Embodiments encompasses 6th and 5th generation broad network and communications technology, including next generation “G5, G6, Gn and N∞.” The G5, G6, Gn and N∞ comprises BETTER network disposed with metamaterial substrate, plasmonic substrate, fluorescent substrate, and photonic substrate for optical network and data center applications. The network configured with multiple antennas on chip for communications, energy harvesting, and interactive user interface applications. The chip configured to boost signal receptions and to provide faster data transmission speed. Embodiments encompass three communication modes—the Cell phone, wireless network applications, and Global communication and media information. Embodiments provide communication apparatus to enhance mobile communication efficiency. The network disposed with charging circuit board configured with memories, processors, sensors, and modules. Embodiments further provide the communication apparatus comprising gaming device, wireless media configured with sensors embedded in silicon substrate and fused in nano-fiber/microfiber material having excellent electrical characteristics for voice enabled and texting applications.