907results about "Pulse generation by opto-electronic devices" patented technology

A combined low-voltage, low-power band-gap reference and temperature sensor circuit is provided for providing a band-gap reference parameter and for sensing the temperature of a chip, such as an eDRAM memory unit or CPU chip, using the band-gap reference parameter. The combined sensor circuit is insensitive to supply voltage and a variation in the chip temperature. The power consumption of both circuits, i.e., the band-gap reference and the temperature sensor circuits, encompassing the combined sensor circuit is less than one μW. The combined sensor circuit can be used to monitor local or global chip temperature. The result can be used to (1) regulate DRAM array refresh cycle time, e.g., the higher the temperature, the shorter the refresh cycle time, (2) to activate an on-chip or off-chip cooling or heating device to regulate the chip temperature, (3) to adjust internally generated voltage level, and (4) to adjust the CPU (or microprocessor) clock rate, i.e., frequency, so that the chip will not overheat. The combined band-gap reference and temperature sensor circuit of the present invention can be implemented within battery-operated devices having at least one memory unit. The low-power circuits of the sensor circuit extend battery lifetime and data retention time of the cells of the at least one memory unit.

A switched current temperature sensing circuit (1) comprises a measuring transistor (Q1) which is located remotely of a measuring circuit (5) which applies three excitation currents (I₁,I₂,I₃) of different values to the measuring transistor (Q1) in a predetermined current sequence along lines (10,11). Resulting base/emitter voltages from the measuring transistor (Q1) are applied to the measuring circuit (5) along the same two lines (10,11) as the excitation currents are applied to the measuring transistor (Q1). Voltage differences ΔV_be of successive base/emitter voltages resulting from the excitation currents are integrated in an integrating circuit (36) of the measuring circuit (5) to provide an output voltage indicative of the temperature of the measuring transistor (Q1). By virtue of the fact that the measuring transistor (Q1) is excited by excitation currents of three different values, the effect of current path series resistance in the lines (10,11) on the output voltage indicative of temperature is eliminated. The predetermined current sequence in which the excitation currents are applied to the measuring transistor (Q1) is selected to minimize the voltages in the integrating circuit (36) during integration of the voltage differences ΔV_be.

A decoupled switched current temperature circuit with compounded DELTA Vbe includes an amplifier having an inverting input with corresponding non-inverting output and a non-inverting input with a corresponding inverting output; a PN junction connected to the non-inverting input through a first input capacitor and a voltage reference circuit is connected to the inverting input through a second input capacitor; a current supply includes a low current source and a high current source; a switching device applies the high current source to the PN junction and applies the low current source to the PN junction for providing the DELTA Vbe of the PN junction to the first capacitor; a first feedback capacitor is interconnected between the inverting output and the non-inverting input and a second feedback capacitor is interconnected between the non-inverting output and inverting input of the amplifier to define the gain on each of the inputs to produce a differential voltage across the outputs representative of the temperature of the PN junction; first and second reset switching devices discharge the first and second feedback capacitors, respectively, and a multi-phase switched device alternately interchanges the connection of the first and second input capacitors with the amplifier inputs for compounding the single DELTA Vbe .

A temperature-based cooling device controller is implemented in an integrated circuit such as a microprocessor. The temperature-based cooling device controller includes a register to store a threshold temperature value, a thermal sensor, and clock adjustment logic to activate a cooling device in response to the thermal sensor indicating that the threshold temperature value has been exceeded. In a microprocessor implementation, the microprocessor contains a plurality of thermal sensors each placed in one of a plurality of different locations across the integrated circuit and an averaging mechanism to calculate an average temperature from the plurality of thermal sensors. Threshold adjustment logic increases the threshold temperature value to a new threshold temperature value in response to the thermal sensor indicating that the threshold temperature value has been exceeded. Threshold adjustment logic further lowers the new threshold temperature to detect decreases in temperature.

A temperature sensing circuit has numerous trip points in conformity with a temperature change without adding decrease resistance branches, so as to obtain a fine control based on the temperature change. Accordingly, when employed in a semiconductor memory device, the temperature sensing circuit substantially reduces the consumption of refresh electrical power in a stand-by state without decreasing the reliability of the semiconductor memory device.

