back to the second grounding capacitor makes the filter structure compact, shortens the equivalent series inductance of the capacitor absorption loop, and thus improves the high-frequency noise suppression performance of the filter.