An epoxy resin mold plastic and its production are disclosed. The mold plastic consists of liquid-crystal epoxy resin, methyl-phenolic epoxy resin, epoxy resin containing biphenyl unit structure, melamine modified linear phenolic resin, silicone micro-powder, imidazo curing improver, toughening agent and silane coupling agent. The process is carried out by treating silicone micro-powder in mixer by coupling agent for 2-5mins, adding into other components, mixing for 3-5mins, melt milling at 95-135 degree for 3-5mins, cooling, crushing, mesh screening, pressing into material cake and storing below 6degree. Its advantages include low thermal expansion coefficient, excellent heat and fire resistances, better toughness and fluidity, no phosphor, no antimony and environmental pollution. It can be used to pack large-scale circuit and electronic devices.