Setting the clock frequency provided to a load circuit as function of the operating temperature and supply voltage of the load circuit, and setting the supply voltage as a function of the operating temperature of the load circuit. The load circuit can be safely operated above the frequency which would be the limit if the load circuit were operating at the maximum test temperature. At the given operating temperature, the supply voltage can be raised to permit even higher frequency operation, or lowered to reduce power.

It is an object to provide a photoelectric conversion device which detects light ranging from weak light to strong light. The present invention relates to a photoelectric conversion device having a photodiode having a photoelectric conversion layer, an amplifier circuit including a thin film transistor and a bias switching means, where a bias which is connected to the photodiode and the amplifier circuit is switched by the bias switching means when intensity of incident light exceeds predetermined intensity, and accordingly, light which is less than the predetermined intensity is detected by the photodiode and light which is more than the predetermined intensity is detected by the thin film transistor of the amplifier circuit. By the present invention, light ranging from weak light to strong light can be detected.

A low supply voltage band-gap reference circuit is provided, which includes a positive temperature coefficient current generation unit and a negative temperature coefficient current generation unit, and it is implemented by way of current summing. Through the current-mode temperature compensation technique, the present invention is able to reduce the voltage headroom and the number of operational amplifiers required by the conventional voltage-summing method, as well as the influence to the output voltage due to the offset voltage, thereby providing a stable and low voltage band-gap reference voltage level. In addition, by reducing the number of operational amplifiers and resistors of high resistance, the circuit area is reduced, and chip cost is saved.

A bandgap voltage reference circuit (1) comprises a bandgap cell (7) comprising first and second transistor stacks (8,9) of first transistors (Q1,Q2) and second transistors (Q3,Q4), respectively, arranged for developing a correcting PTAT voltage (DeltaVbe) across a primary resistor (R1) proportional to the difference in the base-emitter voltages of the first and second transistor stacks (8,9). A first current mirror circuit (10) provides PTAT currents (12 to 15) to the emitters of the first and second transistors (Q1 to Q4), and an operational amplifier (A1) maintains the voltage on the emitter of the first transistor (Q2) of the first transistor stack (8) at the same level as the resistor (R1) and sinks a PTAT current from the first current mirror circuit (10) from which the other PTAT currents are mirrored. The correcting PTAT voltage (DeltaVbe) developed across the primary resistor (R1) is scaled onto a secondary resistor (R3) and summed with the uncorrected base-emitter CTAT voltage of the first transistor (Q1) of the first transistor stack (8) for providing the voltage reference between an output terminal (5) and ground (3). A CTAT correcting current (Icr) is summed with the PTAT current (13) and applied to the emitter of the second transistor (Q3) of the second transistor stack (9) so that the correcting PTAT voltage (DeltaVbe) developed across the primary resistor (R1) has a TlnT curvature complementary to the TlnT temperature curvature of the uncorrected base-emitter CTAT voltage of the first transistor (Q1). Thus the reference voltage developed between the output terminal (5) and the ground (3) is temperature stable and TlnT temperature curvature corrected. The CTAT correcting current is derived from the base-emitter CTAT voltage of the first transistor (Q1) in a CTAT current generating circuit (12) through a second current mirror circuit (15).

A semiconductor memory device controlling an output voltage level of a high voltage generator according to a variation of temperature has a high voltage generator that provides a high voltage higher than a power source voltage through an output terminal, generates a temperature detection signal obtained by sensing a variation of a diode current according to a temperature variation, and adjusts a voltage level of the output terminal in response to the temperature detection signal. The device is able to automatically control an output voltage or current of the high voltage generator. Accordingly, it is possible to control fluctuation of output voltage level or current level due to a voltage variation, thereby lessening degradation of program or erasure characteristics of memory cells that is caused from the fluctuation of the output voltage or current.

In an optical sensor device employing an amorphous silicon photodiode, an external amplifier IC and the like are required due to low current capacity of the sensor element in order to improve the load driving capacity. It leads to increase in cost and mounting space of the optical sensor device. In addition, noise may easily superimpose since the photodiode and the amplifier IC are connected to each other over a printed circuit board. According to the invention, an amorphous silicon photodiode and an amplifier configured by a thin film transistor are formed integrally over a substrate so that the load driving capacity is improved while reducing cost and mounting space. Superimposing noise can be also reduced.